公开(公告)号：US08881381B2

公开(公告)日：2014-11-11

申请号：US12631594

申请日：2009-12-04

申请人： Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

发明人： Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC分类号： H05K3/36 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

摘要翻译： 本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

公开(公告)号：US20110067233A1

公开(公告)日：2011-03-24

申请号：US12654669

申请日：2009-12-29

申请人： Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

发明人： Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

IPC分类号： H05K3/10

CPC分类号： H05K3/465 ,  H05K3/0041 ,  H05K3/045 ,  H05K3/064 ,  H05K3/107 ,  H05K3/108 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/09036 ,  Y10T29/49155

摘要： A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

摘要翻译： 一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。 因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。

公开(公告)号：US20110061912A1

公开(公告)日：2011-03-17

申请号：US12654668

申请日：2009-12-29

申请人： Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

发明人： Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC分类号： H05K1/00 ,  H05K1/11 ,  B32B38/10 ,  B29C65/00

CPC分类号： H05K3/4611 ,  H05K3/045 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2203/1461 ,  H05K2203/1536 ,  Y10T156/10

摘要： Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

摘要翻译： 提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。 在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。 第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和 第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。

公开(公告)号：US20100314755A1

公开(公告)日：2010-12-16

申请号：US12511723

申请日：2009-07-29

申请人： Myung Sam KANG ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

发明人： Myung Sam KANG ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC分类号： H01L23/498 ,  H05K1/11 ,  B05D5/12 ,  B32B38/00

CPC分类号： H05K3/46 ,  B32B2309/10 ,  B32B2457/14 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/0064 ,  H05K3/205 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.

摘要翻译： 公开了一种印刷电路板，其包括嵌入在一个表面中的绝缘层的第一电路层，并且包括凸块焊盘和引线接合焊盘，从而实现高密度导线焊盘。 还提供了包括印刷电路板的半导体器件和制造印刷电路板的方法。

公开(公告)号：US20110061906A1

公开(公告)日：2011-03-17

申请号：US12654433

申请日：2009-12-18

申请人： Min Jung Cho ,  Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

发明人： Min Jung Cho ,  Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC分类号： H05K1/09 ,  B05D5/12

CPC分类号： H05K1/0271 ,  H05K1/09 ,  H05K3/007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/10674

摘要： A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.

摘要翻译： 公开了印刷电路板（PCB）及其制造方法。 PCB包括：在绝缘基底（即绝缘基板）的上表面和下表面的至少一个表面上形成具有期望图案并且具有各自具有不同热膨胀系数的金属层的双层电路图案; 以及形成在所述绝缘基底构件上以覆盖所述电路图案的绝缘层。 由于PCB包括抗翘曲单元，因此可以提高加工速度和生产率。

公开(公告)号：US20120298412A1

公开(公告)日：2012-11-29

申请号：US13204425

申请日：2011-08-05

申请人： Kyung Don Mun ,  Min Jung Cho ,  Sun Uk Hwang

发明人： Kyung Don Mun ,  Min Jung Cho ,  Sun Uk Hwang

IPC分类号： H05K1/11 ,  H05K3/42

CPC分类号： H05K3/4647 ,  H05K3/0038 ,  H05K3/4652 ,  H05K2201/0347 ,  Y10T29/49165

摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes: preparing a base substrate having first circuit layers formed on one surface or both surfaces thereof; forming a plating resist having openings for a first via layer on the base substrate; forming first via layers in the openings for a first via layer; forming insulating layers having outer metal layers on the base substrate having the first via layers formed thereon; forming openings for a second via layer over the first via layer on the insulating layers and the outer metal layers; and completing multi-layer vias by forming second via layers in the openings.

摘要翻译： 这里公开了一种印刷电路板及其制造方法。 制造印刷电路板的方法包括：制备具有形成在其一个表面或两个表面上的第一电路层的基底基板; 形成具有用于所述基底基板上的第一通孔层的开口的电镀抗蚀剂; 在第一通孔层的开口中形成第一通孔层; 在其上形成有第一通孔层的基底基板上形成具有外金属层的绝缘层; 在绝缘层和外部金属层上的第一通孔层上形成用于第二通孔层的开口; 以及通过在开口中形成第二通孔层来完成多层通孔。