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公开(公告)号：US4904257A
公开(公告)日：1990-02-27
申请号：US215782
申请日：1988-07-06
申请人： Shoichi Mori , Shigeo Fujii , Masao Yoshizawa , Kenji Miyasaka , Jyoichi Tabuchi , Kazufumi Egawa , Minoru Hirano , Yoshikazu Yoshida
发明人： Shoichi Mori , Shigeo Fujii , Masao Yoshizawa , Kenji Miyasaka , Jyoichi Tabuchi , Kazufumi Egawa , Minoru Hirano , Yoshikazu Yoshida
CPC分类号： A61F2/28 , A61L27/12 , A61L27/46 , A61F2310/00293 , A61L2430/02 , Y10T428/249921
摘要： A fibrous bone filler having an excellent biocompatibility. The bone filler comprises fibers containing hydroxyl apatite. The hydroxyl apatite is "intact", that is, the hydroxyl apatite substantially retains its hydroxyl groups.
摘要翻译： 具有优异生物相容性的纤维状骨填料。 骨填料包含含有羟基磷灰石的纤维。 羟基磷灰石是“完整的”，即羟基磷灰石基本保持其羟基。
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公开(公告)号：US07828047B2
公开(公告)日：2010-11-09
申请号：US12003542
申请日：2007-12-28
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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公开(公告)号：US06507493B2
公开(公告)日：2003-01-14
申请号：US09791777
申请日：2001-02-26
IPC分类号： H05K720
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
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公开(公告)号：US20050102363A1
公开(公告)日：2005-05-12
申请号：US10983759
申请日：2004-11-09
申请人： Makoto Yokomura , Takashi Hayashi , Takashi Satomura , Toshiro Mitamura , Rika Aizawa , Masaru Moriwaki , Soichiro Fujioka , Minoru Hirano , Yuichiro Hara
发明人： Makoto Yokomura , Takashi Hayashi , Takashi Satomura , Toshiro Mitamura , Rika Aizawa , Masaru Moriwaki , Soichiro Fujioka , Minoru Hirano , Yuichiro Hara
CPC分类号： G06Q10/107 , H04L51/14
摘要： An E-mail transmission control device comprises: a mail information storage unit; a destination information storage unit; an E-mail transmission unit; an error information reception unit for receiving error information; an error information decision unit for deciding whether or not the error information satisfies a predetermined condition; a destination excluding unit for executing the destination indicated by the destination information owned by the error information, from the candidates of the destination, in case the error information decision unit decides the satisfaction of the predetermined condition. The electronic transmission control device further comprises a re-transmission decision unit for deciding whether or not a predetermined condition is satisfied, after the destination excluding unit performed the exclusion. The E-mail transmission unit transmits the E-mail to the excluded destination in case the re-transmission decision unit decides the satisfaction of the predetermined condition.
摘要翻译： 电子邮件传输控制装置包括：邮件信息存储单元; 目的地信息存储单元; 电子邮件传输单元; 用于接收错误信息的错误信息接收单元; 错误信息决定单元，用于判定所述错误信息是否满足预定条件; 在所述错误信息决定单元判定所述预定条件的满足的情况下，从所述目的地的候选者执行由所述错误信息所拥有的目的地信息表示的目的地的目的地排除单元。 电子传输控制装置还包括在目的地排除单元执行排除之后，决定是否满足预定条件的重传决定单元。 电子邮件发送单元在重新发送决定单元决定预定条件的满足的情况下，将电子邮件发送到排除目的地。
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公开(公告)号：US06717808B2
公开(公告)日：2004-04-06
申请号：US09791838
申请日：2001-02-26
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US5338728A
公开(公告)日：1994-08-16
申请号：US929931
申请日：1992-08-14
申请人： Hajime Kamachi , Minoru Hirano , Shinji Masuyoshi
发明人： Hajime Kamachi , Minoru Hirano , Shinji Masuyoshi
IPC分类号： C07H15/24 , A61K31/70 , A61K31/7028 , A61K31/7034 , A61K31/704 , A61P31/04 , A61P31/10 , C07H15/244
CPC分类号： C07H15/244
摘要： Disclosed are novel pradimicin compounds which possess antifungal activity and, preferably, improved water solubility. The compounds of the invention are prepared by modifying the 4'-amino or 4'-alkylamino moieties of known pradimicin compounds.
