公开(公告)号：US07611926B2

公开(公告)日：2009-11-03

申请号：US12040775

申请日：2008-02-29

申请人： Naohide Takamoto ,  Sadahito Misumi ,  Takeshi Matsumura ,  Yasuhiro Amano ,  Masami Oikawa ,  Tsubasa Miki

发明人： Naohide Takamoto ,  Sadahito Misumi ,  Takeshi Matsumura ,  Yasuhiro Amano ,  Masami Oikawa ,  Tsubasa Miki

IPC分类号： H01L21/58 ,  H01L23/14

CPC分类号： H01L24/83 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2224/85001 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/0635 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.

摘要翻译： 本发明的热固性芯片接合薄膜是用于制造半导体器件的热固性芯片接合薄膜，其以主要成分为5〜15重量％的热塑性树脂成分和45〜55重量％的热硬化性树脂 并且在热固化膜之前，在100℃下具有400Pa.s以上且2500Pa·s以下的熔融粘度。

公开(公告)号：US20100219507A1

公开(公告)日：2010-09-02

申请号：US12279633

申请日：2007-02-15

申请人： Sadahito Misumi ,  Takeshi Matsumura ,  Naohide Takamoto ,  Tsubasa Miki

发明人： Sadahito Misumi ,  Takeshi Matsumura ,  Naohide Takamoto ,  Tsubasa Miki

IPC分类号： H01L23/00 ,  B32B7/12 ,  H01L21/78

CPC分类号： H01L24/29 ,  C09J7/28 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/36 ,  C09J2203/326 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/3011 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/3512

摘要： According to the invention, a process for producing a semiconductor device using an adhesive sheet for a spacer, comprising preparing an adhesive sheet having a spacer layer provided with an adhesive layer on at least one surface thereof as the adhesive sheet for a spacer, a step of sticking the adhesive sheet for a spacer onto a dicing sheet with the adhesive layer as a sticking surface, a step of dicing the adhesive sheet for a spacer to form a chip-shaped spacer provided with the adhesive layer, a step of peeling the spacer from the dicing sheet together with the adhesive layer, and a step of fixing the spacer onto an adherend with the adhesive layer interposed therebetween.

摘要翻译： 根据本发明，一种使用间隔物用粘合片的半导体器件的制造方法，其特征在于，在其至少一个面上制备具有间隔层的粘合片作为间隔物的粘合片， 将用于间隔物的粘合剂片粘附到具有粘合剂层作为粘着表面的切割片上，切割用于间隔物的粘合片以形成设置有粘合剂层的芯片形间隔物的步骤，剥离间隔物的步骤 从切割片与粘合剂层一起，以及将间隔物固定在粘合剂层上的粘合剂层之间的步骤。

公开(公告)号：US20080213943A1

公开(公告)日：2008-09-04

申请号：US12040775

申请日：2008-02-29

申请人： Naohide Takamoto ,  Sadahito Misumi ,  Takeshi Matsumura ,  Yasuhiro Amano ,  Masami Oikawa ,  Tsubasa Miki

发明人： Naohide Takamoto ,  Sadahito Misumi ,  Takeshi Matsumura ,  Yasuhiro Amano ,  Masami Oikawa ,  Tsubasa Miki

IPC分类号： H01L21/58 ,  H01B1/12

CPC分类号： H01L24/83 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2224/85001 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/0635 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.

摘要翻译： 本发明的热固性芯片接合薄膜是用于制造半导体器件的热固性芯片接合薄膜，其以主要成分为5〜15重量％的热塑性树脂成分和45〜55重量％的热硬化性树脂 并且在热固化膜之前，在100℃下具有400Pa.s以上且2500Pa·s以下的熔融粘度。

公开(公告)号：US20080182095A1

公开(公告)日：2008-07-31

申请号：US11931168

申请日：2007-10-31

申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B32B5/02 ,  B32B7/10 ,  B32B3/10

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/21 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/249962

摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.

摘要翻译： 本发明提供了一种水射流激光切割用粘合片，其特征在于，包括层叠在基膜上的粘合剂层，其中，所述基膜由纤维形成的网构成。 根据本发明的喷水激光切割用粘合片，使用由网状构成的膜作为基膜，以确保穿孔尺寸和开口面积比无纺布和穿孔片材相对大，从而使其成为可能 在喷水激光切割期间保持对源自液体流的液体的稳定的渗透性，并且提供允许极薄的半导体晶片或材料被加工同时防止芯片脱落或缺陷如IC部件中的破裂和碎裂的粘合片， 芯片等。

公开(公告)号：US20080108262A1

公开(公告)日：2008-05-08

申请号：US11931124

申请日：2007-10-31

申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

IPC分类号： D03D9/00 ,  B32B7/00

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  B26F3/004 ,  C09J7/21 ,  C09J7/22 ,  C09J2201/20 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T442/10

摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 μm to 30 μm. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage. The ability to improve the adhesion between the base film and the adhesive layer also makes it possible to prevent the separation of the adhesive form the base film and the adhesion of the adhesion on the material being processed when picked up after dicing.

