公开(公告)号：US20130236737A1

公开(公告)日：2013-09-12

申请号：US13885278

申请日：2011-11-16

申请人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  H01L31/02

CPC分类号： B32B15/012 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/40 ,  C23C8/02 ,  C23C8/24 ,  C23C14/14 ,  C23C18/125 ,  C23C18/1254 ,  C23C18/1651 ,  C23C28/321 ,  C23C28/34 ,  C23C28/345 ,  C25D3/04 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/0614 ,  C25D11/08 ,  H01L31/02 ,  H01L31/0392 ,  H01L31/03923 ,  H01L31/03925 ,  H01L51/0096 ,  Y02E10/541 ,  Y10T428/12438

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al7Cu2Fe intermetallic compound or FeAl3 based intermetallic compounds.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 包含Fe和Al并且形成在钢层上的合金层; 以及配置在所述合金层上的含Al金属层，其中，当所述含Al金属层的表面的切割面线被定义为轮廓曲线时，将所述轮廓曲线的近似直线定义为 轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10um的最大点，合金层的厚度为0.1〜8μm，合金层含有Al7Cu2Fe金属间化合物 化合物或FeAl3基金属间化合物。

公开(公告)号：US09902134B2

公开(公告)日：2018-02-27

申请号：US13885309

申请日：2011-11-16

申请人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  C23C2/02 ,  C23C2/12 ,  C23C2/28 ,  B21D39/00 ,  C23C28/02 ,  H01L31/0392 ,  C23C2/26 ,  C22C1/02

CPC分类号： B32B15/012 ,  B21D39/00 ,  C22C1/02 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C28/023 ,  H01L31/03926 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/12049 ,  Y10T428/12069 ,  Y10T428/12076

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of μm and a thickness of the Al-containing metal layer is T in units of μm, the granular alloys satisfy x≦0.5T.

公开(公告)号：US09296180B2

公开(公告)日：2016-03-29

申请号：US13885278

申请日：2011-11-16

申请人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： H01L51/00 ,  B32B15/01 ,  C23C2/12 ,  C23C2/26 ,  H01L31/0392 ,  H01L31/02 ,  C23C2/02 ,  C25D3/04 ,  C23C8/24 ,  C23C14/14 ,  C23C18/12 ,  C23C28/00 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/06 ,  C23C18/16 ,  C23C2/40 ,  C23C8/02 ,  C25D11/08

CPC分类号： B32B15/012 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/40 ,  C23C8/02 ,  C23C8/24 ,  C23C14/14 ,  C23C18/125 ,  C23C18/1254 ,  C23C18/1651 ,  C23C28/321 ,  C23C28/34 ,  C23C28/345 ,  C25D3/04 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/0614 ,  C25D11/08 ,  H01L31/02 ,  H01L31/0392 ,  H01L31/03923 ,  H01L31/03925 ,  H01L51/0096 ,  Y02E10/541 ,  Y10T428/12438

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al7Cu2Fe intermetallic compound or FeAl3 based intermetallic compounds.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 包含Fe和Al并且形成在钢层上的合金层; 以及配置在所述合金层上的含Al金属层，其中，当所述含Al金属层的表面的切割面线被定义为轮廓曲线时，将所述轮廓曲线的近似直线定义为 轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10μm的最大点，合金层的厚度为0.1〜8μm，合金层含有Al7Cu2Fe金属间化合物 化合物或FeAl3基金属间化合物。

公开(公告)号：US20130236734A1

公开(公告)日：2013-09-12

申请号：US13885309

申请日：2011-11-16

申请人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  B21D39/00

CPC分类号： B32B15/012 ,  B21D39/00 ,  C22C1/02 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C28/023 ,  H01L31/03926 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/12049 ,  Y10T428/12069 ,  Y10T428/12076

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of μm and a thickness of the Al-containing metal layer is T in units of μm, the granular alloys satisfy x≦0.5T.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 设置在钢层上的含Al金属层; 以及存在于钢层和含Al金属层之间的界面中的多个粒状合金，其中，当含Al金属层的表面的切割线被定义为轮廓曲线和近似直线时 轮廓曲线被定义为轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10um的最大点，并且其中，当粒状合金的等效球体直径 以x为单位，m为单位，含有Al的金属层的厚度为T为单位为m，粒状合金满足x@0.5T。

公开(公告)号：US20090304545A1

公开(公告)日：2009-12-10

申请号：US12281430

申请日：2007-03-08

申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

IPC分类号： C22C13/02 ,  C22C13/00

CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。

公开(公告)号：US08501088B2

公开(公告)日：2013-08-06

申请号：US12345942

申请日：2008-12-30

申请人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： C22C13/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463

摘要： To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.

