公开(公告)号：US20170040287A1

公开(公告)日：2017-02-09

申请号：US15107203

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L21/78 ,  B32B37/18 ,  B32B7/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B37/06 ,  C08J5/18 ,  B29C65/02

CPC分类号： H01L24/96 ,  B29C65/02 ,  B29K2667/003 ,  B29L2031/3481 ,  B32B3/08 ,  B32B5/18 ,  B32B5/20 ,  B32B7/10 ,  B32B7/12 ,  B32B15/046 ,  B32B15/06 ,  B32B25/08 ,  B32B25/12 ,  B32B27/065 ,  B32B27/08 ,  B32B27/26 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B37/06 ,  B32B37/182 ,  B32B37/185 ,  B32B37/187 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/20 ,  B32B2307/51 ,  B32B2307/536 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/105 ,  B32B2367/00 ,  B32B2457/14 ,  C08J5/18 ,  C08J2363/02 ,  C08J2433/10 ,  C08J2461/06 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

摘要： The electronic component device production method includes a step A of preparing a layered body comprising electronic components immobilized on a support body, a step B of preparing an electronic component sealing sheet, a step C of disposing the electronic component sealing sheet over the electronic components under conditions where the probe tack force of the electronic component sealing sheet is 5 gf or lower according to a probe tack test, a step D of rising the temperature of the electronic component sealing sheet until the probe tack of the electronic component sealing sheet is 10 gf or greater according to the probe tack test to immobilize temporarily the electronic component sealing sheet onto the electronic components, and a step E of embedding the electronic components in the electronic component sealing sheet to form a sealed body comprising the electronic components embedded in the electronic component sealing sheet.

摘要翻译： 电子部件装置的制造方法包括：制备包含固定在支撑体上的电子部件的层叠体的工序A，制备电子部件密封片的工序B，将电子部件密封片设置在电子部件下方的工序C 根据探针粘着试验，电子部件密封片的探针粘着力为5gf以下的条件，电子部件密封片的温度上升到电子部件密封片的探针粘着前的步骤D为10gf 或更大，以将电子部件密封片暂时固定在电子部件上，以及将电子部件嵌入电子部件密封片中的步骤E，形成包含嵌入电子部件的电子部件的密封体 密封片。

公开(公告)号：US20160300733A1

公开(公告)日：2016-10-13

申请号：US15037794

申请日：2014-10-31

申请人： NITTO DENKO CORPORATION

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/568 ,  C09J7/10 ,  C09J7/40 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

摘要： A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 μm or more, and a separator (B) stacked on the other surface of the sealing sheet.

摘要翻译： 在两面上具有隔膜的密封片设置有密封片，层叠在密封片的一个表面上且厚度为50μm以上的隔膜（A）和层叠在另一个表面上的隔膜（B） 密封片。

公开(公告)号：US20170033076A1

公开(公告)日：2017-02-02

申请号：US15106439

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/52 ,  H01L25/00 ,  H01L21/78

CPC分类号： H01L24/83 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L21/7806 ,  H01L23/12 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/83005

摘要： Provided is a production method for a semiconductor package making it possible to embed, in its irregularities, a thermosetting resin sheet satisfactorily. The method is a production method, for a semiconductor package, including the step of forming a sealed body by pressurizing a stacked body which includes: a chip-temporarily-fixed body comprising a supporting plate, a temporarily-fixing material stacked over the supporting plate, and a semiconductor chip fixed temporarily over the temporarily-fixing material; a thermosetting resin sheet arranged over the chip-temporarily-fixed body; and a separator having a tensile storage elastic modulus of 200 MPa or less at 90° C. and arranged over the thermosetting resin sheet; the sealed body including the semiconductor chip and the thermosetting resin sheet covering the semiconductor chip.

摘要翻译： 提供一种半导体封装的制造方法，其可以令人满意地嵌入其不规则的热固性树脂片。 该方法是一种用于半导体封装的制造方法，其包括通过对叠层体进行加压而形成密封体的步骤，所述堆叠体包括：芯片临时固定体，包括支撑板，叠置在支撑板上的临时固定材料 以及临时固定在临时固定材料上的半导体芯片; 布置在所述芯片临时固定体上的热固性树脂片; 以及在90℃下的拉伸储存弹性模量为200MPa以下并且配置在所述热固性树脂片上的隔膜; 所述密封体包括半导体芯片和覆盖半导体芯片的热固性树脂片。

公开(公告)号：US10128131B2

公开(公告)日：2018-11-13

申请号：US15037794

申请日：2014-10-31

申请人： Nitto Denko Corporation

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  C09J7/40 ,  C09J7/10

摘要： A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 μm or more, and a separator (B) stacked on the other surface of the sealing sheet.

