公开(公告)号：US11444010B2

公开(公告)日：2022-09-13

申请号：US17060545

申请日：2020-10-01

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kazunori Hasegawa ,  Yuichi Yato ,  Hiroyuki Nakamura ,  Yukihiro Sato ,  Hiroya Shimoyama

IPC: H01L23/495 ,  H01L23/48 ,  H01L21/00 ,  H05K7/02 ,  H05K7/18 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes: a semiconductor chip including a field effect transistor for switching; a die pad on which the semiconductor chip is mounted via a first bonding material; a lead electrically connected to a pad for source of the semiconductor chip through a metal plate; a lead coupling portion formed integrally with the lead; and a sealing portion for sealing them. A back surface electrode for drain of the semiconductor chip and the die pad are bonded via the first bonding material, the metal plate and the pad for source of the semiconductor chip are bonded via a second bonding material, and the metal plate and the lead coupling portion are bonded via a third bonding material. The first, second, and third bonding materials have conductivity, and an elastic modulus of each of the first and second bonding materials is lower than that of the third bonding material.

公开(公告)号：US10347567B2

公开(公告)日：2019-07-09

申请号：US16020353

申请日：2018-06-27

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Atsushi Nishikizawa ,  Yuichi Yato ,  Hiroi Oka ,  Tadatoshi Danno ,  Hiroyuki Nakamura

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: In a resin sealing type semiconductor device, a semiconductor chip CP2 is mounted over a die pad DP having conductivity via a bonding member BD2 having insulation property, and a semiconductor chip CP1 is mounted over the die pad DP via a bonding member BD1 having conductivity. A first length of a portion, in a first side formed by an intersection of a first side surface and a second side surface of the semiconductor chip CP2, covered with the bonding member BD2 is larger than a second length of a portion, in a second side formed by an intersection of a third side surface and a fourth side surface of the semiconductor chip CP1, covered with the bonding member BD1.

公开(公告)号：US09922905B2

公开(公告)日：2018-03-20

申请号：US15444773

申请日：2017-02-28

Applicant: Renesas Electronics Corporation

Inventor： Yuichi Yato ,  Hiroi Oka ,  Noriko Okunishi ,  Keita Takada

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/13 ,  H01L23/31 ,  H01L23/24

CPC classification number: H01L23/49513 ,  H01L21/565 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49805 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/77 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84205 ,  H01L2224/84439 ,  H01L2224/8501 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/92157 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.

公开(公告)号：US10818581B2

公开(公告)日：2020-10-27

申请号：US15657132

申请日：2017-07-22

Applicant: Renesas Electronics Corporation

Inventor： Toshiyuki Hata ,  Yuichi Yato

IPC: H01L23/495 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

Abstract: An improvement is achieved in the performance of a semiconductor device. A second component mounting portion over which a first electronic component is mounted is connected to a coupling portion of a lead frame via a suspension lead. The suspension lead has a first portion between the second component mounting portion and the coupling portion and a second portion between the first portion and the coupling portion. The second portion has a third portion connected to the first portion and having a width smaller than a width of the first portion, a fourth portion connected to the first portion and having a width smaller than the width of the first portion, and a through hole (opening) located between the third and fourth portions. Each of the first, third, and fourth portions has the same thickness. After a sealing body is formed, a cutting jig is pressed against the suspension lead to cut the suspension lead.

公开(公告)号：US09214412B2

公开(公告)日：2015-12-15

申请号：US14304945

申请日：2014-06-15

Applicant: Renesas Electronics Corporation

Inventor： Katsuhiko Funatsu ,  Yukihiro Sato ,  Yuichi Yato ,  Tomoaki Uno

IPC: H01L23/495 ,  H01L23/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/564 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion.

Abstract translation: 半导体器件包括第一芯片安装部分，布置在第一芯片安装部分上的第一半导体芯片，形成在第一半导体芯片的表面中的第一焊盘，用作外部耦合端子的第一引线，第一导电部件 其电连接第一焊盘和第一引线，以及密封体，其密封第一芯片安装部分，第一半导体芯片，第一引线的一部分和第一导电构件的一部分。 第一导电构件包括第一板状部分和与第一板状部分一体形成的第一支撑部分。 第一支撑部的端部从密封体露出，第一支撑部形成有第一弯曲部。

公开(公告)号：US20150001699A1

公开(公告)日：2015-01-01

申请号：US14304945

申请日：2014-06-15

Applicant: Renesas Electronics Corporation

Inventor： Katsuhiko Funatsu ,  Yukihiro Sato ,  Yuichi Yato ,  Tomoaki Uno

IPC: H01L23/495

CPC classification number: H01L23/564 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion.

Abstract translation: 半导体器件包括第一芯片安装部分，布置在第一芯片安装部分上的第一半导体芯片，形成在第一半导体芯片的表面中的第一焊盘，用作外部耦合端子的第一引线，第一导电部件 其电连接第一焊盘和第一引线，以及密封体，其密封第一芯片安装部分，第一半导体芯片，第一引线的一部分和第一导电构件的一部分。 第一导电构件包括第一板状部分和与第一板状部分一体形成的第一支撑部分。 第一支撑部的端部从密封体露出，第一支撑部形成有第一弯曲部。

公开(公告)号：US10037932B2

公开(公告)日：2018-07-31

申请号：US15515297

申请日：2015-03-30

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Atsushi Nishikizawa ,  Yuichi Yato ,  Hiroi Oka ,  Tadatoshi Danno ,  Hiroyuki Nakamura

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/06 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a resin sealing type semiconductor device, a semiconductor chip CP2 is mounted over a die pad DP having conductivity via a bonding member BD2 having insulation property, and a semiconductor chip CP1 is mounted over the die pad DP via a bonding member BD1 having conductivity. A first length of a portion, in a first side formed by an intersection of a first side surface and a second side surface of the semiconductor chip CP2, covered with the bonding member BD2 is larger than a second length of a portion, in a second side formed by an intersection of a third side surface and a fourth side surface of the semiconductor chip CP1, covered with the bonding member BD1.

公开(公告)号：US09607940B2

公开(公告)日：2017-03-28

申请号：US14901424

申请日：2013-07-05

Applicant: Renesas Electronics Corporation

Inventor： Yuichi Yato ,  Hiroi Oka ,  Noriko Okunishi ,  Keita Takada

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/565 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49805 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/77 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84205 ,  H01L2224/84439 ,  H01L2224/8501 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/92157 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.

公开(公告)号：US09362238B2

公开(公告)日：2016-06-07

申请号：US14919597

申请日：2015-10-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Katsuhiko Funatsu ,  Yukihiro Sato ,  Yuichi Yato ,  Tomoaki Uno

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/564 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion.