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Patent Agency Ranking
公开(公告)号：US20150180099A1
公开(公告)日：2015-06-25
申请号：US14569045
申请日：2014-12-12
Inventor： HIROHISA HINO , ARATA KISHI , HONAMI NAWA
IPC: H01M10/6554 , H01M10/6551 , F21V29/15 , F28F21/06
CPC classification number: F21V29/15 , H01M4/8642 , H01M10/613 , H01M10/653 , H01M10/655 , H01M10/6551 , H01M10/66
Abstract: A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity A of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.
Abstract translation: 冷却结构可以有效地减少热量，从而抑制制热电子设备的温度升高，而不使用散热器或水冷套，并且可以实现其小型化或减轻重量。 冷却结构包括：通过在发热体的表面上涂布第一浆料而形成的导热层; 以及通过在导热层的表面上涂布第二糊剂形成的散热层。 导热层包括第一树脂和第一填料，导热层的导热系数A为1.0W /（m·K）以上。 散热层包括第二树脂和第二填料，以及红外发射率 的散热层为0.7以上。
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公开(公告)号：US20170326663A1
公开(公告)日：2017-11-16
申请号：US15582794
申请日：2017-05-01
Inventor： ARATA KISHI , HIROKI MARUO
IPC: B23K1/00 , H01L23/00 , B23K35/26 , C22C12/00 , B23K101/36 , B23K103/08
Abstract: A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.
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3.发明申请CONNECTION STRUCTURE OF CIRCUIT MEMBER, CONNECTION METHOD, AND CONNECTION MATERIAL 有权电路构件的连接结构，连接方法和连接材料公开(公告)号：US20160316554A1
公开(公告)日：2016-10-27
申请号：US15075064
申请日：2016-03-18
Inventor： ARATA KISHI , TADASHI MAEDA , TADAHIKO SAKAI
CPC classification number: H05K1/0274 , B23K1/0016 , B23K35/26 , B23K35/264 , B23K35/3613 , B23K35/362 , H01R12/714 , H05K1/09 , H05K1/092 , H05K1/097 , H05K1/11 , H05K1/111 , H05K1/14 , H05K3/323 , H05K3/3436 , H05K3/3463 , H05K2201/0108 , H05K2201/0133 , H05K2201/0218 , H05K2201/0326 , H05K2201/10136 , H05K2201/10909 , H05K2201/10916 , H05K2201/2036 , Y02P70/613
Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.
Abstract translation: 电路构件的连接结构包括第一电路构件，第二电路构件和接头部分。 第一电路部件具有设置有透光性电极的第一主面。 第二电路部件具有设置有金属电极的第二主面。 接头部分介于第一主表面和第二主表面之间。 接头部分包括树脂部分和焊料部分。 焊料部分电连接透光电极和金属电极。 透光电极含有包含铟和锡的氧化物，焊料部分含有铋和铟。
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4.发明申请公开(公告)号：US20170347463A1
公开(公告)日：2017-11-30
申请号：US15582807
申请日：2017-05-01
Inventor： ARATA KISHI , HIROKI MARUO
CPC classification number: H05K3/3468 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1329 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13318 , H01L2224/13339 , H01L2224/1339 , H01L2224/16227 , H01L2224/81815 , H01L2924/014 , H01L2924/20104 , H05K1/111 , H05K1/181 , H05K3/3478 , H05K2201/10234 , H05K2203/041
Abstract: There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.
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公开(公告)号：US20170345782A1
公开(公告)日：2017-11-30
申请号：US15582801
申请日：2017-05-01
Inventor： ARATA KISHI , HIROKI MARUO
CPC classification number: H01L24/13 , B23K1/0016 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/05 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/05609 , H01L2224/05611 , H01L2224/05686 , H01L2224/13109 , H01L2224/13113 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/81203 , H01L2224/9202 , H01L2224/92125 , H01L2924/014 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H05K1/111 , H05K1/181 , H05K3/3457 , H05K2201/0326
Abstract: There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.
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