公开(公告)号：US20130236734A1

公开(公告)日：2013-09-12

申请号：US13885309

申请日：2011-11-16

申请人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  B21D39/00

CPC分类号： B32B15/012 ,  B21D39/00 ,  C22C1/02 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C28/023 ,  H01L31/03926 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/12049 ,  Y10T428/12069 ,  Y10T428/12076

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of μm and a thickness of the Al-containing metal layer is T in units of μm, the granular alloys satisfy x≦0.5T.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 设置在钢层上的含Al金属层; 以及存在于钢层和含Al金属层之间的界面中的多个粒状合金，其中，当含Al金属层的表面的切割线被定义为轮廓曲线和近似直线时 轮廓曲线被定义为轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10um的最大点，并且其中，当粒状合金的等效球体直径 以x为单位，m为单位，含有Al的金属层的厚度为T为单位为m，粒状合金满足x@0.5T。

公开(公告)号：US20130236737A1

公开(公告)日：2013-09-12

申请号：US13885278

申请日：2011-11-16

申请人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  H01L31/02

CPC分类号： B32B15/012 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/40 ,  C23C8/02 ,  C23C8/24 ,  C23C14/14 ,  C23C18/125 ,  C23C18/1254 ,  C23C18/1651 ,  C23C28/321 ,  C23C28/34 ,  C23C28/345 ,  C25D3/04 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/0614 ,  C25D11/08 ,  H01L31/02 ,  H01L31/0392 ,  H01L31/03923 ,  H01L31/03925 ,  H01L51/0096 ,  Y02E10/541 ,  Y10T428/12438

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al7Cu2Fe intermetallic compound or FeAl3 based intermetallic compounds.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 包含Fe和Al并且形成在钢层上的合金层; 以及配置在所述合金层上的含Al金属层，其中，当所述含Al金属层的表面的切割面线被定义为轮廓曲线时，将所述轮廓曲线的近似直线定义为 轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10um的最大点，合金层的厚度为0.1〜8μm，合金层含有Al7Cu2Fe金属间化合物 化合物或FeAl3基金属间化合物。

公开(公告)号：US09902134B2

公开(公告)日：2018-02-27

申请号：US13885309

申请日：2011-11-16

申请人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Takayuki Kobayashi ,  Shinichi Terashima ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： B32B15/01 ,  C23C2/02 ,  C23C2/12 ,  C23C2/28 ,  B21D39/00 ,  C23C28/02 ,  H01L31/0392 ,  C23C2/26 ,  C22C1/02

CPC分类号： B32B15/012 ,  B21D39/00 ,  C22C1/02 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C28/023 ,  H01L31/03926 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/12049 ,  Y10T428/12069 ,  Y10T428/12076

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of μm and a thickness of the Al-containing metal layer is T in units of μm, the granular alloys satisfy x≦0.5T.

公开(公告)号：US09296180B2

公开(公告)日：2016-03-29

申请号：US13885278

申请日：2011-11-16

申请人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

发明人： Shinichi Terashima ,  Takayuki Kobayashi ,  Masamoto Tanaka ,  Masami Fujishima ,  Masao Kurosaki ,  Jun Maki ,  Hideaki Suda ,  Shuji Nagasaki

IPC分类号： H01L51/00 ,  B32B15/01 ,  C23C2/12 ,  C23C2/26 ,  H01L31/0392 ,  H01L31/02 ,  C23C2/02 ,  C25D3/04 ,  C23C8/24 ,  C23C14/14 ,  C23C18/12 ,  C23C28/00 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/06 ,  C23C18/16 ,  C23C2/40 ,  C23C8/02 ,  C25D11/08

CPC分类号： B32B15/012 ,  C23C2/02 ,  C23C2/12 ,  C23C2/26 ,  C23C2/40 ,  C23C8/02 ,  C23C8/24 ,  C23C14/14 ,  C23C18/125 ,  C23C18/1254 ,  C23C18/1651 ,  C23C28/321 ,  C23C28/34 ,  C23C28/345 ,  C25D3/04 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/0614 ,  C25D11/08 ,  H01L31/02 ,  H01L31/0392 ,  H01L31/03923 ,  H01L31/03925 ,  H01L51/0096 ,  Y02E10/541 ,  Y10T428/12438

摘要： A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al7Cu2Fe intermetallic compound or FeAl3 based intermetallic compounds.

