摘要:
A structure that possesses the combined properties of carrying signals through the provision of a series of electrical conductors, and by optical signals through the intermediary of a series of optical waveguides. This imparts a particular advantage thereto for the fabrication of optical data links, providing a convenient, compact method of interconnecting electrical paths to transducer chips and to waveguide structures. This approach solves the problem of connecting polymer waveguides to VCSEL (Vertical-Cavity-Surface-Emitting Laser) arrays, thereby avoiding the problem of damaging fragile wire bonds. A method is also provided which utilizes the foregoing structure.
摘要:
The invention provides a newly designed head mounted virtual image display that is dramatically less in weight than is known in the art by virtue of a unique beam folding design, making possible wearable computer systems of significantly greater convenience and acceptability to a wide range of users. The unit may be used comfortably in conjunction with eyeglasses. Optical systems according to the invention are provided that are advantageous for use with emissive, transmissive and reflective microdisplays, and which provide high optical performance, compact design and clear see-through properties. Also, the invention provides an improved method of illumination for reflection liquid crystal microdisplays. This makes possible optical systems for virtual image displays of improved field of view, compactness, and shorter image path combined with good efficiency.
摘要:
A head mounted virtual image display unit is provided which is compact in size and weight, and incorporates a high performance optical system offering a clear see-through capability. A sliding light shield may be incorporated for those instances when see-through capability is not desired. A focus adjustment may be incorporated to permit the focusing of the image, for example, at a distance of approximately 18 inches to infinity. An adjustable headband may be incorporated that adapts to fit the users head. A flexible boom structure may be incorporated to facilitate fine positional adjustment of the optical assembly. A slider and ball joint mechanism may also be incorporated to facilitate positional adjustment of the optical assembly. A built-in microphone may be incorporated to enable speech input by the user. The head mounted virtual image display unit may be used comfortably in conjunction with eye or safety glasses, and provides a useful image to the user without blocking his view of the surrounding environment. The unit is designed to have a pleasing appearance so as to greatly enhance user acceptability.
摘要:
A head mounted virtual image display unit is provided which is compact in size and weight, and incorporates a high performance optical system offering a clear see-through capability. A sliding light shield may be incorporated for those instances when see-through capability is not desired. A focus adjustment may be incorporated to permit the focusing of the image, for example, at a distance of approximately 18 inches to infinity. An adjustable headband may be incorporated that adapts to fit the users head. A flexible boom structure may be incorporated to facilitate fine positional adjustment of the optical assembly. A slider and ball joint mechanism may also be incorporated to facilitate positional adjustment of the optical assembly. A built-in microphone may be incorporated to enable speech input by the user. The head mounted virtual image display unit may be used comfortably in conjunction with eye or safety glasses, and provides a useful image to the user without blocking his view of the surrounding environment. The unit is designed to have a pleasing appearance so as to greatly enhance user acceptability.
摘要:
Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.
摘要:
A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
摘要:
An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要:
A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要:
An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.