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公开(公告)号：US06424032B1
公开(公告)日：2002-07-23
申请号：US09643911
申请日：2000-08-23
IPC分类号： H01L2352
CPC分类号： H01L23/50 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05554 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48465 , H01L2224/49109 , H01L2224/49175 , H01L2224/4943 , H01L2224/85 , H01L2924/00014 , H01L2924/01076 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power supply ring and the ground ring are formed on the redistribution substrate in a surrounding area of the semiconductor element. One of the ground ring and the power supply ring has a plurality of convex portions protruding toward the other of the ground ring and the power supply ring. The other of the ground ring and the power supply ring has a plurality of concave portions each of which receives the corresponding one of the convex portions with a predetermined distance therebetween.
摘要翻译： 在半导体器件中，通过增加接地环和电源环之间的去耦电容来降低同时开关噪声的影响。 具有多个电极焊盘的半导体元件安装在再分布基板上。 电源环和接地环形成在半导体元件的周围区域中的再分布基板上。 接地环和供电环中的一个具有向接地环和电源环中的另一个突出的多个凸部。 接地环和电源环中的另一个具有多个凹部，每个凹部在其间以预定的距离接收相应的一个凸部。
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公开(公告)号：US06796024B2
公开(公告)日：2004-09-28
申请号：US10392179
申请日：2003-03-20
IPC分类号： H05K330
CPC分类号： H01L24/32 , H01L23/3128 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05599 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49171 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect to the fixed potion and connecting portions connecting the fixed portion and the stage portion. The heat spreading plate is fixed by positioning the stage portion at a position opposing the opening, then the heat spreading plate is welded to the substrate and the semiconductor chip is mounted on the stage portion through the opening. Then the semiconductor chip and interconnections formed on the substrate are electrically connected and sealing resin is formed on both sides of the heat spreading plate such that at least the semiconductor chip is sealed.
摘要翻译： 根据制造半导体器件的方法，基板设置有形成在大致中心位置的开口，互连部和接合部。 散热板具有固定到基板的固定部分，相对于固定部分凹陷的台部分和连接固定部分和台部部分的连接部分。 通过将台架部分定位在与开口相对的位置来固定散热板，然后将散热板焊接到基板，并且通过开口将半导体芯片安装在台架部分上。 然后，形成在基板上的半导体芯片和互连电连接，并且在散热板的两侧形成密封树脂，使得至少半导体芯片被密封。
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公开(公告)号：US06559536B1
公开(公告)日：2003-05-06
申请号：US09612317
申请日：2000-07-07
IPC分类号： H01L2334
CPC分类号： H01L24/32 , H01L23/3128 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05599 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49171 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining , parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.
摘要翻译： 半导体器件包括半导体芯片，与半导体芯片电连接的基板和热连接到半导体芯片的散热板。 基板在第一表面上设置有外部连接端子，并且电连接半导体芯片和外部连接端子。 基板设置有接合部，第二表面上由金属制成的部件。 通过焊接接合部和散热板将散热板和基板接合在一起。
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公开(公告)号：US07193320B2
公开(公告)日：2007-03-20
申请号：US10352074
申请日：2003-01-28
申请人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
发明人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
IPC分类号： H01L23/06
CPC分类号： H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
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5.发明申请公开(公告)号：US20070114642A1
公开(公告)日：2007-05-24
申请号：US11655253
申请日：2007-01-19
申请人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
发明人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
IPC分类号： H01L23/495
CPC分类号： H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
摘要翻译： 半导体元件具有电路形成面，电极端子在其周边配置有电极端子。 半导体元件由模具树脂封装在基板上，该基板在对应于半导体元件的电极的位置处具有开口。 半导体元件在电路形成表面面向基板并且电极端子位于开口处的状态下安装到基板，并且与半导体元件的电路形成表面相反的后表面从模制树脂露出。 由金属板形成的发热部件设置在与安装有半导体元件的表面相对的基板的表面上。 发泡构件的表面从模制树脂露出。
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公开(公告)号：US20050269701A1
公开(公告)日：2005-12-08
申请号：US10971692
申请日：2004-10-25
IPC分类号： H01L23/12 , H01L21/60 , H01L21/607 , H01L23/48 , H01L23/552 , H01L23/66 , H01L31/0328
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49838 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/85051 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19011 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.
