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1.发明授权Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition 有权含酚羟基的聚酰亚胺树脂，制作方法和聚酰亚胺树脂组合物公开(公告)号：US06949619B2
公开(公告)日：2005-09-27
申请号：US10621527
申请日：2003-07-18
CPC分类号： C08G77/455 , C08G73/10 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08L63/00 , C08L79/08 , H05K2201/0154 , H05K2203/065 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , C08L2666/22
摘要： A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
摘要翻译： 在其骨架中具有酚羟基自由基的聚酰亚胺树脂使用具有与其连接的氨基的芳香族的芳族二胺和具有酚羟基的另一芳香环来制备。 聚酰亚胺树脂和包含聚酰亚胺树脂，环氧树脂和固化剂的组合物适合用作需要粘合和耐热性的清漆，粘合剂和粘合剂膜。
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公开(公告)号：US07147920B2
公开(公告)日：2006-12-12
申请号：US10713163
申请日：2003-11-17
CPC分类号： H01L21/6836 , B32B7/12 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/35 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19042 , H01L2924/3511 , Y10S525/928 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , Y10T428/31721 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
摘要翻译： 在包括背衬构件，粘合剂层和保护构件的晶片切割/芯片接合片中，粘合剂层由包含含酚羟基自由基的聚酰亚胺树脂，环氧树脂和环氧树脂固化的粘合剂组合物制成 环氧树脂和环氧树脂固化剂的总重量与聚酰亚胺树脂的重量的比例为0.1:1至3:1。 由于耐热性，改善的粘合性能和低弹性模量，晶片切割/芯片粘接片对于降低芯片粘合后的芯片的翘曲是有效的。
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公开(公告)号：US07026382B2
公开(公告)日：2006-04-11
申请号：US10422011
申请日：2003-04-24
CPC分类号： H01B1/22 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/28 , C08G77/70 , C08L83/04 , C08L83/14 , C08L101/00 , H05K3/321 , H05K2201/0212 , C08L2666/02 , C08L83/00
摘要： A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.
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公开(公告)号：US06518332B2
公开(公告)日：2003-02-11
申请号：US09841046
申请日：2001-04-25
IPC分类号： C08K310
CPC分类号： H01L23/293 , C08G59/3218 , C08K9/12 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
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公开(公告)号：US07345105B2
公开(公告)日：2008-03-18
申请号：US10737748
申请日：2003-12-18
CPC分类号： H05K3/321 , H05K2201/0245
摘要： A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.
摘要翻译： 通过将粘合剂树脂与基于作为导电剂的银粉的粘合剂组合物以30-98重量％混合来获得导电粘合剂组合物。 银粉含有由平坦的一次粒子构成的银粉，其具有大量的聚集体结构，并且基于粘合剂的30-198重量％的振实密度为0.1-1.5克/厘米3 组成。 导电性粘合剂组合物固化成具有改善的导电性，粘附性，耐热性，耐湿性，加工和热传递容易性的产品。
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6.发明授权Light-emitting semiconductor potting composition and light-emitting semiconductor device 有权发光半导体封装组合物和发光半导体器件公开(公告)号：US06806509B2
公开(公告)日：2004-10-19
申请号：US10797139
申请日：2004-03-11
申请人： Masachika Yoshino , Toshio Shiobara
发明人： Masachika Yoshino , Toshio Shiobara
IPC分类号： H01L3300
CPC分类号： H01L33/56 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08K5/54 , C08L83/04 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/12044 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.
摘要翻译： 一种灌封组合物，其包含（A）在其分子链末端具有乙烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）铂族金属催化剂和任选的（D）具有硅原子的有机硅化合物， 键合的烷氧基。 组合物的固化产物在25℃和589nm（D线）的折射率为1.41-1.56。 该组合物适用于发光半导体部件的嵌入和保护。 通过灌封组合物嵌入和保护发光半导体部件的封装几乎不发生变色，并且在加热试验中保持高发光效率，因此提供了具有长寿命和节能的发光半导体器件。
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公开(公告)号：US6103026A
公开(公告)日：2000-08-15
申请号：US54448
申请日：1998-04-03
CPC分类号： C23C26/00 , C23C8/06 , Y10T428/12021 , Y10T428/12903
摘要： A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.
