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9 条记录 (耗时 0.016 秒)

    Method of forming electrically conducting layer
    1.
    发明授权
    Method of forming electrically conducting layer 失效
    形成导电层的方法

    公开(公告)号：US5043184A

    公开(公告)日：1991-08-27

    申请号：US457530

    申请日：1989-12-27

    申请人： Ryuichi Fujii ,  Osamu Ogitani ,  Toru Shirose

    发明人： Ryuichi Fujii ,  Osamu Ogitani ,  Toru Shirose

    IPC分类号： G03F7/032 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46

    CPC分类号： G03F7/032 ,  H05K3/4676 ,  H05K3/0023 ,  H05K3/4652 ,  H05K3/4661

    摘要： A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of:(a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator;(b) applying the composition to the conducting surface to form a coated layer;(c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer,(d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and(e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).

    Hardenable resin composition
    6.
    发明授权
    Hardenable resin composition 失效
    可硬化树脂组合物

    公开(公告)号：US4985474A

    公开(公告)日：1991-01-15

    申请号：US434263

    申请日：1989-11-13

    申请人： Osamu Ogitani ,  Ryuichi Fujii

    发明人： Osamu Ogitani ,  Ryuichi Fujii

    IPC分类号： C08F2/48 ,  C08F2/44 ,  C08F20/26 ,  C08F220/26 ,  C08F220/28 ,  C09J4/00 ,  C09J4/02 ,  C09J4/06 ,  G03F7/027 ,  G03F7/032 ,  H05K3/00 ,  H05K3/06

    CPC分类号： H05K3/0094 ,  G03F7/027 ,  G03F7/032 ,  H05K2203/0759 ,  H05K3/0076

    摘要： A resin composition hardenable by irradiation of a high energy ray is disclosed, which includes:(a) a resin selected from the group consisting of rosins and modified rosins and having an acid value of at least 150 and a Gardner color scale of not greater than 15;(b) a compound of the general formula (I):Y--CO--O--A--O).sub. m CO--CR.dbd.CH.sub.2 (I) wherein Y represents ##STR1## A represents an alkylene having 1-4 carbon atoms, R represents hydrogen or methyl and m is an integer of 1-4;(c) a hydroxyl group-containing compound having only one acrylic or methacrylic group and at least one hydroxyl group; and(d) a polyol compound having at least two hydroxyl groups. The resin composition is useful for plugging through-holes of a metal plated board in manufacturing printed wiring boards.

    摘要翻译： 公开了通过高能射线照射可硬化的树脂组合物，其包括：（a）选自松香和改性松香，并且酸值至少为150的树脂和不大于 15; （b）通式（I）的化合物：Y-CO-OAO）mCO-CR = CH 2（I）其中Y表示A表示具有1-4个碳原子的亚烷基，R表示氢或甲基， m为1-4的整数; （c）仅具有一个丙烯酸或甲基丙烯酸基团和至少一个羟基的含羟基化合物; 和（d）具有至少两个羟基的多元醇化合物。 树脂组合物可用于在制造印刷线路板时堵塞金属电镀板的通孔。

    Curable adhesive composition
    7.
    发明授权
    Curable adhesive composition 失效
    可固化粘合剂组成

    公开(公告)号：US5250591A

    公开(公告)日：1993-10-05

    申请号：US680016

    申请日：1991-06-19

    申请人： Ryuichi Fujii ,  Takayuki Kawano

    发明人： Ryuichi Fujii ,  Takayuki Kawano

    IPC分类号： C08F299/02 ,  C09J4/00 ,  C09J4/02 ,  H05K3/30 ,  C08L67/06 ,  C08F271/02 ,  C08J3/28 ,  C08L39/04

    CPC分类号： H05K3/305 ,  C08F299/024 ,  C09J4/00 ,  H05K2201/0209 ,  H05K2203/1105 ,  Y02P70/613

    摘要： A curable adhesive composition is disclosed, comprising a polymerizable prepolymer, a reactive diluent, and a polymerization initiator, wherein said composition further comprises an inorganic filler and/or a (meth)acrylate having an isocyanurate ring.The adhesive composition of the invention is curable by the action of heat or light and is extremely useful as an adhesive for surface mounting devices.

    摘要翻译： 公开了一种可固化粘合剂组合物，其包含可聚合预聚物，反应性稀释剂和聚合引发剂，其中所述组合物还包含无机填料和/或具有异氰脲酸酯环的（甲基）丙烯酸酯。 本发明的粘合剂组合物可通过热或光的作用而固化，并且作为表面安装装置的粘合剂是非常有用的。