摘要翻译： 本发明提供一种水喷射激光切割用粘合片，其特征在于，具有层叠在平均开口直径为5〜30μm的基底膜上的粘合剂层。 根据本发明的粘合片，使用具有一定尺寸的平均开口直径的基膜，从而确保对来自液体流的液体的更好的渗透性，并且防止被处理的材料被液体分离 从粘合片。 另外，相对低的平均开口直径使得可以控制基膜的表面上的波纹并保持表面平坦，导致对被处理材料的更好的附着力，并确保在切割阶段期间确保正在加工的材料 。 提高基膜和粘合剂层之间的粘合力的能力也使得可以防止粘合剂从基膜剥离，以及在切割后拾取时对待处理材料的粘合的粘附。

公开(公告)号：US20080057253A1

公开(公告)日：2008-03-06

申请号：US11892567

申请日：2007-08-24

申请人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B65D65/28 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/20 ,  C09J2201/20 ,  C09J2203/326 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2423/006 ,  C09J2433/00 ,  H01L2221/68327 ,  Y10T428/15 ,  Y10T428/28 ,  Y10T428/2852

摘要： An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and said adhesive sheet has an adhesive strength of at least 1.5 N/20 mm.

摘要翻译： 一种用于水射流激光切割的粘合片，包括层压在基膜上的粘合剂层，其中构成粘合剂层的粘合剂是能量辐射固化型粘合剂，并且所述粘合片具有至少1.5N / 20mm的粘合强度 。

公开(公告)号：US20110151252A1

公开(公告)日：2011-06-23

申请号：US13061011

申请日：2009-08-20

申请人： Toshio Shintani ,  Akiyoshi Yamamoto ,  Tsubasa Miki

发明人： Toshio Shintani ,  Akiyoshi Yamamoto ,  Tsubasa Miki

IPC分类号： C09J133/08

CPC分类号： C09J4/06 ,  C08F220/06 ,  C08K3/105 ,  C08K3/16 ,  C08K5/098 ,  C08L71/02 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2471/00 ,  Y10T428/2891

摘要： An adhesive tape or sheet comprises an adhesive layer which contains 0.3 to 10 parts by weight of an polyether polyol compound, and 0.005 to 2 parts by weight of at least one alkali metal salt for 100 parts by weight of an acrylic adhesive which is formed with a copolymer of methyl acrylate monomer, ethyl acrylate monomer, or methyl acrylate monomer and ethyl acrylate monomer, acrylate monomer, and 2-ethylhexyl acrylate monomer.

摘要翻译： 粘合带或片材包含含有0.3-10重量份聚醚多元醇化合物的粘合剂层和100重量份丙烯酸粘合剂0.005至2重量份的碱金属盐，该丙烯酸粘合剂形成有 丙烯酸甲酯单体，丙烯酸乙酯单体或丙烯酸甲酯单体和丙烯酸乙酯单体，丙烯酸酯单体和丙烯酸2-乙基己酯单体的共聚物。

公开(公告)号：US20090311474A1

公开(公告)日：2009-12-17

申请号：US12307882

申请日：2008-04-15

申请人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

发明人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

IPC分类号： B32B3/10

CPC分类号： H01L21/67132 ,  C09J7/20 ,  C09J2201/20 ,  C09J2205/31 ,  H01L21/67092 ,  Y10T428/24331

摘要： An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.

摘要翻译： 本发明的目的是提供一种粘合片，其通过在喷水激光切割期间通过提高液体流中的液体的渗透性而允许芯片，IC部件等被分离，从而防止加工精度 例如通过切片或芯片等的散射而受到损害，并且允许非常薄的半导体晶片或材料被加工。 本发明的喷水激光切割用粘合片包括层压在基膜上的粘合剂层，由网状纤维构成的基膜。

公开(公告)号：US20080057270A1

公开(公告)日：2008-03-06

申请号：US11892616

申请日：2007-08-24

申请人： Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Takatoshi Sasaki ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Takatoshi Sasaki ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B32B3/24

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J4/06 ,  C09J7/241 ,  C09J2201/20 ,  C09J2203/326 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2423/006 ,  C09J2433/00 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/24273

摘要： An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive sheet has perforations, has a porosity of 3 to 90% and has a fracture elongation of at least 100%.

摘要翻译： 一种用于水射流激光切割的粘合片，包括层压在基膜上的粘合剂层，其中粘合片具有穿孔，孔隙率为3-90％，断裂伸长率为至少100％。