公开(公告)号：US20090146314A1

公开(公告)日：2009-06-11

申请号：US12267649

申请日：2008-11-10

申请人： Sadakazu Akaike ,  Atsunori Kajiki ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Sadakazu Akaike ,  Atsunori Kajiki ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H01L23/52

CPC分类号： H05K1/145 ,  H01L23/3128 ,  H01L23/49833 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode.

摘要翻译： 半导体器件包括具有半导体元件连接焊盘的第一布线板; 连接到半导体元件连接焊盘的半导体元件; 以及面对半导体元件和第一布线板的第二布线板，第二布线板电连接到第一布线板。 半导体元件包括被配置为将半导体元件的第一表面和半导体元件的第二表面彼此电连接的电极。 半导体元件的第一表面面向第一布线板。 半导体元件的第二表面面向第二布线板。 第一布线板和第二布线板经由电极彼此电连接。

公开(公告)号：US08208268B2

公开(公告)日：2012-06-26

申请号：US12277905

申请日：2008-11-25

申请人： Atsunori Kajiki ,  Sadakazu Akaike ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Atsunori Kajiki ,  Sadakazu Akaike ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H05K7/00

CPC分类号： H05K1/144 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/09036 ,  H01L2924/00

摘要： A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

摘要翻译： 一种半导体装置，包括：第一电子部件; 第一电路板，包括安装有第一电子部件的第一电子部件安装焊盘; 以及位于所述第一电路板上方的第二电路板，其中所述第一电子部件安装焊盘布置在所述第一电路板的与所述第二电路板相对的第一面上，并且所述第一电路板和所述第二电路板电连接 通过位于第一电路板和第二电路板之间的内部连接端子，并且其中在第二电路板中形成与第一电子部件相对的凹部，以便提供适应第一电子部件的部分的空间。

公开(公告)号：US20060113679A1

公开(公告)日：2006-06-01

申请号：US11288007

申请日：2005-11-28

申请人： Hiroyuki Takatsu ,  Atsunori Kajiki ,  Takashi Tsubota ,  Norio Yamanishi ,  Sadakazu Akaike ,  Akinobu Inoue

发明人： Hiroyuki Takatsu ,  Atsunori Kajiki ,  Takashi Tsubota ,  Norio Yamanishi ,  Sadakazu Akaike ,  Akinobu Inoue

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device includes a semiconductor chip, wirings, a substrate electrically connected to the semiconductor chip via the wirings and a plurality of discrete parts provided on a part of the substrate. The part is located closer to the center of the substrate than a wiring disposing area where the wirings are disposed.

摘要翻译： 半导体器件包括半导体芯片，布线，经由布线电连接到半导体芯片的基板和设置在基板的一部分上的多个分立部件。 该部分比布线布线布置区域更靠近基板的中心。

公开(公告)号：US20080165513A1

公开(公告)日：2008-07-10

申请号：US12000731

申请日：2007-12-17

申请人： Akinobu Inoue ,  Sadakazu Akaike ,  Atsunori Kajiki ,  Yuya Yoshino ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Akinobu Inoue ,  Sadakazu Akaike ,  Atsunori Kajiki ,  Yuya Yoshino ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/186 ,  H01L23/3128 ,  H01L24/14 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13147 ,  H01L2224/134 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/145 ,  H05K3/4614 ,  H05K2201/10234 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/049 ,  Y10T29/49146 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

摘要翻译： 它是如下配置的电子部件内置基板100。 也就是说，电子部件30设置在至少两个板10和20之间。 电子部件30的电极34电连接到板10中的至少一个。 而且，板10和20彼此电连接。 另外，用树脂密封板10和20之间的间隙。 电子部件内置基板100的特征在于，在与另一基板20相对的电子部件30的表面上设置有用于将基板10,20彼此电连接的焊球40。

公开(公告)号：US20080157296A1

公开(公告)日：2008-07-03

申请号：US12000105

申请日：2007-12-07

申请人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

发明人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

摘要翻译： 包装体包括：包括基板的封装主体，安装在基板的第一表面上的电子部件和用于密封电子部件的密封树脂层; 以及用于覆盖所述密封树脂层的屏蔽壳体，所述屏蔽壳体由金属制成并且在横截面视图中具有倒U形，其中所述屏蔽壳体的弯曲部分形成为至少一个 屏蔽壳的端部的一部分朝向与第一表面相反的第二表面弯曲，并且弯曲部分抵靠在第二表面上，使得屏蔽壳附接到基板。

