中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

31 records (took 0.043 seconds)

    GLOBAL VACUUM INJECTION MOLDED SOLDER SYSTEM AND METHOD
    3.
    发明申请
    GLOBAL VACUUM INJECTION MOLDED SOLDER SYSTEM AND METHOD 失效
    全球真空注射成型焊接系统及方法

    公开(公告)号：US20070246853A1

    公开(公告)日：2007-10-25

    申请号：US11758752

    申请日：2007-06-06

    Applicant: S. CHEY ,  Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    Inventor： S. CHEY ,  Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    IPC: B29C70/88 ,  B29C33/38

    CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

    Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

    Abstract translation: 提供了一种系统和方法，用于将导电接合材料注射到真空室内的模具中的多个空腔中。 模具和填充头位于真空室内，其中模具包括多个空腔。 在真空室内产生真空，从而从腔室和空腔中除去空气。 可选地，当填充头与模具基本接触时，将旋转运动提供给模具和填充头中的至少一个。 当在真空室中保持真空时，导电接合材料被迫从灌装头朝向模具，并进入至少一个空腔中。

    Conductive bonding material fill techniques
    4.
    发明申请
    Conductive bonding material fill techniques 有权
    导电接合材料填充技术

    公开(公告)号：US20070246511A1

    公开(公告)日：2007-10-25

    申请号：US11409244

    申请日：2006-04-21

    Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    IPC: A47J36/02

    CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

    Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

    Abstract translation: 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

    Rotational fill techniques for injection molding of solder
    6.
    发明申请
    Rotational fill techniques for injection molding of solder 失效
    用于注射成型焊料的旋转填充技术

    公开(公告)号：US20070246515A1

    公开(公告)日：2007-10-25

    申请号：US11409232

    申请日：2006-04-21

    Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

    IPC: B23K31/02 ,  B23K1/08 ,  B23K35/12

    CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

    Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

    Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

    Laser ablation for integrated circuit fabrication
    8.
    发明授权
    Laser ablation for integrated circuit fabrication 有权
    激光烧蚀用于集成电路制造

    公开(公告)号：US08419895B2

    公开(公告)日：2013-04-16

    申请号：US12788843

    申请日：2010-05-27

    Applicant: Bing Dang ,  John Knickerbocker ,  Aparna Prabhakar ,  Peter Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

    Inventor： Bing Dang ,  John Knickerbocker ,  Aparna Prabhakar ,  Peter Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

    IPC: B32B38/10

    CPC classification number: H01L21/6835 ,  B23K26/361 ,  H01L2221/68381 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917

    Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.

    Abstract translation: 一种用于从晶片释放处理器的方法，包括集成电路（IC）的晶片包括使用包含聚合物的粘合剂将处理器附接到晶片; 执行边缘处理以从处理器和晶片的边缘去除多余的粘合剂部分; 使用激光器通过处理器烧蚀粘合剂，其中基于处理材料的透明度选择激光的波长; 并将处理器与晶片分离。 一种用于从晶片释放处理器的系统，包括IC的晶片包括使用包含聚合物的粘合剂附接到晶片的处理器; 边缘处理模块，所述边缘处理模块被配置为从所述处理器和晶片的边缘去除所述粘合剂的多余部分; 和激光器，激光器被配置为通过处理器消融粘合剂。

    TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE
    9.
    发明申请
    TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE 有权
    提供去耦电容的技术

    公开(公告)号：US20080067628A1

    公开(公告)日：2008-03-20

    申请号：US11930698

    申请日：2007-10-31

    Applicant: Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

    Inventor： Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

    IPC: H01L29/00

    CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

    Abstract: Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mote vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated

    Abstract translation: 提供电子器件制造技术。 一方面，提供一种电子设备。 该电子设备包括具有一个或多个微通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个

Patent Agency Ranking