Gas distribution uniformity improvement by baffle plate with multi-size holes for large size PECVD systems
    3.
    发明申请
    Gas distribution uniformity improvement by baffle plate with multi-size holes for large size PECVD systems 审中-公开
    用于大尺寸PECVD系统的具有多尺寸孔的挡板的气体分布均匀性改善

    公开(公告)号:US20060228490A1

    公开(公告)日:2006-10-12

    申请号:US11101305

    申请日:2005-04-07

    摘要: Embodiments of a gas distribution plate for distributing gas in a processing chamber for large area substrates are provided. The embodiments describe a gas distribution plate assembly for a plasma processing chamber having a cover plate comprises a diffuser plate having an upstream side, a downstream side facing a processing region, and a plurality of gas passages formed through the diffuser plate, and a baffle plate, placed between the cover plate of the process chamber and the diffuser plate, having a plurality of holes extending from the upper surface to the lower surface of the baffle plate, wherein the plurality of holes have at least two sizes. The small pinholes of the baffle plate are used to allow sufficient pass-through of gas mixture, while the large holes of the baffle plate are used to improve the process uniformity across the substrate.

    摘要翻译: 提供了用于在大面积基板的处理室中分配气体的气体分配板的实施例。 实施方式描述了一种用于等离子体处理室的气体分配板组件,其具有盖板,该盖板包括具有上游侧,面向加工区域的下游侧和通过扩散板形成的多个气体通道的扩散板,以及挡板 ,放置在处理室的盖板和扩散板之间,具有从挡板的上表面延伸到下表面的多个孔,其中多个孔具有至少两个尺寸。 挡板的小针孔用于允许气体混合物的充分通过,而挡板的大孔用于改善基板上的工艺均匀性。

    Plasma uniformity control by gas diffuser hole design
    4.
    发明申请
    Plasma uniformity control by gas diffuser hole design 有权
    通过气体扩散器孔设计的等离子体均匀性控制

    公开(公告)号:US20050251990A1

    公开(公告)日:2005-11-17

    申请号:US10889683

    申请日:2004-07-12

    摘要: Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.

    摘要翻译: 提供了用于在处理室中分配气体的气体扩散板的实施例。 气体分配板包括具有上游侧和下游侧的扩散板,以及在扩散板的上游侧和下游侧之间通过的多个气体通路。 气体通道包括在下游侧的中空阴极腔,以增强等离子体电离。 延伸到下游端的气体通道的空心阴极腔的深度,直径,表面积和密度可以从扩散板的中心到边缘逐渐增加,以改善衬底上的膜厚度和性能均匀性 。 从扩散板的中心到边缘的直径,深度和表面积的增加可以通过向下游侧弯曲扩散板,然后在凸出的下游侧加工出来。 扩散板的弯曲可以通过热处理或真空工艺来实现。 从扩散板的中心到边缘的直径,深度和表面积的增加也可以用计算机数字控制加工。 具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加,深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。

    Method of controlling the film properties of PECVD-deposited thin films
    5.
    发明申请
    Method of controlling the film properties of PECVD-deposited thin films 有权
    控制PECVD沉积薄膜的膜性能的方法

    公开(公告)号:US20050255257A1

    公开(公告)日:2005-11-17

    申请号:US11021416

    申请日:2004-12-22

    摘要: We have discovered methods of controlling a combination of PECVD deposition process parameters during deposition of thin films which provides improved control over surface standing wave effects which affect deposited film thickness uniformity and physical property uniformity. By minimizing surface standing wave effects, the uniformity of film properties across a substrate surface onto which the films have been deposited is improved. In addition, we have developed a gas diffusion plate design which assists in the control of plasma density to be symmetrical or asymmetrical over a substrate surface during film deposition, which also provides improved control over uniformity of deposited film thickness.

