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1.发明申请SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING AND/OR SPACING SEMICONDUCTOR DIE 有权包括用于嵌入和/或间隔半导体芯片的独立薄膜层的半导体器件公开(公告)号：US20150221624A1
公开(公告)日：2015-08-06
申请号：US14422152
申请日：2013-01-09
申请人： SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. , SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
发明人： Ning Ye , Chin-Tien Chiu , Suresh Upadhyayula , Peng Fu , Zhong Lu , Cheeman Yu , Yuang Zhang , Li Wang , Pradeep Kumar Rai , Weili Wang , Enyong Tai , King Hoo Ong , Kim Lee Bock
CPC分类号： H01L25/18 , H01L23/145 , H01L23/3128 , H01L23/3135 , H01L23/5389 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/00 , H01L25/165 , H01L25/50 , H01L2224/05554 , H01L2224/27318 , H01L2224/2732 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/83855 , H01L2224/83856 , H01L2224/83986 , H01L2224/85986 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/143 , H01L2924/1438 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
摘要翻译： 公开了一种包括多个堆叠半导体管芯的半导体封装以及形成半导体封装的方法。 为了减轻控制器管芯上的引线接合要求，控制器管芯可以以不需要引线键合或覆盖在控制器管芯外部的倒装芯片布置直接安装到衬底。 此后，可以在控制器管芯周围的衬底上固定隔离层，以提供安装一个或多个闪存管芯的水平表面。 间隔层可以以各种不同的构型设置。
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2.发明授权公开(公告)号：US09773766B2
公开(公告)日：2017-09-26
申请号：US14422152
申请日：2013-01-09
申请人： SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. , SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
发明人： Ning Ye , Chin-Tien Chiu , Suresh Upadhyayula , Peng Fu , Zhong Lu , Cheeman Yu , Yuang Zhang , Li Wang , Pradeep Kumar Rai , Weili Wang , Enyong Tai , King Hoo Ong , Kim Lee Bock
CPC分类号： H01L25/18 , H01L23/145 , H01L23/3128 , H01L23/3135 , H01L23/5389 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/00 , H01L25/165 , H01L25/50 , H01L2224/05554 , H01L2224/27318 , H01L2224/2732 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/83855 , H01L2224/83856 , H01L2224/83986 , H01L2224/85986 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/143 , H01L2924/1438 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
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公开(公告)号：US09362244B2
公开(公告)日：2016-06-07
申请号：US14375408
申请日：2012-10-22
发明人： Chin Tien Chiu , Cheeman Yu , Hem Takiar
IPC分类号： H01L23/48 , H01L23/00 , H01L21/56 , H01L21/82 , H01L23/31 , H01L25/065 , H01L25/00 , H01L23/14 , H01L23/495 , H01L23/538
CPC分类号： H01L24/06 , H01L21/561 , H01L21/82 , H01L23/145 , H01L23/3121 , H01L23/49575 , H01L23/5386 , H01L24/03 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/03011 , H01L2224/04042 , H01L2224/05554 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85001 , H01L2224/85947 , H01L2224/85986 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06527 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2224/48247 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/05599
摘要： A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
摘要翻译： 公开了一种存储器件及其制造方法。 存储器件通过将一个或多个半导体管芯安装在衬底上并将管芯接合到衬底来制造。 管芯和引线键合被封装，并且封装的器件被分割。 在分割步骤期间，线接合被切断，此后，切断的线接合通过模塑料的一个或多个表面上的外部连接器连接到基底。
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4.发明授权Semiconductor device including embedded controller die and method of making same 有权包括嵌入式控制器管芯的半导体器件及其制造方法公开(公告)号：US09236368B2
公开(公告)日：2016-01-12
申请号：US14422155
申请日：2013-01-28
发明人： Shiv Kumar , Chin-Tien Chiu , Kaiyou Qian , Cheeman Yu
IPC分类号： H01L23/52 , H01L25/18 , H01L23/00 , H01L25/065 , H01L25/00 , H01L23/13 , H01L21/56 , H01L23/31
CPC分类号： H01L25/18 , H01L21/56 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/05554 , H01L2224/24227 , H01L2224/24247 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48101 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48482 , H01L2224/49175 , H01L2224/73265 , H01L2224/73267 , H01L2224/82102 , H01L2224/82105 , H01L2224/85 , H01L2225/0651 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
