公开(公告)号：US06497354B2

公开(公告)日：2002-12-24

申请号：US09899356

申请日：2001-07-05

申请人： Seiji Takahashi ,  Kenichi Otake ,  Takatoshi Ishikawa ,  Makoto Okazaki

发明人： Seiji Takahashi ,  Kenichi Otake ,  Takatoshi Ishikawa ,  Makoto Okazaki

IPC分类号： B23K106

CPC分类号： H01L24/75 ,  B23K20/106 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033

摘要： In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. These mechanics do not lose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

摘要翻译： 在通过推压和振动将部件与基板结合的接合工具中，在喇叭中形成通孔。 粘合部装配到孔的下部，并且接合部嵌入孔的上部，从而通过拧紧外螺纹在孔内部形成密封的内部空间。 通过接合部开放的粘接孔经由内部空间与喇叭的吸引孔连通，能够形成简单结构化的真空附着系统。 这些力学不会失去可拆卸到喇叭的粘附部分的替代性。 结果，可以将附着部作为独立部分（施力端子）进行替换，并且可以提供具有简单结构的真空附着系统的接合装置以及接合工具。

公开(公告)号：US06543669B2

公开(公告)日：2003-04-08

申请号：US10271220

申请日：2002-10-15

申请人： Seiji Takahashi ,  Kenichi Otake ,  Takatoshi Ishikawa ,  Makoto Okazaki

发明人： Seiji Takahashi ,  Kenichi Otake ,  Takatoshi Ishikawa ,  Makoto Okazaki

IPC分类号： B23K106

CPC分类号： H01L24/75 ,  B23K20/106 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033

摘要： In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

公开(公告)号：US5839187A

公开(公告)日：1998-11-24

申请号：US690077

申请日：1996-07-31

申请人： Seiichi Sato ,  Kenichi Otake

发明人： Seiichi Sato ,  Kenichi Otake

IPC分类号： H01L21/60 ,  H01L21/00 ,  H05K13/04 ,  B23P21/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/046 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53478

摘要： An apparatus and a method for mounting a chip make it possible to accomplish quick chip mounting and also to mount multiple different chips on substrates. Three heads are provided around a center rod of a head assembly; they horizontally rotate around the center rod. When the heads rotate horizontally, they are turned 180 degrees vertically by a first bevel gear and a second bevel gear. A nozzle of one of the heads picks up a flip chip from a wafer sheet and rotates 180 degrees horizontally to transfer the flip chip to a transferring head, during which it vertically inverts 180 degrees so as to vertically invert the flip chip. The transferring head receives the flip chip from the head and mounts it on a substrate. According to the type of chips to be mounted, the heads and the transferring head are equipped with nozzles best suited for the type of chips.

摘要翻译： 用于安装芯片的装置和方法使得可以实现快速的芯片安装并且还可以在基板上安装多个不同的芯片。 头部组件的中心杆周围设有三个头部; 它们围绕中心杆水平旋转。 当头部水平旋转时，它们通过第一锥齿轮和第二锥齿轮垂直地转动180度。 其中一个头的喷嘴从晶片片上拾取倒装芯片并水平旋转180度，以将倒装芯片传送到转印头，在该转印头期间，其垂直反转180度，以便垂直倒置倒装芯片。 转印头从头部接收倒装芯片并将其安装在基板上。 根据要安装的芯片的类型，头部和转印头配备有最适合于芯片类型的喷嘴。

公开(公告)号：US6078123A

公开(公告)日：2000-06-20

申请号：US129539

申请日：1998-08-05

申请人： Kei Tanaka ,  Eiichi Fukiharu ,  Yasunori Tanaka ,  Michinobu Tanioka ,  Kenichi Otake ,  Takuo Funaya

发明人： Kei Tanaka ,  Eiichi Fukiharu ,  Yasunori Tanaka ,  Michinobu Tanioka ,  Kenichi Otake ,  Takuo Funaya

IPC分类号： H01L21/60 ,  G01N29/02 ,  G01N29/24 ,  H01L23/12 ,  H03H9/05 ,  H03H9/64 ,  H01L41/08

CPC分类号： H03H9/059 ,  G01N29/022 ,  G01N29/2462 ,  G01N2291/0423 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701

摘要： A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.

摘要翻译： 用于安装SAW（表面声波）器件的结构包括在SAW器件的周边部分填充SAW器件和安装衬底之间的间隙的感光树脂。 整个结构的尺寸基本上与SAW器件的尺寸一样小巧且重量轻。 感光性树脂形成在包括用于连接的焊盘的区域中，以便吸收热应力和易于作用在焊盘上的外来力。 第二树脂可以包围感光性树脂，或者可以与感光性树脂一起设置在层叠结构中，从而提高密封性。 还公开了一种安装SAW器件的方法。

公开(公告)号：US5805422A

公开(公告)日：1998-09-08

申请号：US912001

申请日：1997-08-15

申请人： Kenichi Otake ,  Manabu Bonkohara

发明人： Kenichi Otake ,  Manabu Bonkohara

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02

CPC分类号： H01L23/4985 ,  H05K1/141 ,  H05K1/147 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/056 ,  H05K2201/10734 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/368

摘要： Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.

摘要翻译： 焊球附接到柔性印刷电路板，其形状为能够覆盖IC芯片的至少上表面，侧表面和下表面，并且将柔性印刷电路板放置在 IC芯片。 然后，将柔性印刷电路板折叠在IC芯片的边缘上，并通过粘合片结合到IC芯片的外表面。 此后，将密封树脂注入到IC芯片的上表面和柔性印刷电路板之间的间隙中并固化，从而完成半导体封装。