公开(公告)号：US20070235887A1

公开(公告)日：2007-10-11

申请号：US10550548

申请日：2004-10-13

申请人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

发明人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

IPC分类号： H01L23/52 ,  H01B5/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/45683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48639 ,  H01L2224/48839 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01204 ,  H01L2924/01206 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01008 ,  H01L2924/01016 ,  H01L2924/01001 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00015 ,  H01L2924/01076 ,  H01L2924/01006

摘要： A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/μm2 but not greater than 0.165 mN/μm2; or 4. the Vickers hardness of the coating layer is 300 or lower.

摘要翻译： 一种接合线，其包括芯和形成在所述芯上的涂层，其中所述涂层由具有比所述芯更高的熔点的金属形成，并且还具有以下特征中的至少一个; 当芯熔化时与涂层的湿接触角不小于20度; 2.当接合线悬挂时，其端部接触水平表面，并在端部上方15厘米处切割，因此落在水平面上，所形成的弧的曲率半径为35毫米或更大; 0.2％的屈服强度不小于0.115mN / m 2，但不大于0.165mN / m 2。 或4.涂层的维氏硬度为300以下。

公开(公告)号：US20050151253A1

公开(公告)日：2005-07-14

申请号：US10508052

申请日：2003-03-24

申请人： Tsuyoshi Nonaka ,  Masanori Ioka ,  Shingo Kaimori ,  Masato Fukagaya

发明人： Tsuyoshi Nonaka ,  Masanori Ioka ,  Shingo Kaimori ,  Masato Fukagaya

IPC分类号： H01L23/49 ,  H01L23/48

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/45683 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/01016 ,  H01L2924/01004 ,  H01L2924/01047 ,  H01L2924/0104 ,  H01L2924/01008 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01001 ,  H01L2924/00015 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/01006

摘要： A bonding wire comprising a core mainly consisting of copper, a different metal layer formed of a metal other than copper and formed on the core, and a coating layer formed of an oxidation-resistant metal having a melting point higher than that of copper and formed on the different metal layer, from which balls having the shape of a true sphere in a wide ball diameter range can be formed stably, which can be produced without causing the deterioration of a plating solution at the time of plating, and in which the adhesiveness between the coating layer and the core thereof is excellent; and an integrated circuit device using the bonding wire are provided.

摘要翻译： 一种接合线，包括主要由铜组成的芯，由铜以外的金属形成的不同的金属层，形成在芯上，以及由熔点高于铜形成的抗氧化金属形成的涂层，形成 在不同的金属层上，可以稳定地形成具有宽球直径范围内的真球形状的球，其可以在不导致镀覆时的电镀液的劣化的情况下制造，并且其中的粘附性 涂层和其核心之间是优异的; 并提供使用接合线的集成电路器件。

公开(公告)号：US06783921B2

公开(公告)日：2004-08-31

申请号：US10059107

申请日：2002-01-31

申请人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Satoshi Koshimuta ,  Masato Tsurugasaki

发明人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Satoshi Koshimuta ,  Masato Tsurugasaki

IPC分类号： G03C176

CPC分类号： H05K3/002 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Disclosed is an etching method of a laminated assembly having a metal layer and a non-thermoplastic polyimide layer bonded together via thermoplastic polyimide, which comprises using an etchant at least containing an alkali metal hydroxide, water and oxyalkylamine, wherein the concentrations of the alkali metal hydroxide (X weight %) and of the water (Y weight %) have relationships represented by coordinate points present within a region (inclusive of boundary lines) defined by the following expressions [1] and [2]: Y=(½)X (provided that 7≦X≦45)  [1] Y=({fraction (5/20)})X+17.5 (provided that 7≦X≦45)  [2] provided that X and Y are defined based on the total weight of the alkali metal hydroxide, water and oxyalkylamine expressed as 100.

