公开(公告)号：US20070246518A1

公开(公告)日：2007-10-25

申请号：US11409233

申请日：2006-04-21

Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: B23K20/08 ,  B23K31/02 ,  B23K1/00

CPC classification number: B23K3/0638 ,  B23K1/20 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20070246516A1

公开(公告)日：2007-10-25

申请号：US11409242

申请日：2006-04-21

Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: B23K31/02 ,  B23K1/08

CPC classification number: B23K3/0638 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/043 ,  H01L2924/00

Abstract: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.

Abstract translation: 公开了一种用于将导电接合材料施加到基底的系统，方法和装置。 该方法包括在模具的多个空腔中提供导电接合材料。 多个空腔中的空腔的总数大于对应于模具的电路支撑衬底的至少一个导电焊盘的总数。 将模具中的导电接合材料加热至导电接合材料的回流温度。 在至少一个空腔中至少一个可润湿表面被放置成与被加热的导电接合材料基本接触。 模具和相应的电路支撑衬底彼此靠近，使得至少一个空腔中的加热的导电接合材料与相应的电路支撑衬底的至少一个导电焊盘接触。

公开(公告)号：US20070246853A1

公开(公告)日：2007-10-25

申请号：US11758752

申请日：2007-06-06

Applicant: S. CHEY ,  Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： S. CHEY ,  Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: B29C70/88 ,  B29C33/38

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

Abstract translation: 提供了一种系统和方法，用于将导电接合材料注射到真空室内的模具中的多个空腔中。 模具和填充头位于真空室内，其中模具包括多个空腔。 在真空室内产生真空，从而从腔室和空腔中除去空气。 可选地，当填充头与模具基本接触时，将旋转运动提供给模具和填充头中的至少一个。 当在真空室中保持真空时，导电接合材料被迫从灌装头朝向模具，并进入至少一个空腔中。

公开(公告)号：US20070246511A1

公开(公告)日：2007-10-25

申请号：US11409244

申请日：2006-04-21

Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: A47J36/02

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

公开(公告)号：US20070272389A1

公开(公告)日：2007-11-29

申请号：US11396107

申请日：2006-03-31

Applicant: Peter Gruber ,  John Knickerbocker

Inventor： Peter Gruber ,  John Knickerbocker

IPC: B22D11/124 ,  B05D5/12

CPC classification number: H05K3/3457 ,  H01L21/288 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/11009 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2203/0113 ,  H05K2203/0557 ,  H01L2924/00

Abstract: A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention.

Abstract translation: 用于形成共面电连接器的方法和装置。 使用投诉模具将焊料沉积到电气封装的晶片，基板或其他部件上，使得焊料材料的末端被沉积，即与形成与晶片，基板或附件形成连接的端部相对的端部 电气封装的其他部件彼此共面。 使用投诉模具具有一个或多个用于接收焊料材料并具有柔性侧面和平面侧的导管。 模具的柔性侧被定位成与电气封装的晶片，衬底或其它部件相邻，允许将焊料材料沉积到其表面上，使得柔性模具的平面侧提供共面的互连器件。 可以使用注射成型焊料（IMS）头作为填充本​​发明的柔性模具的导管的装置。

公开(公告)号：US20070246515A1

公开(公告)日：2007-10-25

申请号：US11409232

申请日：2006-04-21

Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: B23K31/02 ,  B23K1/08 ,  B23K35/12

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20080317848A2

公开(公告)日：2008-12-25

申请号：US10492270

申请日：2004-04-08

Applicant: Thomas Gramatte ,  Peter Gruber ,  Michael Heschel ,  Dirk Pamperin ,  Jan Ploen ,  Steffen Scheithauer ,  Wolfgang Wehner ,  Peter Guldner

Inventor： Thomas Gramatte ,  Peter Gruber ,  Michael Heschel ,  Dirk Pamperin ,  Jan Ploen ,  Steffen Scheithauer ,  Wolfgang Wehner ,  Peter Guldner

IPC: A61K31/445 ,  A61K9/20

CPC classification number: A61K9/2009 ,  A61K9/2054 ,  A61K9/2846 ,  A61K9/5026 ,  A61K9/5078 ,  A61K31/445

Abstract: By suitable retardation oral pharmaceutical compositions containing propiverine or one or several pharmaceutically acceptable salts thereof in an amount of 4 mg to 60 mg propiverine and having a prolonged release of the active agent are produced. Preferably a blend of active agent and optionally one or more acidic substances having a pKa value of less than 6.65 are provided with a retarding coating or are embedded in a matrix which is then optionally coated with further retarding layers.

Abstract translation: 通过合适的阻滞剂，可以制备含有丙哌嗪或其一种或多种药学上可接受的盐的药物组合物，其量为4mg至60mg propiverine并且具有延长的活性剂释放。 优选地，具有pKa值小于6.65的活性剂和任选的一种或多种酸性物质的混合物具有延迟涂层或嵌入基质中，然后任选地涂覆有进一步的阻滞层。

公开(公告)号：US20070029277A1

公开(公告)日：2007-02-08

申请号：US11195147

申请日：2005-08-02

Applicant: Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

Inventor： Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

IPC: B29D11/00 ,  B29C35/08 ,  B29C45/00

CPC classification number: H01L27/14685 ,  B29D11/00365 ,  B29D11/00461 ,  B82Y30/00 ,  G02B3/0018 ,  G02B3/0056 ,  G02F1/137 ,  G02F1/29 ,  H01L27/14627 ,  H01L31/02327 ,  H01L33/58

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

Abstract translation: 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。

公开(公告)号：US20060124927A1

公开(公告)日：2006-06-15

申请号：US10905013

申请日：2004-12-09

Applicant: Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

Inventor： Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

IPC: H01L21/66 ,  H01L23/58

CPC classification number: H05K3/3468 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/325 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K2203/162 ,  H05K2203/167 ,  H01L2224/0401

Abstract: Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.

Abstract translation: 公开了在封装之前在基板上形成导电结构的方法和根据该方法生成的测试探针结构。 导电结构包括通过注射成型的焊料形成的高纵横比结构。 本发明可以应用于在典型的BEOL之后以及在封装之前在常规半导体衬底上形成无源元件和互连。 该方法可以为导电结构提供更好的电迁移特性，较低的电阻率和更高的Q因子。 此外，该方法可以向后兼容并可定制。

公开(公告)号：US5568133A

公开(公告)日：1996-10-22

申请号：US570814

申请日：1995-12-12

Applicant: Bernhard Durrer ,  Hans Botschi ,  Peter Gruber

Inventor： Bernhard Durrer ,  Hans Botschi ,  Peter Gruber

IPC: G08B17/113 ,  G08B23/00

CPC classification number: G08B17/113

Abstract: Upon insertion of a fire alarm insert into a corresponding fire alarm mounting, the insert covers the mounting. The insert has a movable fastening comprising a ring, for example, for fastening the insert to the mounting. Indicator elements are included for indicating proper positioning of the insert relative to the mounting.

Abstract translation: 在将火警报警插入物插入相应的火灾报警装置后，插入物将覆盖安装件。 插入件具有可移动的紧固件，其包括例如用于将插入件紧固到安装件上的环。 包括指示元件用于指示插入件相对于安装件的正确定位。