摘要翻译： 一种金属箔，包括：厚度为10〜200μm的钢层; 包含Fe和Al并且形成在钢层上的合金层; 以及配置在所述合金层上的含Al金属层，其中，当所述含Al金属层的表面的切割面线被定义为轮廓曲线时，将所述轮廓曲线的近似直线定义为 轮廓平均直线，在轮廓曲线上不存在与轮廓平均直线的距离大于10μm的最大点，合金层的厚度为0.1〜8μm，合金层含有Al7Cu2Fe金属间化合物 化合物或FeAl3基金属间化合物。

公开(公告)号：US09024442B2

公开(公告)日：2015-05-05

申请号：US13508864

申请日：2011-08-04

申请人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  B23K35/26 ,  C22C13/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H05K3/34

CPC分类号： B23K35/262 ,  C22C13/00 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13688 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/3651 ,  H01L2924/37 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  H01L2224/05644 ,  H01L2224/05164 ,  H01L2224/05155 ,  H01L2224/05147 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2924/2076 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball.

摘要翻译： 本发明涉及一种用于半导体封装的焊球和具有这种焊球的电子部件。 具体地说，提供了一种能够确保近年来观察到的直径不大于250μm时的足够的热疲劳特性的焊球; 以及具有这种焊球的电子部件。 更具体地说，提供一种半导体封装用焊料球，其由以Sn为主要元素的焊料合金制成，质量％为0.1〜2.5质量％，Cu为0.1〜1.5质量％，Mg，Al 和Zn，其总量为0.0001-0.005质量％，这种焊球具有包括厚度为1-50nm并且包含Mg，Al和Zn，O和Sn中的至少一种的非晶相的表面，以及 具有这种焊球的电子部件。

公开(公告)号：US20120223430A1

公开(公告)日：2012-09-06

申请号：US13508864

申请日：2011-08-04

申请人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： B23K35/26 ,  H01L23/488

CPC分类号： B23K35/262 ,  C22C13/00 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13688 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/3651 ,  H01L2924/37 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  H01L2224/05644 ,  H01L2224/05164 ,  H01L2224/05155 ,  H01L2224/05147 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2924/2076 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball.

摘要翻译： 本发明涉及一种用于半导体封装的焊球和具有这种焊球的电子部件。 具体地说，提供了一种能够确保近年来观察到的直径不大于250μm时的足够的热疲劳特性的焊球; 以及具有这种焊球的电子部件。 更具体地说，提供一种半导体封装用焊料球，其由以Sn为主要元素的焊料合金制成，质量％为0.1〜2.5质量％，Cu为0.1〜1.5质量％，Mg，Al 和Zn，其总量为0.0001-0.005质量％，这种焊球具有包括厚度为1-50nm并且包含Mg，Al和Zn，O和Sn中的至少一种的非晶相的表面，以及 具有这种焊球的电子部件。

公开(公告)号：US20120038042A1

公开(公告)日：2012-02-16

申请号：US13264625

申请日：2010-04-12

申请人： Tsutomu Sasaki ,  Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Tsutomu Sasaki ,  Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： H01L23/498 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  C22C13/00

CPC分类号： H05K3/3463 ,  B23K35/262 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01L2924/0002 ,  H05K3/3436 ,  H01L2924/00

摘要： A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.