摘要翻译： 为了提供用于焊料合金的熔融温度低于250℃的焊料合金，焊球和具有用于与母板等连接的焊料凸块的电子部件，实现高的耐跌落冲击强度 在移动设备等中需要。 使用焊料合金，其由不低于0.1质量ppm的硼和不大于200质量ppm的硼组成，剩余部分包含基本上不小于40质量％的Sn，其中其熔化温度低于250℃ C。

公开(公告)号：US08562906B2

公开(公告)日：2013-10-22

申请号：US12281430

申请日：2007-03-08

申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

IPC分类号： C22C13/00 ,  C22C13/02

CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。

公开(公告)号：US20090196789A1

公开(公告)日：2009-08-06

申请号：US12345942

申请日：2008-12-30

申请人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Takayuki Kobayashi ,  Tsutomu Sasaki ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： C22C28/00 ,  C22C11/06 ,  C22C13/02 ,  C22C13/00 ,  C22C12/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463

摘要： To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.

摘要翻译： 为了提供用于焊料合金的熔融温度低于250℃的焊料合金，焊球和具有用于与母板等连接的焊料凸块的电子部件，实现高的耐跌落冲击强度 在移动设备等中需要。 使用焊料合金，其由不低于0.1质量ppm的硼和不大于200质量ppm的硼组成，剩余部分包含基本上不小于40质量％的Sn，其中其熔化温度低于250℃ C。

公开(公告)号：US20140109962A1

公开(公告)日：2014-04-24

申请号：US14122954

申请日：2012-05-25

申请人： Takayuki Kobayashi ,  Keiichi Kimura ,  Masamoto Tanaka ,  Eiji Hashino

发明人： Takayuki Kobayashi ,  Keiichi Kimura ,  Masamoto Tanaka ,  Eiji Hashino

IPC分类号： H01L31/05

CPC分类号： H01L31/05 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/262 ,  H01L31/0508 ,  H01L31/0512 ,  Y02E10/50

摘要： The purpose of the present invention is to provide an interconnector for solar cells, which reduces the stress acting on a solar cell and suppresses warping and cracking of the solar cell. An interconnector for solar cells of the present invention is characterized by comprising an electrically conductive wire part and a surface layer that is formed on at least one wide surface of the electrically conductive wire part. The interconnector for solar cells is also characterized in that the surface layer has a function of reducing the stress that is caused by the difference between the thermal expansion coefficient of the electrically conductive part and the thermal expansion coefficient of a solar cell, said stress being generated when the interconnector is joined to the solar cell.

摘要翻译： 本发明的目的是提供一种用于太阳能电池的互连器，其降低了作用在太阳能电池上的应力并抑制了太阳能电池的翘曲和开裂。 本发明的太阳能电池互连器的特征在于包括导电线部分和形成在导电线部分的至少一个宽表面上的表面层。 用于太阳能电池的互连器的特征还在于，表面层具有降低由导电部件的热膨胀系数与太阳能电池的热膨胀系数之间的差异引起的应力的功能，所述应力产生 当互连器连接到太阳能电池时。

公开(公告)号：US09700163B2

公开(公告)日：2017-07-11

申请号：US14348761

申请日：2012-09-26

申请人： Takayuki Kobayashi

发明人： Takayuki Kobayashi

IPC分类号： B65D51/16 ,  A47G19/22 ,  B65D77/20 ,  B65D43/02

CPC分类号： A47G19/2205 ,  B65D43/021 ,  B65D43/0229 ,  B65D51/1622 ,  B65D77/2004 ,  B65D2543/00092 ,  B65D2543/00231 ,  B65D2543/0024 ,  B65D2543/00296 ,  B65D2543/00518 ,  B65D2543/00546 ,  B65D2543/00629 ,  B65D2543/00685 ,  B65D2543/00731 ,  B65D2543/00796

摘要： A synthetic resin cup container including two members: a cup body having a cylindrical shape and a bottom disposed at a lower end of a round peripheral sidewall of this cup body, and a flange unit including a fitting cylinder and a brim-like flange, an inner edge portion of the flange being integrally connected to an upper end of the fitting cylinder, wherein the flange unit is detachably fitted in an upper portion of the cup body by fitting the fitting cylinder in an upper portion of the peripheral sidewall.