公开(公告)号：US4042548A

公开(公告)日：1977-08-16

申请号：US622513

申请日：1975-10-15

申请人： Mitsuo Abe ,  Masaki Nagata ,  Masafumi Kikuchi

发明人： Mitsuo Abe ,  Masaki Nagata ,  Masafumi Kikuchi

IPC分类号： C08L27/00 ,  C08L1/00 ,  C08L7/00 ,  C08L9/02 ,  C08L21/00 ,  C08L23/00 ,  C08L27/06 ,  C08L33/00 ,  C08L33/02 ,  C08L51/00 ,  C08L51/02 ,  C08L51/04 ,  C08L51/06 ,  C08L101/00 ,  C08K5/12 ,  C08K5/15

CPC分类号： C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L9/02

摘要： A highly weather-resistant, thermoformable sheeting prepared by mixing from 45 to 70 parts by weight of a rigid thermoplastic resin selected from the group consisting of polyvinyl chlorides and copolymers each of which is composed mostly of a vinyl chloride and a small amount of a monoolefinic monomer copolymerizable with the vinyl chloride, from 20 to 50 parts by weight of a thermoplastic resin obtained by a graft polymerization of from 20 to 40 parts by weight of an ethylene-propylene copolymer rubber or ethylene-propylene-diene terpolymer with from 60 to 80 parts by weight of a vinyl monomer mixture consisting of from 40 to 90 percent by weight of an alkenyl aromatic compound and from 10 to 60 percent by weight of at least one monomer copolymerizable with the alkenyl aromatic compound, and from 5 to 35 parts by weight of an acrylonitrile-butadiene rubber, with from 5 to 50 parts by weight of a plasticizer or plasticizers added to the 100 parts by weight of the resinous mixture.

摘要翻译： 通过混合45至70重量份的选自聚氯乙烯和共聚物的刚性热塑性树脂制备的高耐候性，可热成形的片材，其主要由氯乙烯和少量单烯烃 可与氯乙烯共聚的单体，20〜50重量份通过接枝聚合20〜40重量份的乙烯 - 丙烯共聚物橡胶或乙烯 - 丙烯 - 二烯三元共聚物得到的热塑性树脂，其含量为60〜80 由40至90重量％的烯基芳族化合物和10至60重量％的至少一种可与链烯基芳族化合物共聚的单体组成的乙烯基单体混合物重量份，以及5至35重量份 的丙烯腈 - 丁二烯橡胶，与100重量份树脂混合物一起加入5至50重量份的增塑剂或增塑剂。

公开(公告)号：US07193320B2

公开(公告)日：2007-03-20

申请号：US10352074

申请日：2003-01-28

申请人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

发明人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

IPC分类号： H01L23/06

CPC分类号： H01L24/48 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/4943 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

公开(公告)号：US5276574A

公开(公告)日：1994-01-04

申请号：US744515

申请日：1991-08-13

申请人： Mitsuo Abe ,  Yukiko Ogura ,  Masakatsu Saito ,  Toshio Tsuchiya

发明人： Mitsuo Abe ,  Yukiko Ogura ,  Masakatsu Saito ,  Toshio Tsuchiya

IPC分类号： G11B5/127 ,  G11B5/187 ,  G11B5/31 ,  G11B5/255

CPC分类号： G11B5/3106 ,  G11B5/1871 ,  G11B5/1878

摘要： Disclosed herein is a magnetic head in which the sliding surface is constructed of a transducing gap, a pair of soft magnetic metal films opposite to each other through the transducing gap, and a substrate holding the soft magnetic metal film. The substrate is 20-200 times as wear-resistant as the soft magnetic metal film. The magnetic head has a gap depth of 1-5 .mu.m and produces an overall high head output.

摘要翻译： 这里公开了一种磁头，其中滑动表面由换能间隙，通过换能间隙彼此相对的一对软磁金属膜构成，以及保持软磁金属膜的基板。 基材的耐磨性为软磁金属膜的20-200倍。 磁头的间隙深度为1-5（my）m，产生一个整体较高的磁头输出。

公开(公告)号：US5067038A

公开(公告)日：1991-11-19

申请号：US548628

申请日：1990-07-05

申请人： Toshio Tsuchiya ,  Mitsuo Abe ,  Nobuo Arai ,  Masumi Hisatomi ,  Hideo Zama

发明人： Toshio Tsuchiya ,  Mitsuo Abe ,  Nobuo Arai ,  Masumi Hisatomi ,  Hideo Zama

IPC分类号： G11B5/31 ,  G11B5/53

CPC分类号： G11B5/534

摘要： A rotary magnetic head device utilizes a thin film magnetic head or heads having small mutual influence to external magnetic field in combination with a bulk magnetic head or heads to reduce crosstalk between recording head and reproducing head to thereby improve S/N ratio.

