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23 条记录 (耗时 0.02 秒)

    Magnetic head and method of making same
    1.
    发明授权
    Magnetic head and method of making same 失效
    磁头及其制作方法

    公开(公告)号：US5676768A

    公开(公告)日：1997-10-14

    申请号：US316477

    申请日：1994-10-03

    申请人： Shunsaku Muraoka ,  Akinaga Natsui ,  Yasuhiro Nakatani

    发明人： Shunsaku Muraoka ,  Akinaga Natsui ,  Yasuhiro Nakatani

    IPC分类号： G11B5/127 ,  G11B5/147 ,  H01F10/16 ,  H01F1/00

    CPC分类号： G11B5/127 ,  G11B5/147 ,  H01F10/16 ,  H01F10/265 ,  Y10S428/90 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49034 ,  Y10T29/49043 ,  Y10T428/1171 ,  Y10T428/265

    摘要： A ring-type magnetic head is of a structure in which a metallic magnetic film is sandwiched between two substrates, and the metallic magnetic film has a saturation magnetic field not less than 50 A/m in all directions parallel to a film plane thereof. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx greater than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not less than Tc and a second heat treatment at a temperature Ta of Tc-180.degree. C..ltoreq.Ta.ltoreq.Tc-30.degree. C. in the absence of any applied magnetic field. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx less than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not greater than Tx while a rotating magnetic field is being applied thereto and a second heat treatment at a temperature Ta of Tx-200.degree. C..ltoreq.Ta.ltoreq.Tx-50.degree. C. in the absence of any applied magnetic field.

    摘要翻译： 环形磁头具有将金属磁性膜夹在两个基板之间的结构，并且该金属磁性膜在与其膜平面平行的所有方向上具有不小于50A / m的饱和磁场。 在金属磁性膜是结晶化温度Tx大于居里温度Tc的含Co磁性软膜的情况下，金属磁性膜在不低于Tc的温度下进行第一次热处理，在 在没有任何施加的磁场的情况下，Tc-180℃的温度Ta

    Magnetic head
    2.
    发明授权
    Magnetic head 失效
    磁头

    公开(公告)号：US5604045A

    公开(公告)日：1997-02-18

    申请号：US550282

    申请日：1995-10-30

    申请人： Shunsaku Muraoka ,  Akinaga Natsui ,  Yasuhiro Nakatani

    发明人： Shunsaku Muraoka ,  Akinaga Natsui ,  Yasuhiro Nakatani

    IPC分类号： G11B5/127 ,  G11B5/147 ,  H01F10/16 ,  G11B5/66 ,  B32B9/00

    CPC分类号： G11B5/127 ,  G11B5/147 ,  H01F10/16 ,  H01F10/265 ,  Y10S428/90 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49034 ,  Y10T29/49043 ,  Y10T428/1171 ,  Y10T428/265

    摘要： A ring-type magnetic head is of a structure in which a metallic magnetic film is sandwiched between two substrates, and the metallic magnetic film has a saturation magnetic field not less than 50 A/m in all directions parallel to a film plane thereof; the direction of lamination of the sandwich is generally perpendicular to a gap-forming surface of the head; where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx greater than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not less than Tc and a second heat treatment at a temperature Ta of Tc-180.degree. C..ltoreq.Ta.ltoreq.Tc-30.degree. C. in the absence of any applied magnetic field; where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx less than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not greater than Tx while a rotating magnetic field is being applied thereto and a second heat treatment at a temperature Ta of Tx-200.degree. C..ltoreq.Ta.ltoreq.Tx-50.degree. C. in the absence of any applied magnetic field.

    摘要翻译： 环形磁头具有金属磁性膜夹在两个基板之间的结构，并且金属磁性膜在与其膜平面平行的所有方向上具有不小于50A / m的饱和磁场; 夹层的层压方向一般垂直于头部的间隙形成表面; 其中金属磁性膜是结晶温度Tx大于居里温度Tc的含Co磁性软膜，金属磁性膜在不低于Tc的温度下进行第一次热处理，在 在没有任何施加的磁场的情况下，Tc-180℃的温度Ta

    SURFACE-TREATED FLUORESCENT BODIES AND PROCESS FOR PRODUCTION OF SURFACE-TREATED FLUORESCENT BODIES
    3.
    发明申请
    SURFACE-TREATED FLUORESCENT BODIES AND PROCESS FOR PRODUCTION OF SURFACE-TREATED FLUORESCENT BODIES 审中-公开
    表面处理荧光体和表面处理荧光体生产工艺

    公开(公告)号：US20130094186A1

    公开(公告)日：2013-04-18

    申请号：US13637777

    申请日：2011-03-17

    申请人： Ren-de Sun ,  Yasuhiro Nakatani ,  Takahiro Oomura ,  Mitsuru Tanikawa ,  Takashi Watanabe

    发明人： Ren-de Sun ,  Yasuhiro Nakatani ,  Takahiro Oomura ,  Mitsuru Tanikawa ,  Takashi Watanabe