摘要翻译： 公开了具有抗真菌活性，优选改善的水溶性的新型普拉明霉素化合物。 本发明的化合物通过改性已知的普拉定霉素化合物的4'-氨基或4'-烷基氨基部分制备。
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公开(公告)号：US4783219A
公开(公告)日：1988-11-08
申请号：US929171
申请日：1986-11-10
申请人： Hajime Mori , Minoru Hirano , Teruyuki Hasegawa , Yoshihiko Kawai , Yoshiteru Kikuchi , Kenji Takahashi
发明人： Hajime Mori , Minoru Hirano , Teruyuki Hasegawa , Yoshihiko Kawai , Yoshiteru Kikuchi , Kenji Takahashi
摘要： A method for melting and reducing chrome ore, which comprises charging chrome ore and carbonaceous material, and blowing in oxygen gas under a pressure ranging from 1 to 600 Torr, while molten metal is being stirred by a stirring gas blown in. In this method, a reaction vessel capable of allowing top blowing and bottom blowing onto the molten metal and decreasing pressure within the vessel is employed. Chrome ore and carbonaceous material can be used in the form of lumps or powder. When powdered ore and material are used, they can be injected through a lance or a tuyere into the vessel.
摘要翻译： 一种熔融还原铬矿的方法，其包括装入铬矿和碳质材料，并在1至600乇的压力下吹入氧气，同时通过吹入的搅拌气体搅拌熔融金属。在该方法中， 采用能够允许顶吹和底吹到熔融金属上并减小容器内的压力的反应容器。 铬矿石和碳质材料可以以块状或粉末的形式使用。 当使用粉状矿石和材料时，可以通过喷枪或风口将其注入容器。
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公开(公告)号：US06385043B1
公开(公告)日：2002-05-07
申请号：US09688857
申请日：2000-10-17
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06219236B1
公开(公告)日：2001-04-17
申请号：US09448496
申请日：1999-11-24
申请人： Minoru Hirano , Masumi Suzuki
发明人： Minoru Hirano , Masumi Suzuki
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/40 , H01L23/4006 , H01L2924/0002 , H05K7/20436 , H05K7/20472 , H05K7/20509 , H01L2924/00
摘要： It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.
摘要翻译： 本发明的目的是提供一种冷却系统，其能够同时冷却多芯片模块上的电子部件，该多芯片模块被布置成提供预定功能，其中冷却系统可以容易且快速地附接到 模块必要时。 本发明提供一种用于冷却具有预定功能的多芯片模块MCM的冷却系统，该冷却系统在其上安装有包括发热部件P的多个电子部件的基板B上，用于冷却多芯片模块的冷却系统包括： 在辐射体1和电子部件P之间形成有规定的间隙的情况下，能够覆盖多个电子部件P的上部的散热体1; 布置在所述间隙中的由硅橡胶制成的片材S，用于热连接所述电子部件和所述散热构件的上表面; 以及用于将散热体与多芯片模块MCM的基板B可拆卸地连接的螺钉N.
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10.发明授权Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together 失效具有多层电路板的多芯片模块，绝缘层和布线导体堆叠在一起
公开(公告)号：US5586006A
公开(公告)日：1996-12-17
申请号：US573577
申请日：1995-12-15
申请人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
发明人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46 , H05K7/20
CPC分类号： H01L25/0657 , H01L23/49811 , H05K1/141 , H01L2224/16 , H01L2224/48225 , H01L2224/48227 , H01L2225/0651 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06589 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/10253 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H05K2201/0317 , H05K2201/1031 , H05K2201/10318 , H05K2201/10477 , H05K3/3421 , H05K3/3426 , H05K3/3436 , H05K3/368 , H05K3/467 , Y02P70/611
摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。
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