摘要翻译： 旋转磁头装置利用与大量磁头或磁头组合的对外部磁场具有小的相互影响的薄膜磁头或磁头，以减少记录头和再现磁头之间的串扰，从而提高S / N比。

公开(公告)号：US4589230A

公开(公告)日：1986-05-20

申请号：US647815

申请日：1984-09-06

申请人： Shigehiro Yonemura ,  Hiroshi Umino ,  Masao Kume ,  Mitsuo Abe ,  Satoshi Miyatake

发明人： Shigehiro Yonemura ,  Hiroshi Umino ,  Masao Kume ,  Mitsuo Abe ,  Satoshi Miyatake

IPC分类号： B23Q15/14 ,  B23F5/02 ,  B23F23/12 ,  B23Q15/013 ,  B23Q15/12 ,  B24B49/16 ,  B24B19/00

CPC分类号： B23F23/12 ,  B23Q15/12 ,  B24B49/16 ,  G05B2219/37348 ,  G05B2219/45161

摘要： A grinding machine including a grinding wheel spindle motor for rotating a grinding wheel, a workpiece spindle motor for rotating a workpiece such as a gear to be ground in mesh with the grinding wheel, and a traverse motor for moving a table supporting the workpiece spindle motor. A power detector and a comparator are connected to a driver circuit for the grinding wheel spindle motor. When a load on the grinding wheel in mesh with the workpiece is increased, such a load increase is detected by the power detector and applied to a comparator. If the load signal is in excess of a reference level, then the application of a drive signal to the traverse motor is interrupted or a speed at which the workpiece is traversed relatively to the grinding wheel is reduced.

摘要翻译： 一种磨床，包括用于使砂轮旋转的砂轮主轴电机，用于旋转与研磨轮啮合的待磨削齿轮的工件的工件主轴电机和用于移动支撑工件主轴电机的工作台的横动电动机 。 功率检测器和比较器连接到用于砂轮主轴电机的驱动器电路。 当与工件啮合的砂轮上的负载增加时，这种负载增加由功率检测器检测并施加到比较器。 如果负载信号超过基准电平，则驱动信号施加到横动电动机被中断，或者工件相对于砂轮运动的速度减小。

公开(公告)号：US4448580A

公开(公告)日：1984-05-15

申请号：US421777

申请日：1982-09-23

申请人： Mitsuo Abe ,  Syuji Tsuchikawa ,  Teizo Fukuta ,  Tsugio Asakawa

发明人： Mitsuo Abe ,  Syuji Tsuchikawa ,  Teizo Fukuta ,  Tsugio Asakawa

IPC分类号： C08F2/00 ,  C08F2/22 ,  C08F212/00 ,  C08F212/10 ,  C08F212/12 ,  C08L25/12 ,  C08L25/16 ,  C08L55/02 ,  C08F257/02 ,  C08L33/12

CPC分类号： C08L25/12 ,  C08F212/12 ,  C08L25/16 ,  C08L55/02

摘要： A thermoplastic resin having an excellent thermal stability and a high heat resistance is prepared by initiating polymerization of 65-85 parts by weight of a monomer mixture (A) consisting of 50-85% by weight of .alpha.-methylstyrene, 3-20% by weight of methyl methacrylate, 2-20% by weight of acrylonitrile, and 0-25% by weight of an aromatic alkenyl compound other than .alpha.-methylstyrene, continuously or intermittently adding, on the way of the polymerization, 2-15 parts by weight of a monomer (B) consisting of acrylonitrile or a mixture thereof with an aromatic alkenyl compound other than .alpha.-methylstyrene to the polymerization system while continuing the polymerization, further adding to the polymerization system 5-25 parts by weight of a monomer (C) consisting of an aromatic alkenyl compound other than .alpha.-methylstyrene, or a mixture thereof with acrylonitrile, and continuing the polymerization to complete the polymerization, the total amount of monomers (A), (B), and (C) being 100 parts by weight. Further, a thermoplastic resin composition having an excellent thermal stability, a high heat resistance and a high impact strength is prepared by mixing the thermoplastic resin thus obtained with a graft copolymer obtained by grafting 60-30 parts by weight of a monomer mixture consisting of 65-80% by weight of an aromatic alkenyl compound and 35-20% by weight of acrylonitrile on 40-70 parts by weight of a diene rubbery polymer in such a proportion that the composition contains 10-30% by weight of the rubbery polymer.