摘要翻译： 公开了一种层压组件的蚀刻方法，其具有通过热塑性聚酰亚胺粘合在一起的金属层和非热塑性聚酰亚胺层，其包括使用至少含有碱金属氢氧化物，水和氧烷基胺的蚀刻剂，其中碱金属 氢氧化物（X重量％）和水（Y重量％）具有由以下表达式[1]和[2]限定的区域（包括边界线）内存在的坐标点表示的关系：X和Y为 基于表示为100的碱金属氢氧化物，水和氧化烷基胺的总重量定义。

公开(公告)号：US20120048598A1

公开(公告)日：2012-03-01

申请号：US13318304

申请日：2010-03-26

申请人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

发明人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC分类号： H05K1/00 ,  C09J133/14 ,  C09J171/10 ,  C09J11/02 ,  B32B27/38 ,  C09J163/00

CPC分类号： H05K3/386 ,  C08G2650/56 ,  C08L33/068 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J171/02 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2471/00 ,  C09J2477/00 ,  H05K1/0393 ,  Y10T428/287

摘要： Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

摘要翻译： 提供含有环氧树脂和/或苯氧基树脂的粘合性树脂组合物; 通过使具有环氧基的单体和可与具有环氧基的单体共聚的烯键式不饱和单体共聚得到的含环氧基共聚物; 热塑性树脂; 和固化剂，其中使用重均分子量为5,000至小于100,000且每环氧当量重量为3,500g / eq或更低的共聚物作为含环氧基的共聚物。 粘合性树脂组合物能够提供具有良好的聚合物成分的相容性，阻燃性好，为无卤素，且具有良好的储存稳定性的一部分型粘合剂溶液。 还提供了使用粘合剂树脂组合物的层压体和柔性印刷线路板。

公开(公告)号：US20110303439A1

公开(公告)日：2011-12-15

申请号：US13203209

申请日：2010-01-18

申请人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

发明人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC分类号： H05K1/02 ,  C09J163/02 ,  C09J11/06 ,  C09J167/00 ,  C09J177/00 ,  B32B7/12 ,  C09J185/02

CPC分类号： C09J177/00 ,  C08G59/304 ,  C08G59/3272 ,  C08K5/0066 ,  C08K5/3437 ,  C08K5/353 ,  C08K5/5399 ,  C08L63/00 ,  C08L67/00 ,  C08L77/00 ,  C08L2666/22 ,  C09J7/35 ,  C09J163/00 ,  C09J167/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2477/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0129 ,  Y10T428/287

摘要： Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

摘要翻译： 提供一种无卤素的粘合剂组合物，并且可以在不损害粘合性或焊料耐热性的情况下满足阻燃性，以及层压体和使用其的柔性印刷线路板。 粘合剂树脂组合物含有环氧树脂; 热塑性树脂; 苯并恶嗪化合物; 无卤阻燃剂; 以及固化剂，其中至少一种环氧树脂和热塑性树脂含有含磷树脂，并且粘合剂树脂组合物的固体部分中的磷含量为2.5质量％以上。 优选使用含磷环氧树脂作为环氧树脂，使用含有10〜70质量％的含磷聚酯的热塑性树脂作为热塑性树脂，苯并恶嗪的量为5〜25重量份 质量和无卤阻燃剂的量为每100份树脂1至30质量份。

公开(公告)号：US08012321B2

公开(公告)日：2011-09-06

申请号：US12280721

申请日：2007-02-27

申请人： Moriyasu Ichino ,  Toshifumi Hosoya ,  Shingo Kaimori ,  Takahiko Kitamura

发明人： Moriyasu Ichino ,  Toshifumi Hosoya ,  Shingo Kaimori ,  Takahiko Kitamura

IPC分类号： G01N27/327

CPC分类号： G01N33/48785

摘要： In a biosensor system and its measuring instrument which determine that a biosensor chip has been inserted and measure biological information on a biological material supplied to the biosensor chip, the size of the biosensor chip is made small, the reliability of the measuring instrument is improved, and the product life becomes long. In addition, a measurement error of the biological information is suppressed in measuring the biological information by inserting a biosensor chip, which has a sensor electrode formed of an electrode member with an electric resistance value higher than a conductive metal, into the measuring instrument.