摘要翻译： 一种无铅焊料合金，焊球和包括焊料凸块的电子部件，其能够防止在焊接之后在焊料表面上发生黄色变色，在焊料形成之后的焊料凸块的表面 BGA，以及在BGA的老化测试之后的焊料凸块的表面。 具体公开的是：无铅焊料合金; 焊球; 以及包含焊料凸块的电子部件，其含有选自Li，Na，K，Ca，Be，Mg，Sc，Y，镧系元素中的至少一种添加元素，Ti，Zr，Hf，Nb，Ta，Mo，Zn ，Al，Ga，In，Si和Mn，总量为1质量ppm〜0.1质量％，余量为Sn的40质量％以上。

公开(公告)号：US08847390B2

公开(公告)日：2014-09-30

申请号：US13951596

申请日：2013-07-26

申请人： Eiji Hashino ,  Shinji Ishikawa ,  Shinichi Terashima ,  Masamoto Tanaka

发明人： Eiji Hashino ,  Shinji Ishikawa ,  Shinichi Terashima ,  Masamoto Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498

CPC分类号： H01L23/49866 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2924/301 ,  H01L2924/381 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0769 ,  H05K2203/041 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2924/01015 ,  H01L2924/01012 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01025 ,  H01L2924/01013 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00015

摘要： According to a lead-free solder bump bonding structure, by causing the interface (IMC interface) of the intermetallic compound layer at a lead-free-solder-bump side to have scallop shapes of equal to or less than 0.02 [portions/μm] without forming in advance an Ni layer as a barrier layer on the surfaces of respective Cu electrodes of first and second electronic components like conventional technologies, a Cu diffusion can be inhibited, thereby inhibiting an occurrence of an electromigration. Hence, the burden at the time of manufacturing can be reduced by what corresponds to an omission of the formation process of the Ni layer as a barrier layer on the Cu electrode surfaces, and thus a lead-free solder bump bonding structure can be provided which reduces a burden at the time of manufacturing in comparison with conventional technologies and which can inhibit an occurrence of an electromigration.

摘要翻译： 根据无铅焊料接合结构，通过使无铅焊料凸点侧的金属间化合物层的界面（IMC界面）具有等于或小于0.02 [份/μm]的扇形， 在不像传统技术那样在第一和第二电子部件的各个Cu电极的表面上预先形成Ni层作为阻挡层的情况下，可以抑制Cu扩散，从而抑制电迁移的发生。 因此，可以通过对作为Cu电极表面上的阻挡层的Ni层的形成处理的省略来减少制造时的负担，从而可以提供无铅焊料凸块接合结构，其中， 与传统技术相比，减少制造时的负担，并且可以抑制电迁移的发生。

公开(公告)号：US20090304545A1

公开(公告)日：2009-12-10

申请号：US12281430

申请日：2007-03-08

申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

IPC分类号： C22C13/02 ,  C22C13/00

CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。

公开(公告)号：US08562906B2

公开(公告)日：2013-10-22

申请号：US12281430

申请日：2007-03-08

申请人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

发明人： Masamoto Tanaka ,  Tsutomu Sasaki ,  Takayuki Kobayashi ,  Kazuto Kawakami ,  Masayoshi Fujishima

IPC分类号： C22C13/00 ,  C22C13/02

CPC分类号： C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

摘要： A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

摘要翻译： 在耐冲击性和抗振性方面表现出良好性能的无铅焊料合金。 还提供了使用这种无铅焊料合金的焊球，以及使用这种无铅合金的具有焊锡凸块的电子部件。 具体地说，无铅焊料合金由1.0〜2.0质量％的Ag，0.3〜1.0质量％的Cu，0.005〜0.1质量％的Ni组成，余量包含Sn和不可避免的杂质。 在Cu电极上的Sn-Ag-Cu基焊料部中，在Cu电极上直接形成Cu 3 Sn金属间化合物层，然后在其上形成Cu6Sn5金属间化合物层。 Cu6Sn5金属间化合物层中的Cu原子位置被原子半径小于Cu的Ni代替，从而减小Cu6Sn5金属间化合物层的应变，从而可以提高耐冲击性和抗振性。