公开(公告)号：US20160105956A1

公开(公告)日：2016-04-14

申请号：US14877291

申请日：2015-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Oh HWANG ,  Kwang Hee KWON ,  Seung Eun LEE ,  Young Kwan LEE ,  Yul Kyo CHUNG ,  Se Rang IM ,  Ki Jung SUNG

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/205 ,  H05K1/115 ,  H05K3/108 ,  H05K2203/054

Abstract: The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member.

Abstract translation: 本发明提供了一种印刷电路板，包括绝缘构件，埋在绝缘构件的底部区域中的第一镀层，埋在绝缘构件的顶部区域中的第二镀层，以及用于将第一镀层 层和第二镀层被埋在绝缘构件的顶部区域和底部区域中的任一个中。

公开(公告)号：US20200243450A1

公开(公告)日：2020-07-30

申请号：US16535421

申请日：2019-08-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyun CHO ,  Young Kwan LEE ,  Young Sik HUR ,  Yun Tae LEE ,  Ho Kwon YOON

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18

Abstract: A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.

公开(公告)号：US20150351231A1

公开(公告)日：2015-12-03

申请号：US14722066

申请日：2015-05-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE ,  Myung Sam KANG ,  Seung Yeop KOOK ,  Kwang Hee KWON ,  Seung Eun LEE ,  Ki Jung SUNG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/48237 ,  H05K1/0209 ,  H05K3/0097 ,  H05K2201/068 ,  H05K2201/09472 ,  H05K2201/10553 ,  H05K2203/0369 ,  H05K2203/1536 ,  Y10T29/49131 ,  Y10T29/49149 ,  H01L2924/014

Abstract: Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like.

Abstract translation: 这里公开了一种电路板，其中金属板设置在耦合到器件的表面上，并且连接焊盘通过金属板的开口部分暴露以与该器件电连接。 电路板可以具有安装在其上的装置，并且该装置的连接端子和电路板的连接焊盘可以通过导线等相互连接。

公开(公告)号：US20160050755A1

公开(公告)日：2016-02-18

申请号：US14824598

申请日：2015-08-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung Sam KANG ,  Young Kwan LEE ,  Seung Eun LEE ,  Seung Yeop KOOK

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/117 ,  H05K3/403 ,  H05K3/421 ,  H05K3/429 ,  H05K2203/072

Abstract: There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.

Abstract translation: 提供了一种印刷电路板，包括：形成通孔的绝缘层; 通孔中形成的通孔; 形成在绝缘层之下并电连接到通孔的第一电路图案; 以及形成在所述绝缘层上以与所述通孔接合的第二电路图案; 其中所述通孔的直径小于所述通孔的直径，以及制造印刷电路板的方法。

公开(公告)号：US20150156865A1

公开(公告)日：2015-06-04

申请号：US14199326

申请日：2014-03-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE ,  Myung Sam KANG ,  Joo Hwan JUNG ,  Ju Hee PARK ,  Seung Yeop KOOK

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2924/13055 ,  H01L2924/15156 ,  H01L2924/18161 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y10T29/49147 ,  H01L2924/00

Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.

Abstract translation: 本文公开了一种用于半导体封装的无芯板及其制造方法。 半导体封装的无芯板包括：支架; 形成在支撑体上的积聚层; 形成在积聚层上的外部连接端子; 以及形成在积聚层上以使外部连接端子露出的阻焊层。

公开(公告)号：US20210183754A1

公开(公告)日：2021-06-17

申请号：US16800201

申请日：2020-02-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Hoon KIM ,  Seung Eun LEE ,  Young Kwan LEE ,  Hak Chun KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/16

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

公开(公告)号：US20160050752A1

公开(公告)日：2016-02-18

申请号：US14691115

申请日：2015-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Myung Sam KANG ,  Seung Eun LEE ,  Young Kwan LEE ,  Seung Yeop KOOK ,  Ki Jung SUNG

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/092 ,  H05K3/007 ,  H05K3/243 ,  H05K3/244 ,  H05K3/30 ,  H05K3/4007 ,  H05K3/4682

Abstract: There are provided a printed circuit board including: an insulation layer; circuit patterns buried in the insulation layer; and a bump pad having a lower part buried in the insulation layer and an upper part protruding upwardly from the insulation layer, and a method of manufacturing the printed circuit board.