摘要翻译： 在生物传感器系统及其测量仪器中，确定生物传感器芯片已被插入，并且测量生物传感器芯片上提供的生物材料上的生物信息，生物传感器芯片的尺寸变小，测量仪器的可靠性得到改善， 产品寿命长。 此外，通过将具有电阻值高于导电金属的电极部件形成的传感器电极的生物传感器芯片插入到测量仪器中来测量生物信息，抑制了生物信息的测量误差。

公开(公告)号：US20090123335A1

公开(公告)日：2009-05-14

申请号：US11885945

申请日：2006-10-25

申请人： Hideaki Nakamura ,  Masao Gotoh ,  Tomoko Ishikawa ,  Isao Karube ,  Toshifumi Hosoya ,  Shingo Kaimori ,  Moriyasu Ichino

发明人： Hideaki Nakamura ,  Masao Gotoh ,  Tomoko Ishikawa ,  Isao Karube ,  Toshifumi Hosoya ,  Shingo Kaimori ,  Moriyasu Ichino

IPC分类号： G01N31/22

CPC分类号： C12Q1/001 ,  G01N27/3272 ,  G01N33/5438

摘要： It is intended to provide a sensor chip that enables detection of a deterioration state of a reagent applied on a reaction portion when measuring a concentration of a measurement object substance and a sensor system that enables a correct measurement by using the sensor chip for detecting the reagent deterioration state. A sensor chip including two substrates opposed to each other, a spacer layer sandwiched between the substrates, a multiple reaction portions provided in the spacer layer, and detection electrode units disposed on surfaces of the substrates facing to the spacer layer and exposed to the reaction portions, wherein an identical reagent A is applied on two or more of the reaction portions, and another reagent B that reacts with the reagent A is applied on at least one of the two reaction portions and a sensor system including the sensor chip and a measurement unit for comparing current values from the two or more reaction portions on which the identical reagent A is applied.

摘要翻译： 本发明旨在提供一种传感器芯片，其能够检测在测量对象物质的浓度的反应部分上施加的试剂的劣化状态，以及能够通过使用用于检测试剂的传感器芯片进行正确测量的传感器系统 劣化状态。 一种传感器芯片，包括彼此相对的两个基板，夹在基板之间的间隔层，设置在间隔层中的多个反作用部分和设置在面向间隔层的基板的表面上并暴露于反应部分的检测电极单元 其中相同的试剂A施加在两个或更多个反应部分上，另一个与试剂A反应的试剂B施加在两个反应部分中的至少一个上，以及包括传感器芯片和测量单元的传感器系统 用于比较来自施加相同试剂A的两个或更多个反应部分的电流值。

公开(公告)号：US20090050986A1

公开(公告)日：2009-02-26

申请号：US11795903

申请日：2006-01-23

申请人： Shingo Kaimori ,  Toshifumi Hosoya ,  Moriyasu Ichino ,  Hideaki Nakamura ,  Masao Gotoh ,  Fumiyo Kurusu ,  Tomoko Ishikawa ,  Isao Karube

发明人： Shingo Kaimori ,  Toshifumi Hosoya ,  Moriyasu Ichino ,  Hideaki Nakamura ,  Masao Gotoh ,  Fumiyo Kurusu ,  Tomoko Ishikawa ,  Isao Karube

IPC分类号： H01L29/00 ,  H01L21/50

CPC分类号： B01J19/0046 ,  B01J2219/00518 ,  B01J2219/00527 ,  B01J2219/00533 ,  B01J2219/00621 ,  B01J2219/00657 ,  B01J2219/0072 ,  B01J2219/00725

摘要： A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.