    IPC分类号： C09K11/77 ,  H01L33/50 ,  H01L27/15 ,  G09F13/04

    CPC分类号： C09K11/7734 ,  C09K11/025 ,  G09F13/04 ,  H01L27/15 ,  H01L33/502

    摘要： The present invention aims to provide a surface-treated phosphor having high dispersibility and capable of significantly enhancing moisture resistance without deteriorating the fluorescence properties, and a method for producing the surface-treated phosphor. The surface-treated phosphor includes: a phosphor body; and a surface treatment layer containing at least one specific element selected from elements of the third to sixth groups of the periodic table, and fluorine, the phosphor body having the surface treatment layer on the surface thereof, wherein, when a cross section of the surface treatment layer is subjected to a thickness-wise elemental distribution analysis by a combination of an electron microscopic analysis and an energy-dispersive X-ray element analysis, a peak indicating the maximum content of the specific element appears nearer to the surface than a peak indicating the maximum fluorine content.

    摘要翻译： 本发明的目的在于提供一种具有高分散性并且能够显着提高耐湿性而不降低荧光性能的表面处理荧光体，以及用于制备表面处理荧光体的方法。 表面处理荧光体包括：荧光体; 以及含有选自元素周期表第三至第六组元素中的至少一种特定元素的表面处理层，以及表面上具有表面处理层的荧光体，其中，当表面的横截面 处理层通过电子显微镜分析和能量色散X射线元素分析的组合进行厚度方向的元素分布分析，表示特定元素的最大含量的峰出现在比表面更接近的峰 最大氟含量。

    Multilayer circuit board and method for manufacturing the same
    4.
    发明申请
    Multilayer circuit board and method for manufacturing the same 失效
    多层电路板及其制造方法

    公开(公告)号：US20060008628A1

    公开(公告)日：2006-01-12

    申请号：US11226142

    申请日：2005-09-14

    申请人： Yasuhiro Nakatani ,  Hideki Higashitani ,  Tadashi Nakamura ,  Fumio Echigo

    发明人： Yasuhiro Nakatani ,  Hideki Higashitani ,  Tadashi Nakamura ,  Fumio Echigo

    IPC分类号： B32B15/00

    CPC分类号： H05K3/4614 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/09045 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/068 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/24917

    摘要： It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.

    摘要翻译： 本发明的目的是提供一种层叠多个电路板的多层电路板及其制造方法，其中至少一个位于外侧的电路板，导电物质 填充穿过电路板的厚度方向的孔并固化，并且多个电路板的布线层通过已固化的导电物质电连接，其中在多层电路板中，位于外侧的布线层 已经固化的导电物质从其周围向外突出。 因此，导热膏在热压期间被充分压缩，从而产生稳定的电连接，并且可以在内层布线图案之间填充热固性树脂，而不会留下间隙。

    Method for manufacturing printed circuit board
    5.
    发明授权
    Method for manufacturing printed circuit board 有权
    印刷电路板制造方法

    公开(公告)号：US07155820B2

    公开(公告)日：2007-01-02

    申请号：US10695302

    申请日：2003-10-27

    申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    IPC分类号： H01K3/10 ,  H01R12/04

    CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

    摘要翻译： 本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

    Method for preparing resin particles, resin particles and apparatus for preparing resin particles
    8.
    发明授权
    Method for preparing resin particles, resin particles and apparatus for preparing resin particles 有权
    树脂颗粒的制备方法，树脂颗粒和树脂颗粒的制备装置

    公开(公告)号：US07306752B2

    公开(公告)日：2007-12-11

    申请号：US10481604

    申请日：2002-06-21

    申请人： Yasuhiro Nakatani

    发明人： Yasuhiro Nakatani

    IPC分类号： B29B9/10

    CPC分类号： B01J19/285 ,  B01J14/00 ,  C08F2/22

    摘要： The present provides a method for preparing resin fine particles of a homogeneous particle size used in the fields of chemistry, medicine, electronic material or the like, resin fine particles, and a production apparatus for resin fine particles.The present invention provides a method for preparing a resin fine particle, which comprises discharging a liquid comprising a polymerizable monomer as a dispersion phase into a continuous phase; splitting the liquid comprising the polymerizable monomer by applying mechanical vibration to form a liquid droplet; and polymerizing the liquid droplet in a state without splitting or integrating the liquid droplet, said method comprising recognizing a state of said liquid being split into a liquid droplet, and a condition of said discharging and/or said mechanical vibration of the liquid being determined by feedback from a result of the recognition.

    摘要翻译： 本发明提供一种制备用于化学，医药，电子材料等领域的均匀粒径的树脂细颗粒的方法，树脂细颗粒和用于树脂细颗粒的生产装置。 本发明提供一种制备树脂微粒的方法，其包括将包含作为分散相的可聚合单体的液体排放到连续相中; 通过施加机械振动来分解包含可聚合单体的液体以形成液滴; 并且在不分裂或积分液滴的状态下聚合液滴，所述方法包括识别被分成液滴的所述液体的状态，并且所述液体的所述排出和/或所述机械振动的条件由 来自认可结果的反馈。