Abstract translation: 提供了一种印刷电路板，包括：绝缘层; 埋在绝缘层中的电路图案; 以及具有埋在绝缘层中的下部的凸块和从绝缘层向上突出的上部，以及制造印刷电路板的方法。

公开(公告)号：US20150156891A1

公开(公告)日：2015-06-04

申请号：US14209160

申请日：2014-03-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ki Jung SUNG ,  Myung Sam KANG ,  Joo Hwan JUNG ,  Seung Yeop KOOK ,  Young Kwan LEE

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4673 ,  H05K1/115 ,  H05K3/061 ,  H05K3/4661 ,  H05K2201/0191 ,  Y10T29/49155

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof capable of improving poor inter-layer conduction by increasing inter-layer insulating property and rigidity. The manufacturing method of a printed circuit board includes: laminating a copper foil layer on upper and lower surfaces of an insulating layer; coating an insulating material on a surface of the copper foil layer; forming a circuit layer by etching the copper foil layer; laminating an insulator on the copper foil layer so as to enclose the insulating material and the circuit layer; forming a via in the insulator so as to be communicated with the circuit layer; and forming a circuit pattern on the insulator.

Abstract translation: 这里公开了能够通过增加层间绝缘性和刚性来改善差的层间传导的印刷电路板及其制造方法。 印刷电路板的制造方法包括：在绝缘层的上表面和下表面上层压铜箔层; 在铜箔层的表面上涂覆绝缘材料; 通过蚀刻铜箔层形成电路层; 在铜箔层上层叠绝缘体以包围绝缘材料和电路层; 在绝缘体中形成通孔以与电路层连通; 并在绝缘体上形成电路图案。

公开(公告)号：US20200328160A1

公开(公告)日：2020-10-15

申请号：US16521271

申请日：2019-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Rok KIM ,  Young Sik HUR ,  Young Kwan LEE ,  Jung Hyun CHO ,  Seung Eun LEE

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes: a core structure having first and second surfaces and having first and second through-holes; a first semiconductor chip embedded in the core structure and having first and second contacts disposed on two opposing surfaces thereof, respectively; a first wiring layer on the surface of the core structure and connected to the first contact; a second wiring layer on the second surface of the core structure and connected to the second contact; a chip antenna disposed in the first through-hole; a second semiconductor chip in the second through-hole and having a connection pad; a first redistribution layer on the first surface of the core structure and connected to the connection terminal, the connection pad, and the first wiring layer; an encapsulant encapsulating the chip antenna and the second semiconductor chip; and a second redistribution layer on the encapsulant connecting to the second wiring layer.

公开(公告)号：US20140109934A1

公开(公告)日：2014-04-24

申请号：US13844094

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE

IPC: H05K3/26 ,  B08B7/02 ,  B08B5/04

CPC classification number: H05K3/26 ,  B08B5/04 ,  B08B7/02

Abstract: Disclosed herein are an apparatus for removing particles from a printed circuit board and a method for removing particles from a printed circuit board. The apparatus includes: a vibration generating unit vibrating a printed circuit board; a vacuum sucking unit formed over the printed circuit board and removing the particles from the printed circuit board; and a controlling unit controlling the vibration generating unit and the vacuum sucking unit.

Abstract translation: 本文公开了一种用于从印刷电路板除去颗粒的装置和从印刷电路板上去除颗粒的方法。 该装置包括：振动产生单元振动印刷电路板; 形成在所述印刷电路板上并从所述印刷电路板上除去所述颗粒的真空吸附单元; 以及控制单元，其控制所述振动产生单元和所述真空吸附单元。