摘要翻译： 在半导体器件中，当将高度致密化的半导体元件安装在低成本基板上同时减少接合线的长度时，可以将接合线彼此平行地应用于高速信号线的电极。 具有与半导体元件的电路阻抗匹配的布线的阻抗匹配基板安装在基板上。 多个第一金属线连接在半导体元件的第一电极和基板的电极之间。 多个第二金属线连接在半导体元件的第二电极和阻抗匹配衬底的第一电极之间。 多个第三金属线连接在阻抗匹配衬底的第二电极和衬底的电极之间。 第二金属线彼此平行地延伸，并且第三金属线也彼此平行地延伸。
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公开(公告)号：US07476811B2
公开(公告)日：2009-01-13
申请号：US11078326
申请日：2005-03-14
IPC分类号： H05K1/00
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/24 , H01L23/36 , H01L23/49816 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H05K1/0203 , H05K1/182 , H05K3/0058 , H05K3/284 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that a bonding resin may be disposed in a gap portion which communicates with the cavity between the circuit substrate and the heat radiating member, and by means of a bonding force of the bonding resin, the heat radiating member is permanently fixed to the circuit substrate.
摘要翻译： 半导体器件包括：半导体元件; 电路基板，其中心具有空腔; 散热构件，其半导体元件在其中心部分接合; 以及密封树脂，其被配置为将所述半导体元件密封在所述空腔中。 提供一种结构，使得接合树脂可以设置在与电路基板和散热构件之间的空腔连通的间隙部分中，并且借助于接合树脂的结合力，散热构件被永久固定 到电路基板。
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公开(公告)号：US07361980B2
公开(公告)日：2008-04-22
申请号：US11137697
申请日：2005-05-26
IPC分类号： H01L23/02
CPC分类号： H01L23/5286 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device comprises a semiconductor chip in which a circuit part provided in a center of the semiconductor chip is connected with power-supply lines and power-supply electrodes to supply power from an external power source to the circuit part. A substrate is provided for carrying the semiconductor chip thereon and provided so that first terminals in a region encircling the semiconductor chip are electrically connected to the power-supply electrodes. A first opening is formed on the power-supply line in a center of the circuit part. A second opening is formed on the power-supply line at a peripheral part of the circuit part. A conductor layer is electrically connected to second terminals in the region encircling the semiconductor chip on the substrate, and provided so that the power-supply line in the first opening and the power-supply line in the second opening are connected together.
摘要翻译： 半导体器件包括半导体芯片，其中设置在半导体芯片的中心的电路部分与电源线和电源电极连接，以从外部电源向电路部分供电。 提供了用于在其上承载半导体芯片的基板，并且设置成使得包围半导体芯片的区域中的第一端子电连接到电源电极。 在电路部分的中心的电源线上形成第一开口。 在电路部分的周边部分的电源线上形成第二开口。 导体层与围绕基板上的半导体芯片的区域中的第二端子电连接，并且设置为使得第一开口中的电源线和第二开口中的电源线连接在一起。
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公开(公告)号：US07042102B2
公开(公告)日：2006-05-09
申请号：US10971692
申请日：2004-10-25
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49838 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/85051 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19011 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.
摘要翻译： 在半导体器件中，当将高度致密化的半导体元件安装在低成本基板上同时减少接合线的长度时，可以将接合线彼此平行地应用于高速信号线的电极。 具有与半导体元件的电路阻抗匹配的布线的阻抗匹配基板安装在基板上。 多个第一金属线连接在半导体元件的第一电极和基板的电极之间。 多个第二金属线连接在半导体元件的第二电极和阻抗匹配衬底的第一电极之间。 多个第三金属线连接在阻抗匹配衬底的第二电极和衬底的电极之间。 第二金属线彼此平行地延伸，并且第三金属线也彼此平行地延伸。
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公开(公告)号：US20060137902A1
公开(公告)日：2006-06-29
申请号：US11078326
申请日：2005-03-14
IPC分类号： H05K1/00
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/24 , H01L23/36 , H01L23/49816 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H05K1/0203 , H05K1/182 , H05K3/0058 , H05K3/284 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that a bonding resin may be disposed in a gap portion which communicates with the cavity between the circuit substrate and the heat radiating member, and by means of a bonding force of the bonding resin, the heat radiating member is permanently fixed to the circuit substrate.
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