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    Chip assembly with load-bearing lid in thermal contact with the chip
    1.
    发明授权
    Chip assembly with load-bearing lid in thermal contact with the chip 失效
    带有承载盖的芯片组件与芯片热接触

    公开(公告)号：US06222263B1

    公开(公告)日：2001-04-24

    申请号：US09420765

    申请日：1999-10-19

    申请人： Raed Sherif ,  Hilton T. Toy ,  David J. Womac

    发明人： Raed Sherif ,  Hilton T. Toy ,  David J. Womac

    IPC分类号： H01L2334

    CPC分类号： H01L23/36 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/09701

    摘要： In a direct lid attach structure incorporating thermally conductive material between a lid and an electronic circuit chip, there are provided a number of apertures in the lid. These apertures are provided directly opposite disks or pads disposed on the substrate to which the chip is attached. A hardenable adhesive such as an epoxy is disposed through the apertures and hardened in place so as to provide a bond between the lid and the underlying pad which has been previously affixed to the substrate to which the chip is attached with a compliant adhesive. There is thus provided an electronic chip assembly which allows bonded chip-to-lid thermal interfaces to be used with LGA interconnection techniques. The support structure mitigates the mechanical loads associated with LGA socketing which could otherwise damage the substrate and affect the integrity of the bonded thermal interface.

    摘要翻译： 在盖和电子电路芯片之间结合有导热材料的直接盖附接结构中，在盖中设有多个孔。 这些孔直接设置在与芯片附接到的基板上相对的盘或垫上。 诸如环氧树脂的可硬化粘合剂通过孔设置并固化就位，以便在先前通过柔性粘合剂粘附到芯片附着的基底上的盖和下垫之间提供粘结。 因此，提供了一种电子芯片组件，其允许粘合的芯片到盖子热接口与LGA互连技术一起使用。 支撑结构减轻了与LGA浸入相关的机械载荷，否则可能损坏基板并影响粘结的热界面的完整性。

    Method of forming a flip-chip package
    4.
    发明授权
    Method of forming a flip-chip package 有权
    形成倒装芯片封装的方法

    公开(公告)号：US08037594B2

    公开(公告)日：2011-10-18

    申请号：US12116655

    申请日：2008-05-07

    申请人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    发明人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    IPC分类号： H05B3/00

    CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

    摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

    摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。