公开(公告)号：US6132865A

公开(公告)日：2000-10-17

申请号：US118022

申请日：1998-07-17

申请人： Osamu Oka ,  Jun Tochihira ,  Fumiki Komagata

发明人： Osamu Oka ,  Jun Tochihira ,  Fumiki Komagata

IPC分类号： B32B7/12 ,  B32B15/08 ,  C08G73/10 ,  C09J7/02 ,  C09J179/08 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/29 ,  B32B15/08 ,  B32B7/12 ,  C09J179/08 ,  C09J7/0242 ,  C09J7/0292 ,  H01L23/49513 ,  C09J2201/36 ,  C09J2479/08 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  Y10T428/2804 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663 ,  Y10T428/31721

摘要： An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

摘要翻译： 一种用于电子部件的胶带，包括金属基材和粘合剂层A和在所述金属基材的至少一侧依次层压的粘合剂层B，其中所述粘合剂A包含由100〜20摩尔％ 由下式（1a）表示的重复单元和由下式（1b）表示的重复单元为0〜80摩尔％，所述粘合剂B包含由100〜40摩尔％的重复单元表示的聚酰亚胺 通过下式（1a）和0-60摩尔％由下式（2）表示的重复单元，并且粘合剂层A和粘合剂层B各自具有不同的玻璃化转变温度：其中Ar表示二价 选自含有芳环的指定结构的基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，其亚甲基与Si连接，n表示1〜20的整数。

公开(公告)号：US06395391B1

公开(公告)日：2002-05-28

申请号：US09559084

申请日：2000-04-27

申请人： Osamu Oka ,  Jun Tochihira ,  Fumiki Komagata

发明人： Osamu Oka ,  Jun Tochihira ,  Fumiki Komagata

IPC分类号： B32B712

CPC分类号： B32B15/08 ,  B32B7/06 ,  B32B7/12 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J179/08 ,  C09J2201/36 ,  C09J2479/08 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  Y10T428/2804 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663 ,  Y10T428/31721 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B and an adhesive layer C laminated in order wherein said adhesive A comprises a polyimide consisting of 100-20% by mol of the repeating unit represented by the following formula-(1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

摘要翻译： 一种用于电子部件的胶带，包括金属基材和粘合剂层A以及粘合剂层B和粘合剂层C，其中所述粘合剂A包含由100-20摩尔％的由以重量单元表示的重复单元 下式（1a）和0-80％（摩尔）由下式（1b）表示的重复单元，所述粘合剂B包括由100-40摩尔％的由下式 （1a）和0-60摩尔％的由下式（2）表示的重复单元，并且粘合剂层A和粘合剂层B各自具有不同的玻璃化转变温度：其中Ar表示选自 含有芳香环的指定结构，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，其亚甲基与Si连接，n表示1〜20的整数。

公开(公告)号：US06228452B1

公开(公告)日：2001-05-08

申请号：US09015334

申请日：1998-01-29

申请人： Osamu Oka ,  Takeshi Nishigaya ,  Jun Tochihira ,  Fumiki Komagata

发明人： Osamu Oka ,  Takeshi Nishigaya ,  Jun Tochihira ,  Fumiki Komagata

IPC分类号： C09J702

CPC分类号： C09J7/28 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2479/08 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T428/1476 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2896 ,  H01L2924/00014

摘要： This invention provide an adhesive tape for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises a metal substrate, an adhesive layer A and an adhesive layer B laminated in order, wherein said adhesive layers A and B are resin layers composed of 100-40% by mol of at least a polyimide comprising the repeating unit represented by the formula (1) and 0-60% by mol of the repeating unit represented by the formula (2), said two adhesive layers having each a different glass transition temperature: wherein X is —SO2— and/or —C(=O)—OCH2CH2O—C(=O)—, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, and n means an integer of 1 to 20.

摘要翻译： 本发明提供一种具有足够热阻和可靠性的电子部件用胶带。 粘合带包括金属基材，粘合剂层A和依次层压的粘合剂层B，其中所述粘合剂层A和B是至少包含100-40摩尔％的至少一种聚酰亚胺的树脂层，所述聚酰亚胺包含由 所述两个粘合剂层具有不同的玻璃化转变温度：其中X是-SO 2 - 和/或-C（= O），所述式（1）和0-60摩尔％由式（2）表示的重复单元， ）-OCH 2 CH 2 O-C（= O） - ，Ar为含有芳环的二价基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，n表示1〜20的整数。

公开(公告)号：US06770370B2

公开(公告)日：2004-08-03

申请号：US10211265

申请日：2002-08-05

申请人： Naoji Suzuki ,  Osamu Oka ,  Jun Tochihira ,  Akihiro Maeda

发明人： Naoji Suzuki ,  Osamu Oka ,  Jun Tochihira ,  Akihiro Maeda

IPC分类号： B32B2738

CPC分类号： C09J163/00 ,  C08G59/188 ,  C08G59/686 ,  C08L53/00 ,  C08L2666/02 ,  C08L2666/08 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

摘要： An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the epoxy resin (B) to the phenol resin (C) is within a range from 1:0.6 to 1:1 in terms of a functional group equivalent ratio, and an adhesive sheet for a semiconductor device using the same are provided. The composition and the sheet are superior in reflow resistance and short-time and low-temperature bonding without lowering characteristics such as heat resistance, low hygroscopicity, high adhesion and electrical insulating properties of an epoxy resin cured article.

摘要翻译： 一种半导体装置用粘合剂组合物，其含有10〜30重量％的反应性弹性体（A），40〜65重量％的具有两个以上缩水甘油醚基的环氧树脂（B），酚醛树脂（C）和 固化促进剂（D），其中环氧树脂（B）与酚醛树脂（C）的比例以官能团当量比计为1：0.6〜1：1的范围内， 提供了使用该半导体器件的半导体器件。 组合物和片材在耐候性，耐湿性，低吸湿性，高粘合性和电绝缘性等环氧树脂固化物的特性方面优异的耐回流性和短时，低温接合性。

公开(公告)号：US06352847B1

公开(公告)日：2002-03-05

申请号：US09327487

申请日：1999-06-08

申请人： Hirokazu Matsukawa ,  Osamu Oka ,  Tuyosi Fujita ,  Kentaro Miyazaki

发明人： Hirokazu Matsukawa ,  Osamu Oka ,  Tuyosi Fujita ,  Kentaro Miyazaki

IPC分类号： C12N904

CPC分类号： C12N9/0006 ,  C12Q1/32

摘要： The invention provides an ammonia elimination reagent in solution, comprising a thermo-resistant isocitrate dehydrogenase with prominent stability under conditions at high alkaline pHs. For example, the isocitrate dehydrogenase is preferably derived from the genus Thermus. For an assay system of biological substances generating a reaction product ammonia, an ammonia elimination reagent can be prepared by selecting and using the enzyme; the resulting ammonia elimination reagent can be stored in solution; additionally, the assay system can be designed in combination with both the coenzymes NAD+ and NADP+. The ammonia elimination reagent is novel and can eliminate ammonia in an extremely short time.

摘要翻译： 本发明提供一种溶液中的氨清除试剂，其包含在高碱性pH下条件下具有突出稳定性的耐热异柠檬酸脱氢酶。 例如，异柠檬酸脱氢酶优选来自嗜热栖热菌属。 对于产生反应产物氨的生物物质的测定系统，可以通过选择和使用酶来制备氨消除剂; 所得氨消除剂可以储存在溶液中; 此外，测定系统可以与辅酶NAD +和NADP +两者结合设计。 氨消除剂是新颖的，可以在极短时间内消除氨。

公开(公告)号：US06265042B1

公开(公告)日：2001-07-24

申请号：US09150036

申请日：1998-09-09

申请人： Osamu Oka ,  Takeshi Nishigaya

发明人： Osamu Oka ,  Takeshi Nishigaya

IPC分类号： B32B712

CPC分类号： C09J179/08 ,  C09J7/22 ,  C09J7/38 ,  C09J2479/08 ,  C09J2479/086 ,  H01L23/4951 ,  H01L23/49558 ,  H01L2224/45144 ,  H01L2224/4826 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1476 ,  Y10T428/25 ,  Y10T428/31721 ,  H01L2924/00014

摘要： An adhesive tape for electronic parts of the present invention is characterized by comprising a heat resisting film and an adhesive layer provided on at least a side of said heat resisting film, said adhesive layer contains at least a polyimide comprising 100-30% by mol of at least one of the repeating units represented by the following formulas (1a) and (1b) and 0-70% by mol of at least one of the repeating unit represented by the following formulas (2a) and (2b) and 0.1-15 parts by weight of a silane coupling agent based on 100 parts by weight of said polyimide: wherein Ar represents a specified divalent aromatic group wherein R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