摘要翻译： 一种用于制造具有衬底，覆盖层，插入在衬底和覆盖层之间的间隔层的传感器芯片的方法和设置在间隔层中的中空反应部分，该方法包括以下步骤：将两个或更多个粘合剂 或将带粘合到要形成多个基底的片上或多个基底上，从而形成间隔层; 并且从带之间的一个或多个间隙形成中空反应部分，从而可以减小中空反应部分的体积变化或位置位移。 可通过该方法制造的传感器芯片。

公开(公告)号：US20120043118A1

公开(公告)日：2012-02-23

申请号：US13318300

申请日：2010-03-26

申请人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syoung Asai ,  Takuma Yoshisaka ,  Naota Uenishi

发明人： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syoung Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC分类号： H05K1/02 ,  C09J163/00 ,  C08K5/5399 ,  B32B7/12

CPC分类号： H05K3/386 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B27/288 ,  B32B27/302 ,  B32B27/36 ,  B32B27/38 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2457/08 ,  C08G2650/56 ,  C08K5/0066 ,  C08L25/04 ,  C08L33/066 ,  C08L63/00 ,  C08L77/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J7/35 ,  C09J125/14 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2477/00 ,  H05K1/0393 ,  Y10T428/287

摘要： Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

摘要翻译： 提供含有（A）环氧树脂和/或苯氧基树脂的粘合剂树脂组合物; （B）含有具有环氧基的单体单元和苯乙烯单体单元的含环氧基苯乙烯共聚物; （C）热塑性树脂; 和（D）固化剂，其中含有环氧基的苯乙烯共聚物（B）相对于粘合性树脂组合物中含有的树脂成分的总量的含有率为3质量％〜25质量％。 粘合剂树脂组合物是具有良好阻燃性和高剥离强度的无卤素粘合剂组合物。 还提供了使用粘合剂树脂组合物的层压体和柔性印刷线路板。

公开(公告)号：US20100004559A1

公开(公告)日：2010-01-07

申请号：US12519916

申请日：2007-12-17

申请人： Tsuyoshi Fujimura ,  Hideaki Nakamura ,  Masao Gotoh ,  Isao Karube ,  Tomoko Ishikawa ,  Takahiko Kitamura ,  Shingo Kaimori ,  Hiroto Nakajima ,  Hiroshi Hayami ,  Toshifumi Hosoya

发明人： Tsuyoshi Fujimura ,  Hideaki Nakamura ,  Masao Gotoh ,  Isao Karube ,  Tomoko Ishikawa ,  Takahiko Kitamura ,  Shingo Kaimori ,  Hiroto Nakajima ,  Hiroshi Hayami ,  Toshifumi Hosoya

IPC分类号： A61B5/151

CPC分类号： A61B5/1519 ,  A61B5/150022 ,  A61B5/150213 ,  A61B5/150358 ,  A61B5/150412 ,  A61B5/150503 ,  A61B5/150549 ,  A61B5/150618 ,  A61B5/150717 ,  A61B5/15113 ,  A61B5/15117

摘要： A biosensor cartridge capable of making the collected amount of a sample required for measurement into a small quantity to reduce a user's burden, and easily collecting and measuring a sample of a puncture hole without requiring the operation of bringing a sample collection opening close to the puncture hole is provided. When one end portion of biosensor chip is pushed against subject, elastic body is compressed, and puncturing tool can protrude and perform puncturing. Additionally, if a pushing force is weakened, puncturing tool is extracted from subject by the restoring force of elastic body, and blood (sample) flows out of the puncture hole. In this case, since the puncture hole, and sample collection opening provided at biosensor chip are contained in enclosed half-open space formed by elastic body, even a small amount of blood (sample) can also be easily collected. Additionally, elastic body is formed with a groove which forms a ventilation passage, so that enclosed half-open space can be opened to the atmosphere.

摘要翻译： 一种生物传感器盒，其能够将少量测量所需的样本的收集量减少到用户的负担，并且容易地收集和测量穿孔的样本，而不需要使样本收集开口靠近穿刺的操作 提供孔。 当生物传感器芯片的一个端部被压住物体时，弹性体被压缩，并且穿刺工具可以伸出并进行穿刺。 此外，如果推力减弱，则通过弹性体的恢复力从被检体取出穿刺工具，血液（样品）从穿刺孔流出。 在这种情况下，由于设置在生物传感器芯片上的穿刺孔和样本收集开口包含在由弹性体形成的封闭半开放空间中，所以即使少量的血液（样品）也可以容易地收集。 此外，弹性体形成有形成通风通道的槽，使得封闭的半开放空间可以打开到大气。