    摘要翻译: 我们已经发现了在沉积薄膜期间控制PECVD沉积工艺参数的组合的方法,其提供了影响沉积膜厚度均匀性和物理性质均匀性的表面驻波效应的改进控制。 通过最小化表面驻波效应,改善了膜沉积在其上的衬底表面上的膜性质的均匀性。 此外,我们开发了一种气体扩散板设计,其有助于在膜沉积期间等离子体密度在衬底表面上对称或不对称,这也提供了对沉积膜厚度的均匀性的改进的控制。

    GAS DISTRIBUTION UNIFORMITY IMPROVEMENT BY BAFFLE PLATE WITH MULTI-SIZE HOLES FOR LARGE SIZE PECVD SYSTEMS
    6.
    发明申请
    GAS DISTRIBUTION UNIFORMITY IMPROVEMENT BY BAFFLE PLATE WITH MULTI-SIZE HOLES FOR LARGE SIZE PECVD SYSTEMS 审中-公开
    气体分布均匀度改进由具有多个尺寸PECVD系统的多尺寸孔板

    公开(公告)号:US20080178807A1

    公开(公告)日:2008-07-31

    申请号:US12099112

    申请日:2008-04-07

    IPC分类号: C23C16/00

    摘要: Embodiments of a gas distribution plate for distributing gas in a processing chamber for large area substrates are provided. The embodiments describe a gas distribution plate assembly for a plasma processing chamber having a cover plate comprises a diffuser plate having an upstream side, a downstream side facing a processing region, and a plurality of gas passages formed through the diffuser plate, and a baffle plate, placed between the cover plate of the process chamber and the diffuser plate, having a plurality of holes extending from the upper surface to the lower surface of the baffle plate, wherein the plurality of holes have at least two sizes. The small pinholes of the baffle plate are used to allow sufficient pass-through of gas mixture, while the large holes of the baffle plate are used to improve the process uniformity across the substrate.

    摘要翻译: 提供了用于在大面积基板的处理室中分配气体的气体分配板的实施例。 实施方式描述了一种用于等离子体处理室的气体分配板组件,其具有盖板,该盖板包括具有上游侧,面向加工区域的下游侧和通过扩散板形成的多个气体通道的扩散板,以及挡板 ,放置在处理室的盖板和扩散板之间,具有从挡板的上表面延伸到下表面的多个孔,其中多个孔具有至少两个尺寸。 挡板的小针孔用于允许气体混合物的充分通过,而挡板的大孔用于改善基板上的工艺均匀性。

    Sulfur hexafluoride remote plasma source clean
    9.
    发明申请
    Sulfur hexafluoride remote plasma source clean 审中-公开
    六氟化硫远程等离子体源清洁

    公开(公告)号:US20060090773A1

    公开(公告)日:2006-05-04

    申请号:US11088327

    申请日:2005-03-22

    申请人: Soo Choi Qunhua Wang

    发明人: Soo Choi Qunhua Wang

    IPC分类号: B08B6/00 B08B9/00

    摘要: A method for cleaning a substrate processing chamber including introducing a gas mixture to a remote plasma source, wherein the gas mixture comprises sulfur hexafluoride and an oxygen containing compound selected from the group consisting of oxygen and nitrous oxide, disassociating a portion of the gas mixture into ions, transporting the atoms into a processing region of the chamber, providing an in situ plasma, and cleaning a deposit from within the chamber by reaction with the ions.

    摘要翻译: 一种用于清洁衬底处理室的方法,包括将气体混合物引入到远程等离子体源,其中所述气体混合物包括六氟化硫和选自氧和一氧化二氮的含氧化合物,将一部分气体混合物分解成 离子,将原子输送到室的处理区域中,提供原位等离子体,以及通过与离子反应来清洗室内的沉积物。

    Methods and apparatus for reducing arcing during plasma processing
    10.
    发明申请
    Methods and apparatus for reducing arcing during plasma processing 失效
    在等离子体处理期间减少电弧的方法和装置

    公开(公告)号:US20050266174A1

    公开(公告)日:2005-12-01

    申请号:US10858267

    申请日:2004-06-01

    摘要: In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.

    摘要翻译: 在第一方面,提供了一种在等离子体处理期间使用的方法。 第一种方法包括以下步骤:(1)将衬底放置在等离子体室的衬底保持器上; (2)将盖框架定位在所述基板的周边附近和下方; 和(3)采用盖框架来减小等离子体室内的等离子体处理期间的电弧。 提供了许多其他方面。