公开(公告)号：US07911042B2

公开(公告)日：2011-03-22

申请号：US12000105

申请日：2007-12-07

申请人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

发明人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

IPC分类号： H01L23/02

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

摘要翻译： 包装体包括：包括基板的封装主体，安装在基板的第一表面上的电子部件和用于密封电子部件的密封树脂层; 以及用于覆盖所述密封树脂层的屏蔽壳体，所述屏蔽壳体由金属制成并且在横截面视图中具有倒U形，其中所述屏蔽壳体的弯曲部分形成为至少一个 屏蔽壳的端部的一部分朝向与第一表面相反的第二表面弯曲，并且弯曲部分抵靠在第二表面上，使得屏蔽壳附接到基板。

公开(公告)号：US20060125077A1

公开(公告)日：2006-06-15

申请号：US11291599

申请日：2005-12-01

申请人： Sadakazu Akaike ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Sadakazu Akaike ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H01L23/48

CPC分类号： H01L22/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.

摘要翻译： 提供了一种半导体器件，其包括半导体芯片，其上安装有半导体芯片的衬底，布置在衬底的第一侧上的安装端子和布置在衬底的第二侧上的测试端子 第二面与衬底的第一侧相对。

公开(公告)号：US20060113642A1

公开(公告)日：2006-06-01

申请号：US11251347

申请日：2005-10-13

申请人： Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi ,  Sadakazu Akaike ,  Akinobu Inoue

发明人： Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi ,  Sadakazu Akaike ,  Akinobu Inoue

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/321 ,  H05K2201/10371 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device is disclosed that includes a substrate, electronic components that are arranged at an electronic components mounting area of the substrate, a ground terminal that is arranged within the electronic components mounting area, transfer molded resin that covers the electronic components while exposing the ground terminal, a shield member that covers the electronic components and is connected to the ground terminal, and conductive adhesive that realizes electrical connection between the ground terminal and the shield member.

摘要翻译： 公开了一种半导体器件，其包括基板，布置在基板的电子部件安装区域的电子部件，布置在电子部件安装区域内的接地端子，在暴露地面的同时覆盖电子部件的传递模塑树脂 端子，覆盖电子元件并连接到接地端子的屏蔽构件，以及实现接地端子和屏蔽构件之间的电连接的导电粘合剂。

公开(公告)号：US20090135575A1

公开(公告)日：2009-05-28

申请号：US12277905

申请日：2008-11-25

申请人： Atsunori KAJIKI ,  Sadakazu Akaike ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Atsunori KAJIKI ,  Sadakazu Akaike ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H05K1/11

CPC分类号： H05K1/144 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/09036 ,  H01L2924/00

摘要： A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

摘要翻译： 一种半导体装置，包括：第一电子部件; 第一电路板，包括安装有第一电子部件的第一电子部件安装焊盘; 以及位于所述第一电路板上方的第二电路板，其中所述第一电子部件安装焊盘布置在所述第一电路板的与所述第二电路板相对的第一面上，并且所述第一电路板和所述第二电路板电连接 通过位于第一电路板和第二电路板之间的内部连接端子，并且其中在第二电路板中形成与第一电子部件相对的凹部，以便提供适应第一电子部件的部分的空间。

公开(公告)号：US07261596B2

公开(公告)日：2007-08-28

申请号：US11318674

申请日：2005-12-27

申请人： Sadakazu Akaike ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Sadakazu Akaike ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Takatsu ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H01R13/648

CPC分类号： H01L23/552 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01R12/7076 ,  H01R13/6585 ,  H01R13/6594 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

摘要翻译： 公开了一种半导体器件，其包括板，设置在板上的接地端子，设置在板上的连接端子，安装在板上的半导体芯片以及电连接到接地端子的屏蔽构件。 半导体芯片，接地端子和连接端子设置在电路板的一侧，屏蔽部件直接设置在电路板的另一面上。