摘要翻译： 本发明的电子部件用胶带的特征在于，在耐热薄膜的至少一侧设置有耐热薄膜和粘合剂层，所述粘合剂层至少包含含有100〜30摩尔％ 由下式（1a）和（1b）表示的重复单元中的至少一种和由下式（2a）和（2b）表示的重复单元中的至少一种和0.1-15 基于100重量份所述聚酰亚胺的硅烷偶联剂重量份：其中Ar表示指定的二价芳族基团，其中R是具有1-10个碳原子的亚烷基或-CH 2 OC 6 H 4 - ，其亚甲基连接到Si ，n表示1〜20的整数。

公开(公告)号：US06184337B2

公开(公告)日：2001-02-06

申请号：US09178770

申请日：1998-10-26

申请人： Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

发明人： Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC分类号： C09J13324

CPC分类号： H01L24/83 ,  C08G73/10 ,  C08G73/1064 ,  C08L79/08 ,  C09J7/22 ,  C09J7/35 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/61 ,  C09J2479/08 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T428/1476 ,  Y10T428/2896 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.

摘要翻译： 本发明提供一种可溶于有机溶剂且耐热性优异的新型聚酰亚胺，以及聚酰亚胺的制造方法。 本发明的聚酰亚胺包含由式（1）表示的重复单元，其数均分子量为4,000至200,000.其中X为-SO 2 - 或-C（= O）-OCH 2 CH 2 O-C（= O ） - ，R 1，R 2，R 3和R 4独立地为具有1至4个碳原子的烷基或具有1至4个碳原子的烷氧基。

公开(公告)号：US5959068A

公开(公告)日：1999-09-28

申请号：US190174

申请日：1998-11-12

申请人： Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

发明人： Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC分类号： C09J7/02 ,  C08G73/10 ,  C09D179/08 ,  C09J179/08 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  C08G69/08 ,  C08G75/00 ,  C08G79/02

CPC分类号： C09D179/08 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/106 ,  C08G73/1064 ,  C09J179/08 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/181 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2887

摘要： This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.

摘要翻译： 本发明提供一种具有足够热阻和可靠性的电子部件的胶带和液体粘合剂。 粘合带包括至少由包含由式（1）和（2）表示的重复单元的聚酰亚胺构成的粘合剂层，其设置在耐热膜或脱模膜的表面上：其中X是-SO 2 - 和/ 或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar为含有芳环的二价基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，n表示1 到20。

公开(公告)号：US5723571A

公开(公告)日：1998-03-03

申请号：US703151

申请日：1996-08-29

申请人： Osamu Oka ,  Takeshi Nishigaya

发明人： Osamu Oka ,  Takeshi Nishigaya

IPC分类号： C08G77/455 ,  C08G73/10 ,  C08G77/42 ,  C08G69/26

CPC分类号： C08G73/1042 ,  C08G73/106

摘要： A novel polyimide is soluble in organic solvents and excels in heat resistance. The polyimide comprises 95-40 mol % of the repeating unit represented by the formulas (1) and 60-5 mol % of the repeating unit represented by the formula (2) and has a number average molecular weight of 4,000-200,000: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1-10 carbon atoms or a group: --CH.sub.2 OC.sub.6 H.sub.4 --, and n is an integer of 1-20.

摘要翻译： 新型聚酰亚胺可溶于有机溶剂，耐热性优异。 聚酰亚胺含有95-40摩尔％的由式（1）表示的重复单元和60-5摩尔％的式（2）表示的重复单元，其数均分子量为4,000-200,000:nd / 或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar是含有芳环的二价基团，R是具有1-10个碳原子的亚烷基或基团-CH 2 OC 6 H 4 - ，n是 1-20的整数。

公开(公告)号：US06617021B2

公开(公告)日：2003-09-09

申请号：US10068945

申请日：2002-02-11

申请人： Masaharu Kobayashi ,  Osamu Oka ,  Yasuhiro Yoshii

发明人： Masaharu Kobayashi ,  Osamu Oka ,  Yasuhiro Yoshii

IPC分类号： B32B2738

CPC分类号： C09J163/08 ,  C08G59/504 ,  C08L53/025 ,  C08L61/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/38 ,  C09J153/025 ,  C09J163/00 ,  C09J2203/326 ,  C09J2453/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10S428/901 ,  Y10T428/1476 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.