摘要:
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.
摘要:
A tester for testing a digital device. The tester includes a plurality of time measurement units to measure transition timing values of output data of each output pin of the digital device in each test cycle. A plurality of result operations units performs real-time arithmetic operations on the measured transition timing values to produce a pass/fail result and additional test results. A plurality of result accumulators stores the pass/fail result and a number of selected test results. And a capture/analysis engine captures and analyzes the pass/fail result and the selected results to provide comprehensive test performance of the digital device.
摘要:
I/O delay testing for devices utilizing on-chip delay generation. An embodiment of an apparatus includes I/O buffer circuits, at least one of the buffer circuits including a transmitter and a receiver that are coupled for loop-back testing of the buffer circuit; and testing circuitry for the loop-back testing for the at least one buffer circuit, the loop-back testing including determining whether test data transmitted by the transmitter of the buffer circuit matches test data received by the respective coupled receiver. The testing circuitry includes a delay line to provide delay values from a transmit clock signal for the testing of the at least one buffer circuit, a counter to provide a count to choose one of the plurality of delay values, and test logic for the loop-back testing.
摘要:
I/O delay testing for devices utilizing on-chip delay generation. An embodiment of an apparatus includes I/O buffer circuits, at least one of the buffer circuits including a transmitter and a receiver that are coupled for loop-back testing of the buffer circuit; and testing circuitry for the loop-back testing for the at least one buffer circuit, the loop-back testing including determining whether test data transmitted by the transmitter of the buffer circuit matches test data received by the respective coupled receiver. The testing circuitry includes a delay line to provide delay values from a transmit clock signal for the testing of the at least one buffer circuit, a counter to provide a count to choose one of the plurality of delay values, and test logic for the loop-back testing.
摘要:
A system and method for communicating with contactless IC cards of multiple protocols includes transmitting an IC card polling signal and receiving a data transmission from an IC card. A processor is configured to determine whether or not a data transmission is received in response to the polling signal. The processor is configured to decode the data transmission in real-time if it is received in response to the polling signal. The processor is otherwise configured to first store the received data transmission in a memory and then decode the stored data transmission.
摘要:
A system and method for communicating with contactless IC cards of multiple protocols and power levels includes generating a first alternating magnetic field with an interrogator for energizing a proximate IC card and receiving a data transmission from the IC card. A processor of the interrogator is configured to decode the received data transmission. The interrogator then generates a second alternating magnetic field having a different magnetic field strength than the first alternating magnetic field when failing to decode the data transmission being received from the IC card. The processor then attempts to decode a data transmission received from the IC card in response to the second alternating magnetic field.
摘要:
The present invention provides machinery used to create products (for instance disposable products). The machinery is operated at high speed, with the machine occupying a small footprint. Materials can be fed into the manufacturing process vertically (from above or below), using assembly stations to feed completed components into the system at appropriate stations. Additionally, restocking of raw components can be accomplished by robotic means of transferring the raw material from staging areas into infeeding or splicing stations, without the need for human operators.
摘要:
A system and method for communicating with contactless IC cards of multiple protocols includes transmitting an IC card polling signal and receiving a data transmission from an IC card. A processor is configured to determine whether or not a data transmission is received in response to the polling signal. The processor is configured to decode the data transmission in real-time if it is received in response to the polling signal. The processor is otherwise configured to first store the received data transmission in a memory and then decode the stored data transmission.
摘要:
The present invention provides machinery used to create products (for instance disposable products). The machinery is operated at high speed, with the machine occupying a small footprint. Materials can be fed into the manufacturing process vertically (from above or below), using assembly stations to feed completed components into the system at appropriate stations. Additionally, restocking of raw components can be accomplished by robotic means of transferring the raw material from staging areas into infeeding or splicing stations, without the need for human operators.
摘要:
Techniques and mechanisms for evaluating I/O buffer circuits. In an embodiment, test rounds are performed for a device including the I/O buffer circuits, each of the test rounds comprising a respective loop-back test for each of the I/O buffer circuits. Each of the test rounds corresponds to a different respective delay between a transmit clock signal and a receive clock signal. In another embodiment, a first test round indicates a failure condition for at least one I/O buffer circuit and a second test round indicates the failure condition for each of the I/O buffer circuits. Evaluation of the I/O buffer circuits determines whether the device satisfies a test condition, where the determining is based on a difference between the delay corresponding to the first test round and the delay corresponding to the second test round.