摘要翻译： 半导体器件包括其中形成有用于接收半导体管芯的空腔（112）的衬底（102）。 在示例中，半导体管芯是控制器管芯（114）。 控制器管芯（114）可以用例如印刷形成的电迹线（120）电连接到基板（102）。 在控制器管芯（114）电连接到衬底（102）之后，一个或多个存储器管芯（150）可以在空腔（112）和控制器管芯（114）上固定到衬底（102）上。
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公开(公告)号：US20150001739A1
公开(公告)日：2015-01-01
申请号：US14375408
申请日：2012-10-22
发明人： Chin Tien Chiu , Cheeman Yu , Hem Takiar
CPC分类号： H01L24/06 , H01L21/561 , H01L21/82 , H01L23/145 , H01L23/3121 , H01L23/49575 , H01L23/5386 , H01L24/03 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/03011 , H01L2224/04042 , H01L2224/05554 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85001 , H01L2224/85947 , H01L2224/85986 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06527 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2224/48247 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/05599
摘要： A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
摘要翻译： 公开了一种存储器件及其制造方法。 存储器件通过将一个或多个半导体管芯安装在衬底上并将管芯接合到衬底来制造。 管芯和引线键合被封装，并且封装的器件被分割。 在分割步骤期间，线接合被切断，此后，切断的线接合通过模塑料的一个或多个表面上的外部连接器连接到基底。
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6.发明申请METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY 审中-公开在存储器件和形成的存储器件上形成彩色图像的方法公开(公告)号：US20160086827A1
公开(公告)日：2016-03-24
申请号：US14959859
申请日：2015-12-04
发明人： Peng Fu , Zhong Lu , Chin Tien Chiu , Cheeman Yu , Matthew Chen , Weiting Jiang
IPC分类号： H01L21/56 , H01L23/544
CPC分类号： H01L21/565 , H01L21/56 , H01L21/561 , H01L21/566 , H01L23/28 , H01L23/544 , H01L23/552 , H01L24/73 , H01L24/97 , H01L2223/54406 , H01L2223/5442 , H01L2223/54433 , H01L2223/54486 , H01L2224/16225 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.
摘要翻译： 公开了一种包括图形内容的存储设备和使具有图形内容的存储设备的方法。 图形内容形成在释放介质上。 将释放介质和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，图形内容从释放介质转移到封装的存储器件。
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公开(公告)号：US20150061157A1
公开(公告)日：2015-03-05
申请号：US14450005
申请日：2014-08-01
发明人： Cheeman Yu , Zhong Lu , Gursharan Singh , Wei Gu
IPC分类号： H01L25/065 , H01L21/56 , H01L21/66 , H01L23/31
CPC分类号： H01L25/0657 , H01L22/14 , H01L23/3135 , H01L24/73 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85205 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
摘要翻译： 一种半导体器件，包括安装到衬底上的两个或更多个管芯堆叠。 安装第一个模具堆叠，至少部分封装，然后进行测试。 如果第一裸片堆栈在预定义参数内起作用，则第二裸片堆叠被安装在第一裸片叠上，然后该装置可经历第二封装处理。 在安装第二芯片堆叠之前测试第一个裸片堆叠通过在所有裸片安装在半导体器件中之前识别有缺陷的半导体裸片来提高产量。
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8.发明申请SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CONTROLLER DIE AND METHOD OF MAKING SAME 有权包括嵌入式控制器的半导体器件及其制造方法公开(公告)号：US20150214206A1
公开(公告)日：2015-07-30
申请号：US14422155
申请日：2013-01-28
发明人： Shiv Kumar , Chin-Tien Chiu , Kaiyou Qian , Cheeman Yu
CPC分类号： H01L25/18 , H01L21/56 , H01L23/13 , H01L23/3121 , H01L23/3128 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/05554 , H01L2224/24227 , H01L2224/24247 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48101 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48482 , H01L2224/49175 , H01L2224/73265 , H01L2224/73267 , H01L2224/82102 , H01L2224/82105 , H01L2224/85 , H01L2225/0651 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
摘要翻译： 半导体器件包括其中形成有用于接收半导体管芯的空腔（112）的衬底（102）。 在示例中，半导体管芯是控制器管芯（114）。 控制器管芯（114）可以用例如印刷形成的电迹线（120）电连接到基板（102）。 在控制器管芯（114）电连接到衬底（102）之后，一个或多个存储器管芯（150）可以在空腔（112）和控制器管芯（114）上固定到衬底（102）上。
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公开(公告)号：US09240393B2
公开(公告)日：2016-01-19
申请号：US14450005
申请日：2014-08-01
发明人： Cheeman Yu , Zhong Lu , Gursharan Singh , Wei Gu
IPC分类号： H01L25/065 , H01L23/31 , H01L25/00 , H01L21/66
CPC分类号： H01L25/0657 , H01L22/14 , H01L23/3135 , H01L24/73 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85205 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
摘要翻译： 一种半导体器件，包括安装在衬底上的两个或更多个管芯堆叠。 安装第一个模具堆叠，至少部分封装，然后测试。 如果第一裸片堆栈在预定义参数内起作用，则第二裸片堆叠被安装在第一裸片叠上，然后该装置可经历第二封装处理。 在安装第二芯片堆叠之前测试第一个裸片堆叠通过在所有裸片安装在半导体器件中之前识别有缺陷的半导体裸片来提高产量。
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