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1.发明授权Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition 有权含酚羟基的聚酰亚胺树脂，制作方法和聚酰亚胺树脂组合物公开(公告)号：US06949619B2
公开(公告)日：2005-09-27
申请号：US10621527
申请日：2003-07-18
CPC分类号： C08G77/455 , C08G73/10 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08L63/00 , C08L79/08 , H05K2201/0154 , H05K2203/065 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , C08L2666/22
摘要： A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
摘要翻译： 在其骨架中具有酚羟基自由基的聚酰亚胺树脂使用具有与其连接的氨基的芳香族的芳族二胺和具有酚羟基的另一芳香环来制备。 聚酰亚胺树脂和包含聚酰亚胺树脂，环氧树脂和固化剂的组合物适合用作需要粘合和耐热性的清漆，粘合剂和粘合剂膜。
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公开(公告)号：US07147920B2
公开(公告)日：2006-12-12
申请号：US10713163
申请日：2003-11-17
CPC分类号： H01L21/6836 , B32B7/12 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/35 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19042 , H01L2924/3511 , Y10S525/928 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , Y10T428/31721 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
摘要翻译： 在包括背衬构件，粘合剂层和保护构件的晶片切割/芯片接合片中，粘合剂层由包含含酚羟基自由基的聚酰亚胺树脂，环氧树脂和环氧树脂固化的粘合剂组合物制成 环氧树脂和环氧树脂固化剂的总重量与聚酰亚胺树脂的重量的比例为0.1:1至3:1。 由于耐热性，改善的粘合性能和低弹性模量，晶片切割/芯片粘接片对于降低芯片粘合后的芯片的翘曲是有效的。
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公开(公告)号：US07026382B2
公开(公告)日：2006-04-11
申请号：US10422011
申请日：2003-04-24
CPC分类号： H01B1/22 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/28 , C08G77/70 , C08L83/04 , C08L83/14 , C08L101/00 , H05K3/321 , H05K2201/0212 , C08L2666/02 , C08L83/00
摘要： A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.
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4.发明申请Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer 有权部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物公开(公告)号：US20050261456A1
公开(公告)日：2005-11-24
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译： 提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y 1是二胺残基 Y 2是二氨基硅氧烷残基，共聚物中的Y 1 Y 2和Y 2 2的含量为99-20摩尔％，1- 80mol％，L和m分别为2-50的整数。 共聚物对基材的粘合性好，防潮可靠性和低弹性模量。
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5.发明授权Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer 有权部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物公开(公告)号：US07683152B2
公开(公告)日：2010-03-23
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08G77/24
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译： 提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y1是二胺残基，Y2是二氨基硅氧烷残基，Y1 和Y2分别以99-20摩尔％和1-80摩尔％的量包含在共聚物中，L和m各自为2-50的整数。 共聚物对基材的粘合性好，防潮可靠性和低弹性模量。
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公开(公告)号：US06808819B2
公开(公告)日：2004-10-26
申请号：US10366388
申请日：2003-02-14
申请人： Nobuhiro Ichiroku , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： B32B2738
CPC分类号： C09J179/08 , C08G73/1085 , C08L63/00 , C08L79/08 , C09J7/10 , C09J2463/00 , C09J2479/08 , H05K3/386 , Y10S525/928 , Y10T428/31721 , C08L2666/20
摘要： A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
摘要翻译： 包含骨架中具有酸酐基团的聚酰亚胺树脂与环氧树脂固化催化剂，环氧树脂和任选的环氧树脂固化剂的相关产物的树脂组合物具有优异的粘附性，耐热性，储存稳定性和溶剂 抵抗性。 包含树脂组合物的粘合剂膜可用作印刷电路板和半导体封装的粘合剂或密封剂。
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公开(公告)号：US07244495B2
公开(公告)日：2007-07-17
申请号：US10829150
申请日：2004-04-22
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/31663 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
摘要翻译： 切割/贴合粘合带包括基底，硅氧烷粘合剂层和粘合层。 在硅胶粘合剂层和粘合层之间产生0.2-2.0N / 25mm的粘着强度。 接合层由包含（A）聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂的粘合组合物形成。
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公开(公告)号：US07364797B2
公开(公告)日：2008-04-29
申请号：US10942077
申请日：2004-09-16
IPC分类号： B32B9/04 , C08G77/455
CPC分类号： C09J179/08 , C08L63/00 , C08L79/085 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/10 , C09J163/00 , C09J183/10 , C09J2463/00 , C09J2479/08 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855
摘要： An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.
摘要翻译： 提供了一种粘合剂组合物，其包含（A）在主链上含有具有乙烯基作为有机取代基的二有机聚硅氧烷键的聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂。 由粘合剂组合物制备的粘合剂膜对于各种基材具有高的粘合强度，并且当热压粘合并热固化时具有高的粘合强度，并且具有低弹性模量和高耐热性，确保制造具有高可靠性的树脂封装的半导体器件 。
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9.发明授权Film-type adhesive for electronic components, and electronic components bonded therewith 有权用于电子部件的膜型粘合剂和与其粘合的电子部件公开(公告)号：US06645632B2
公开(公告)日：2003-11-11
申请号：US09808186
申请日：2001-03-15
IPC分类号： B32B2728
CPC分类号： H01L24/28 , C08L63/00 , C08L79/08 , C09J163/00 , C09J179/08 , H01L23/49513 , H01L24/31 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , H01L2924/00 , H01L2924/3512
摘要： A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.
摘要翻译： 用于电子部件的膜型粘合剂包括由特定重复单元构成的聚酰亚胺树脂，其重均分子量为5,000-150,000，与每分子具有至少两个缩水甘油基的环氧树脂组合。 粘合剂的聚酰亚胺树脂与环氧树脂的重量比在50/50至5/95的范围内，膜厚度为20-150μm。 这种膜型粘合剂使得可以简化和缩短具有各种类型的被粘物表面的电子部件的组装操作的持续时间。
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公开(公告)号：US6117953A
公开(公告)日：2000-09-12
申请号：US234482
申请日：1999-01-21
申请人： Nobuhiro Ichiroku , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Toshio Shiobara
CPC分类号： C08G59/38 , C08L63/00 , H01L23/293 , H01L2924/0002
摘要： A liquid epoxy resin composition comprising (A) an epoxy resin component which includes specific amounts of three specific epoxy resins, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler has a low viscosity, high cure rate, ease of processing, reliability, and shelf stability. The composition can be used as a semiconductor device encapsulant to provide BGA packages having minimal warpage.
摘要翻译： 一种液体环氧树脂组合物，其包含（A）包含特定量的三种特定环氧树脂的环氧树脂组分，（B）固化剂，（C）固化促进剂和（D）无机填料的环氧树脂组合物具有低粘度，高 固化速度，易加工性，可靠性和储存稳定性。 该组合物可用作半导体器件密封剂以提供具有最小翘曲的BGA封装。
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