摘要翻译： 耐腐蚀铜材料具有包含10-50原子％（即原子％）硅和10-1000埃格姆库姆厚度的铜合金的表面层。 它通过在含氢气体中在100-600℃下退火含有0.01-5at％的硅的铜材料来简单地制备。 由于其耐热老化对表面腐蚀性能优良，因此所得铜材料适用于要求耐热性的汽车和电气应用，并且也适用于电线和半导体器件的引线框。
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公开(公告)号：US6084037A
公开(公告)日：2000-07-04
申请号：US993403
申请日：1997-12-18
IPC分类号： C08K3/22 , C08F283/10 , C08G59/40 , C08G59/68 , C08K3/36 , C08K5/548 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08K5/548 , C08F283/10 , C08G59/686 , C08G59/687 , C08L63/00
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.
摘要翻译： 在包含环氧树脂，固化剂和无机填料的环氧树脂组合物中，将偏苯三酸酐的盐与作为固化促进剂的1,8-二氮杂双环（5.4.0）十一碳烯-7和含巯基的 硅烷偶联剂。 该组合物是稳定的并顺利流动并固化成具有改善的粘合性，耐湿性和电性能的产品。 该组合物适用于半导体器件的封装。
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公开(公告)号：US5563203A
公开(公告)日：1996-10-08
申请号：US339665
申请日：1994-11-14
摘要： A silicone rubber composition is prepared by mixing 100 parts by weight of an alkenyl-containing organopolysiloxane having a degree of polymerization of at least 3,000 and 5 to 30 parts by weight of finely divided silica having a specific surface of at least 50 m.sup.2 /g with 0.5 to 10 parts by weight of an organopolysiloxane resin having a weight average molecular weight of 500 to 50,000, a OH group content of 0.0001 to 0.01 mol/g, and a liquefying temperature of 50.degree. to 150.degree. C., at a temperature above the liquefying temperature of the resin. The composition has high plasticity in an uncured base compound form and is effective for extrusion molding. The composition cures into silicone rubber having low hardness, good flexibility and excellent physical properties, finding a variety of applications.
摘要翻译： 通过将100重量份具有至少3,000的聚合度的烯基的有机聚硅氧烷和5至30重量份的比表面积至少为50m 2 / g的细碎二氧化硅与100重量份的硅橡胶组合物混合， 0.5〜10重量份的重均分子量为500〜50,000的有机聚硅氧烷树脂，OH基含量为0.0001〜0.01摩尔/克，液化温度为50〜150℃，温度高于 树脂的液化温度。 该组合物在未固化的基础化合物形式中具有高塑性，并且对于挤出成型是有效的。 该组合物固化成具有低硬度，良好的柔韧性和优异的物理性能的硅橡胶，发现各种应用。
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公开(公告)号：US5179148A
公开(公告)日：1993-01-12
申请号：US698025
申请日：1991-05-10
摘要： A silicone rubber composition having excellent workability and extrusion-moldability and capable of giving cured silicone rubber articles having good mechanical properties is proposed, which is prepared by admixing, in addition to the conventional ingredients of an organopolysiloxane gum, a finely divided reinforcing silica filler and a curing agent such as an organic peroxide, a low molecular-weight organopolysiloxane having, in a molecule, at least three silanolic hydroxy groups which serves as a wetting agent of the silica filler so as to improve the compatibility of the silica filler with the organopolysiloxane gum giving a possibility of increasing the amount of the silica filler without adverse influences such as a decrease in the plasticity of the composition.
摘要翻译： 提出了具有优异的加工性和挤出成型性并能够得到具有良好机械性能的固化的硅橡胶制品的硅橡胶组合物，其通过将有机聚硅氧烷胶的常规成分，细碎的增强二氧化硅填料和 固化剂如有机过氧化物，低分子量有机聚硅氧烷，其在分子中具有至少三个硅烷醇羟基，其用作二氧化硅填料的润湿剂，以改善二氧化硅填料与有机聚硅氧烷的相容性 胶可以增加二氧化硅填料的量，而不会有不利影响，例如组合物的可塑性降低。
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