METHOD FOR DEPOSITING GROUP III/V COMPOUNDS
    1.
    发明申请
    METHOD FOR DEPOSITING GROUP III/V COMPOUNDS 审中-公开
    沉积III / V族化合物的方法

    公开(公告)号:US20090149008A1

    公开(公告)日:2009-06-11

    申请号:US12244440

    申请日:2008-10-02

    IPC分类号: H01L21/20

    摘要: Embodiments of the invention generally relate to methods for forming Group III-V materials by a hydride vapor phase epitaxy (HVPE) process. In one embodiment, a method for forming a gallium nitride material on a substrate within a processing chamber is provided which includes heating a metallic source to form a heated metallic source, wherein the heated metallic source contains gallium, aluminum, indium, alloys thereof, or combinations thereof, exposing the heated metallic source to chlorine gas while forming a metallic chloride gas, exposing the substrate to the metallic chloride gas and a nitrogen precursor gas while forming a metal nitride layer on the substrate during the HVPE process. The method further provides exposing the substrate to chlorine gas during a pretreatment process prior to forming the metal nitride layer. In one example, the exhaust conduit of the processing chamber is heated to about 200° C. or less during the pretreatment process.

    摘要翻译: 本发明的实施方案一般涉及通过氢化物气相外延(HVPE)方法形成III-V族材料的方法。 在一个实施例中,提供了一种用于在处理室内的衬底上形成氮化镓材料的方法,其包括加热金属源以形成加热的金属源,其中加热的金属源包含镓,铝,铟,其合金或 其组合,同时形成金属氯化物气体,将加热的金属源暴露于氯气中,在HVPE工艺期间在衬底上形成金属氮化物层,同时将衬底暴露于金属氯化物气体和氮气前体气体。 该方法还在形成金属氮化物层之前在预处理工艺期间将衬底暴露于氯气。 在一个实例中,处理室的排气管道在预处理过程中被加热到约200℃或更低。

    LIGHT EMITTING DIODE WITH ENHANCED QUANTUM EFFICIENCY AND METHOD OF FABRICATION
    9.
    发明申请
    LIGHT EMITTING DIODE WITH ENHANCED QUANTUM EFFICIENCY AND METHOD OF FABRICATION 审中-公开
    具有增强量子效率的发光二极管和制造方法

    公开(公告)号:US20120235116A1

    公开(公告)日:2012-09-20

    申请号:US13387713

    申请日:2010-07-30

    摘要: One embodiment of a quantum well structure comprises an active region including active layers that comprise quantum wells and barrier layers wherein some or all of the active layers are p type doped. P type doping some or all of the active layers improves the quantum efficiency of III-V compound semiconductor light emitting diodes by locating the position of the P-N junction in the active region of the device thereby enabling the dominant radiative recombination to occur within the active region. In one embodiment, the quantum well structure is fabricated in a cluster tool having a hydride vapor phase epitaxial (HVPE) deposition chamber with a eutectic source alloy. In one embodiment, the indium gallium nitride (InGaN) layer and the magnesium doped gallium nitride (Mg—GaN) or magnesium doped aluminum gallium nitride (Mg—AlGaN) layer are grown in separate chambers by a cluster tool to avoid indium and magnesium cross contamination. Doping of group III-nitrides by hydride vapor phase epitaxy using group III-metal eutectics is also described. In one embodiment, a source is provided for HVPE deposition of a p-type or an n-type group III-nitride epitaxial film, the source including a liquid phase mechanical (eutectic) mixture with a group III species. In one embodiment, a method is provided for performing HVPE deposition of a p-type or an n-type group III-nitride epitaxial film, the method including using a liquid phase mechanical (eutectic) mixture with a group III species.

    摘要翻译: 量子阱结构的一个实施例包括有源区,包括有源层,其包括量子阱和阻挡层,其中一些或全部有源层是p型掺杂的。 通过将PN结的位置定位在器件的有源区域中,P型掺杂部分或全部有源层提高了III-V族化合物半导体发光二极管的量子效率,从而能够在主动区域内发生主要的辐射复合 。 在一个实施例中,量子阱结构在具有共晶源合金的氢化物气相外延(HVPE)沉积室的簇工具中制造。 在一个实施例中,氮化铟镓(InGaN)层和掺杂镁的氮化镓(Mg-GaN)或镁掺杂的氮化铝镓(Mg-AlGaN)层通过簇工具在分开的室中生长以避免铟和镁的交叉 污染。 还描述了使用III族金属共晶体通过氢化物气相外延掺杂的III族氮化物。 在一个实施例中,提供了用于HVPE沉积p型或n型III族氮化物外延膜的源,该源包括具有III族的液相机械(共晶)混合物。 在一个实施例中,提供了一种用于执行p型或n型III族氮化物外延膜的HVPE沉积的方法,该方法包括使用具有III族物质的液相机械(共晶)混合物。

    Method for growth of nitrogen face (N-face) polarity compound nitride semiconductor device with integrated processing system
    10.
    发明授权
    Method for growth of nitrogen face (N-face) polarity compound nitride semiconductor device with integrated processing system 有权
    具有集成处理系统的氮面(N面)极性复合氮化物半导体器件生长方法

    公开(公告)号:US08080466B2

    公开(公告)日:2011-12-20

    申请号:US12853409

    申请日:2010-08-10

    IPC分类号: H01L21/36

    摘要: Embodiments described herein generally relate to apparatus and methods for forming Group III-V materials by metal-organic chemical vapor deposition (MOCVD) processes and hydride vapor phase epitaxial (HVPE) processes. In one embodiment, a method for fabricating a nitrogen-face (N-face) polarity compound nitride semiconductor device is provided. The method comprises depositing a nitrogen containing buffer layer having N-face polarity over one or more substrates using a metal organic chemical vapor deposition (MOCVD) process to form one or more substrates having N-face polarity and depositing a gallium nitride (GaN) layer over the nitrogen containing buffer layer using a hydride vapor phase epitaxial (HVPE) deposition process, wherein the nitrogen containing buffer layer and the GaN layer are formed without breaking vacuum and exposing the one or more substrates to atmosphere.

    摘要翻译: 本文描述的实施方案通常涉及通过金属 - 有机化学气相沉积(MOCVD)工艺和氢化物气相外延(HVPE)工艺形成III-V族材料的装置和方法。 在一个实施例中,提供了一种用于制造氮 - 面(N面)极性复合氮化物半导体器件的方法。 该方法包括使用金属有机化学气相沉积(MOCVD)工艺在一个或多个衬底上沉积具有N面极性的含氮缓冲层,以形成具有N面极性的一个或多个衬底并沉积氮化镓(GaN)层 使用氢化物​​气相外延(HVPE)沉积工艺在含氮缓冲层上方,其中形成含氮缓冲层和GaN层,而不破坏真空并将一个或多个衬底暴露于大气中。