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公开(公告)号：US10340418B2
公开(公告)日：2019-07-02
申请号：US15865051
申请日：2018-01-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ye Seul Kim , Kyoung Wan Kim , Ji Hye Kim , Sang Won Woo
Abstract: Described herein is a highly efficient light emitting device. The light emitting device includes: a first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer; an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a current blocking layer disposed on the second conductivity-type semiconductor layer; a transparent electrode layer covering the current blocking layer; a first electrode electrically connected to the first conductivity-type semiconductor layer; a second electrode disposed on the transparent electrode layer and electrically connected to the transparent electrode layer, the second electrode including a second electrode pad and a second electrode extension extending from the second electrode pad; and a second reflective layer interposed between the second electrode and the transparent electrode layer, wherein each of the second electrode pad and the second electrode extension covers at least part of the current blocking layer.
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公开(公告)号：US10186638B2
公开(公告)日：2019-01-22
申请号：US15405031
申请日：2017-01-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ye Seul Kim , Kyoung Wan Kim , Sang Hyun Oh , Duk Il Suh , Sang Won Woo , Ji Hye Kim
IPC: H01L33/44 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62 , H01L33/14 , H01L33/24 , F21K9/66 , F21K9/238 , F21K9/232 , F21S41/143 , F21S45/47 , F21V8/00 , G02F1/1335 , H01L27/15 , H01L33/22 , F21S45/43
Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.
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3.发明授权公开(公告)号：US10126831B2
公开(公告)日：2018-11-13
申请号：US15279549
申请日：2016-09-29
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ye Seul Kim , Kyoung Wan Kim , Sang Won Woo , Ji Hye Kim
Abstract: A light emitting diode chip used in devices includes: a substrate including protrusions disposed on an upper surface; a light emitting structure disposed on the substrate and including at least one hole through a second conductive type semiconductor layer and an active layer and partially exposing a first conductive type semiconductor layer; a contact electrode including an optically transparent conductive oxide; a light reflective insulation layer including a distributed Bragg reflector; a first pad electrode electrically connected to the first conductive type semiconductor layer; and a second pad electrode electrically connected to the contact electrode, wherein a portion of an upper surface of the substrate is exposed around the light emitting structure, the light reflective insulation layer adjoins the exposed portion of the upper surface of the substrate around the light emitting structure, and an upper edge of the substrate is spaced from the light reflective insulation layer.
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公开(公告)号：US20170125640A1
公开(公告)日：2017-05-04
申请号：US15405031
申请日：2017-01-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ye Seul Kim , Kyoung Wan Kim , Sang Hyun Oh , Duk Il Suh , Sang Won Woo , Ji Hye Kim
CPC classification number: H01L33/44 , F21K9/232 , F21K9/238 , F21K9/66 , F21S41/143 , F21S45/43 , F21S45/47 , G02B6/0073 , G02F1/133603 , G02F1/133606 , H01L27/156 , H01L33/06 , H01L33/145 , H01L33/22 , H01L33/24 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62
Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.
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公开(公告)号：US20170110629A1
公开(公告)日：2017-04-20
申请号：US15394333
申请日：2016-12-29
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Duk Il Suh , Ye Seul Kim , Kyoung Wan Kim , Sang Won Woo , Ji Hye Kim
CPC classification number: H01L33/24 , H01L24/05 , H01L24/48 , H01L33/145 , H01L33/22 , H01L33/38 , H01L33/382 , H01L33/387 , H01L33/42 , H01L2224/48091 , H01L2224/48453 , H01L2224/48465 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: The light emitting element is provided to comprise: a first conductive type semiconductor layer; a mesa; a current blocking layer; a transparent electrode; a first electrode pad and a first electrode extension; a second electrode pad and a second electrode extension; and an insulation layer partially located on the lower portion of the first electrode, wherein the mesa includes at least one groove formed on a side thereof, the first conductive type semiconductor layer is partially exposed through the groove, the insulation layer includes an opening through which the exposed first conductive type semiconductor layer is at least partially exposed, the first electrode extension includes extension contact portions in contact with the first conductive type semiconductor layer through an opening, and the second electrode extension includes an end with a width different from the average width of the second electrode extension.
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Patent Agency Ranking
公开(公告)号：US20150076446A1
公开(公告)日：2015-03-19
申请号：US14385113
申请日：2013-02-27
Applicant: Seoul Viosys Co, Ltd.
Inventor： Duk II Suh , Kyoung Wan Kim , Yeo Jin Yoon , Ji Hye Kim
CPC classification number: H01L33/24 , H01L33/0025 , H01L33/0075 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/382 , H01L33/42 , H01L2933/0016 , H01L2933/0058
Abstract: Disclosed are a light emitting diode and a method of fabricating the same. The light emitting diode includes a GaN substrate having a plurality of through-holes; a GaN-based semiconductor stack structure placed on the substrate and including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; and a first electrode electrically connected to the first conductive-type semiconductor layer via the through-holes. The light emitting diode can reduce crystal defects and prevent reduction in light emitting area.