公开(公告)号：US20170125373A1

公开(公告)日：2017-05-04

申请号：US15107222

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC分类号： H01L24/96 ,  G03F7/038 ,  G03F7/0387 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： Provided is a method for producing a semiconductor package. By this method, a periphery of a light-exposure planning region can be prevented from being exposed to light. The method is a semiconductor package producing method in which a film-formation planning surface of a cured product has a surface roughness of a predetermined value or less.

公开(公告)号：US09659883B2

公开(公告)日：2017-05-23

申请号：US15023501

申请日：2014-09-09

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/29 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/544

CPC分类号： H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

摘要： The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

公开(公告)号：US20170040187A1

公开(公告)日：2017-02-09

申请号：US15106909

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Chie Iino ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Goji Shiga

IPC分类号： H01L21/56 ,  H01L23/498 ,  H01L21/78 ,  C09J183/04 ,  H01L23/29 ,  C09J163/00 ,  C09J7/02 ,  H01L21/683 ,  H01L23/31

CPC分类号： H01L21/568 ,  C09J7/25 ,  C09J7/40 ,  C09J7/401 ,  C09J163/00 ,  C09J183/04 ,  C09J2203/326 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/12 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/32 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2221/68386 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

摘要： A sealing sheet with a double-sided separator, provided with a sealing sheet, a separator (A) laminated on one side of the sealing sheet, and a separator (B) laminated on the other side of the sealing sheet, the separation force F1 between the sealing sheet and the separator (A), the separation force F2 between the sealing sheet and the separator (B), the thickness t of the sealing sheet, and the area A of the sealing sheet satisfying a specific relationship.

摘要翻译： 具有双面隔板的密封片，设置有密封片，层叠在密封片的一侧的隔膜（A）和层叠在密封片的另一侧的隔膜（B），分离力F1 在密封片和隔片（A）之间，密封片和隔膜（B）之间的分离力F2，密封片的厚度t和密封片的面积A满足特定关系。

公开(公告)号：US20160211228A1

公开(公告)日：2016-07-21

申请号：US15023501

申请日：2014-09-09

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L21/78 ,  H01L25/065

CPC分类号： H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

摘要： The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

摘要翻译： 本发明提供一种用于密封具有优异的可靠性和可储存性的半导体芯片的热固化树脂片，同时由于热固性树脂片的体积收缩而减少翘曲变形，以及半导体封装的制造方法。 本发明涉及用于密封半导体芯片的热固性树脂片，其中活化能（Ea）满足下式（1），在150℃下热固化1小时的产品的玻璃化转变温度为125 ℃以上，热固化物的玻璃化转变温度以下的热膨胀系数α[ppm / K]和热固化物的25℃下的储能模量E'[GPa]满足 下式（2）：30＆nlE; Ea＆nlE; 120 [kJ / mol]（1）; 和10,000＆nlE;α×E'＆nlE; 300,000 [Pa / K]（2）。

公开(公告)号：US10301509B2

公开(公告)日：2019-05-28

申请号：US15539657

申请日：2015-12-11

申请人： NITTO DENKO CORPORATION

发明人： Yuki Sugo ,  Nao Kamakura ,  Tsuyoshi Ishizaka ,  Mitsuaki Fusumada

IPC分类号： C08K3/08 ,  C08K3/22 ,  C09J5/06 ,  C09J7/10 ,  C09J7/35 ,  C09J9/02 ,  G01N1/44 ,  C09J11/04 ,  H01L21/52 ,  C09J133/00 ,  C09J133/08 ,  C09J133/26 ,  C09J169/00 ,  C09J201/08 ,  H01L21/304

摘要： A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

公开(公告)号：US20170369744A1

公开(公告)日：2017-12-28

申请号：US15539657

申请日：2015-12-11

申请人： NITTO DENKO CORPORATION

发明人： Yuki Sugo ,  Nao Kamakura ,  Tsuyoshi Ishizaka ,  Mitsuaki Fusumada

IPC分类号： C09J5/06 ,  C09J11/04 ,  C09J133/26 ,  C09J9/02 ,  C09J7/02 ,  C09J169/00 ,  C09J201/08 ,  G01N1/44 ,  H01L21/304 ,  H01L21/52

CPC分类号： C09J5/06 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2248 ,  C08K2003/2286 ,  C08K2201/001 ,  C08L2312/06 ,  C09J7/10 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/00 ,  C09J133/08 ,  C09J133/26 ,  C09J169/005 ,  C09J201/08 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2469/00 ,  G01N1/44 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  H01L23/00 ,  H01L2221/68327 ,  H01L2221/68381

摘要： A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.