摘要翻译： 通过引发65-85重量份由50-85重量％的α-甲基苯乙烯，3-20重量％的α-甲基苯乙烯组成的单体混合物（A）的引发聚合来制备具有优异的热稳定性和高耐热性的热塑性树脂 重量的甲基丙烯酸甲酯，2-20重量％的丙烯腈和0-25重量％的除α-甲基苯乙烯之外的芳族烯基化合物，在聚合过程中连续或间歇地加入2-15重量份 由丙烯腈或其与α-甲基苯乙烯以外的芳族烯基化合物的混合物组成的单体（B），同时继续进行聚合，进一步向聚合体系中加入5-25重量份的单体（C） 由除α-甲基苯乙烯以外的芳族烯基化合物或其与丙烯腈的混合物组成，并继续聚合以完成聚合，单体（A），（B）和（C） ng 100重量份。 此外，通过将由此获得的热塑性树脂与通过接枝60-30重量份的由65重量份组成的单体混合物获得的接枝共聚物来制备具有优异的热稳定性，高耐热性和高冲击强度的热塑性树脂组合物 -80重量％的芳族链烯基化合物和35-20重量％的丙烯腈，40-70重量份的二烯橡胶状聚合物的比例为组合物含有10-30重量％的橡胶状聚合物。

公开(公告)号：US4420348A

公开(公告)日：1983-12-13

申请号：US248456

申请日：1981-03-27

申请人： Kazuo Shiiki ,  Shigekazu Otomo ,  Mitsuhiro Kudo ,  Mitsuo Abe

发明人： Kazuo Shiiki ,  Shigekazu Otomo ,  Mitsuhiro Kudo ,  Mitsuo Abe

IPC分类号： C22C45/00 ,  C22C45/04 ,  G11B5/147 ,  H01F1/153 ,  C22C33/00

CPC分类号： C22C45/008 ,  H01F1/15316

摘要： Amorphous alloy for magnetic head core represented by the general formula, (Fe.sub.x Co.sub.1-x).sub.a Cr.sub.b Si.sub.c -B.sub.1-a-b-c, where the value of x is 0.04-0.07, the value of a is 0.73-0.75, the value of b is 0.005-0.03, and the value of c is 0.02-0.06. The present amorphous alloy has high permeability, high saturation flux density, low magnetostriction, and low magnetic after-effect at the same time, and has distinguished characteristics for magnetic head core.

摘要翻译： 由通式（FexCo1-x）a CrbSic-B1-abc表示的用于磁头芯的非晶合金，其中x的值为0.04-0.07，a的值为0.73-0.75，b的值为0.005〜 0.03，c值为0.02-0.06。 本发明的非晶合金同时具有高磁导率，高饱和磁通密度，低磁致伸缩性和低磁性后效应，具有磁头芯的特点。

公开(公告)号：US20070114642A1

公开(公告)日：2007-05-24

申请号：US11655253

申请日：2007-01-19

申请人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

发明人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

IPC分类号： H01L23/495

CPC分类号： H01L24/48 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/4943 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

摘要翻译： 半导体元件具有电路形成面，电极端子在其周边配置有电极端子。 半导体元件由模具树脂封装在基板上，该基板在对应于半导体元件的电极的位置处具有开口。 半导体元件在电路形成表面面向基板并且电极端子位于开口处的状态下安装到基板，并且与半导体元件的电路形成表面相反的后表面从模制树脂露出。 由金属板形成的发热部件设置在与安装有半导体元件的表面相对的基板的表面上。 发泡构件的表面从模制树脂露出。

公开(公告)号：US06559536B1

公开(公告)日：2003-05-06

申请号：US09612317

申请日：2000-07-07

申请人： Yoshitsugu Katoh ,  Mitsuo Abe ,  Yoshihiko Ikemoto ,  Sumikazu Hosoyamada

发明人： Yoshitsugu Katoh ,  Mitsuo Abe ,  Yoshihiko Ikemoto ,  Sumikazu Hosoyamada

IPC分类号： H01L2334

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining , parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.

摘要翻译： 半导体器件包括半导体芯片，与半导体芯片电连接的基板和热连接到半导体芯片的散热板。 基板在第一表面上设置有外部连接端子，并且电连接半导体芯片和外部连接端子。 基板设置有接合部，第二表面上由金属制成的部件。 通过焊接接合部和散热板将散热板和基板接合在一起。

公开(公告)号：US06333564B1

公开(公告)日：2001-12-25

申请号：US09336747

申请日：1999-06-21

申请人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

发明人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

摘要翻译： 一种半导体器件及其制造方法，该器件包括半导体芯片; 作为外部连接端子的球; 电连接半导体芯片和滚珠的基板; 模制树脂，其密封半导体芯片的至少一部分; 以及密封基板和半导体芯片之间的连接部分的连接部密封树脂。 半导体器件通过球安装到印刷电路板上。 模制树脂的热膨胀系数与印刷电路板的热膨胀系数相匹配。 在模制树脂中形成用于保持半导体芯片的侧表面的侧表面保持部分，以限制半导体芯片的热变形。