Abstract translation: 公开了一种发光二极管及其制造方法。 发光二极管包括具有多个通孔的GaN衬底; GaN基半导体堆叠结构，其放置在基板上并且包括第一导电型半导体层，有源层和第二导电型半导体层; 以及经由所述通孔与所述第一导电型半导体层电连接的第一电极。 发光二极管可以减少晶体缺陷并防止发光面积的减少。
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公开(公告)号：US10069038B2
公开(公告)日：2018-09-04
申请号：US14732455
申请日：2015-06-05
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Sum Geun Lee , Kyung Wan Kim , Yeo Jin Yoon , Duk Il Suh , Ji Hye Kim
IPC: H01L27/15 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/22 , H01L33/20 , H01L33/32 , H01L33/00 , H01L33/10
Abstract: Provided are a substrate having concave-convex patterns, a light-emitting diode (LED) including the substrate, and a method of fabricating the LED. The LED includes a substrate, and concave-convex patterns disposed in an upper surface of the substrate and having convexes and concaves defined by the convexes. Unit light-emitting device having a first conductive semiconduct or layer, an active layer, and a second conductive semiconductor layer disposed on the substrate in sequence is present.
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8.发明申请SUBSTRATE HAVING CONCAVE-CONVEX PATTERN, LIGHT-EMITTING DIODE INCLUDING THE SUBSTRATE, AND METHOD FOR FABRICATING THE DIODE 审中-公开具有凹凸图案的基板，包括基板的发光二极管以及用于制造二极管的方法公开(公告)号：US20140231748A1
公开(公告)日：2014-08-21
申请号：US14348005
申请日：2012-09-28
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Sum Geun Lee , Kyung Wan Kim , Yeo Jin Yoon , Duk II Suh , Ji Hye Kim
CPC classification number: H01L33/20 , H01L27/153 , H01L33/007 , H01L33/06 , H01L33/10 , H01L33/14 , H01L33/16 , H01L33/22 , H01L33/32
Abstract: Provided are a substrate having concave-convex patterns, a light-emitting diode (LED) including the substrate, and a method of fabricating the LED. The LED includes a substrate, and concave-convex patterns disposed in an upper surface of the substrate and having convexes and concaves defined by the convexes. Unit light-emitting device having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer disposed on the substrate in sequence is present.
Abstract translation: 提供具有凹凸图案的基板，包括该基板的发光二极管（LED）以及制造该LED的方法。 LED包括基板和设置在基板的上表面中并具有由凸部限定的凸起和凹部的凹凸图案。 存在具有依次设置在基板上的第一导电半导体层，有源层和第二导电半导体层的单元发光器件。
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公开(公告)号：US20180135809A1
公开(公告)日：2018-05-17
申请号：US15852704
申请日：2017-12-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Ye Seul Kim , Kyoung Wan Kim , Sang Won Woo , Ji Hye Kim
IPC: F21K9/232 , G06F1/16 , H01L25/075 , H01L33/00 , H01L33/06 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/62 , H05K1/18
CPC classification number: F21K9/232 , F21Y2107/70 , G06F1/1662 , H01L25/0753 , H01L33/0033 , H01L33/0095 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/42 , H01L33/46 , H01L33/62 , H01L2224/73204 , H01L2933/0016 , H01L2933/0025 , H05K1/189 , H05K2201/10106
Abstract: A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; at least one groove disposed on a side surface of the mesa forming a concave region; an extension electrode forming ohmic contact with the first conductive type semiconductor layer in the concave region; an insulation layer covering the extension electrode, the first conductive type semiconductor layer, and the mesa, and including at least one first opening exposing the extension electrode and a second opening; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening.
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公开(公告)号：US20170108173A1
公开(公告)日：2017-04-20
申请号：US15348192
申请日：2016-11-10
Applicant: Seoul Viosys Co., Ltd.
Inventor： Ye Seul KIM , Kyoung Wan Kim , Snag Won Woo , Ji Hye Kim
IPC: F21K9/232 , H01L33/06 , H01L33/46 , H01L33/38 , F21S4/24 , H01L33/42 , H01L33/00 , H01L25/075 , H05K1/18 , H01L33/32 , H01L33/62
CPC classification number: F21K9/232 , F21Y2107/70 , G06F1/1662 , H01L25/0753 , H01L33/0033 , H01L33/0095 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/42 , H01L33/46 , H01L33/62 , H01L2224/73204 , H01L2933/0016 , H01L2933/0025 , H05K1/189 , H05K2201/10106
Abstract: A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer including at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening. The first opening of the insulation layer includes a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.
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