公开(公告)号：US20060143886A1

公开(公告)日：2006-07-06

申请号：US11027386

申请日：2004-12-30

申请人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

发明人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

IPC分类号： H01G7/00 ,  H01G4/20

CPC分类号： H05K1/162 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  Y10T29/43 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

公开(公告)号：US20060220175A1

公开(公告)日：2006-10-05

申请号：US11096235

申请日：2005-03-31

申请人： John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev

发明人： John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev

IPC分类号： H01L29/00

CPC分类号： H01L23/49822 ,  H01G4/236 ,  H01G4/33 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/15312 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  Y10T29/435 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.

公开(公告)号：US20060146476A1

公开(公告)日：2006-07-06

申请号：US11218357

申请日：2005-09-02

申请人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

发明人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

IPC分类号： H01G4/228

CPC分类号： H05K1/162 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  Y10T29/43 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。

公开(公告)号：US20060223226A1

公开(公告)日：2006-10-05

申请号：US11095917

申请日：2005-03-31

申请人： John Guzek ,  Victor Prokofiev

发明人： John Guzek ,  Victor Prokofiev

IPC分类号： H01L21/00 ,  H01L21/20

CPC分类号： H05K1/162 ,  H01G4/236 ,  H01G4/33 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/141 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An organic substrate, thin-film capacitor composite includes two plates that are accessed through deep and shallow vias. The organic substrate, thin-film capacitor composite includes integral structure with at least one trace in the organic substrate. The composite is able to be coupled with an interposer. The composite is also part of computing system.

摘要翻译： 有机基板，薄膜电容器复合材料包括通过深和浅通孔访问的两个板。 有机衬底，薄膜电容器复合材料包括在有机衬底中具有至少一个迹线的整体结构。 复合材料能够与插入件耦合。 复合也是计算系统的一部分。

公开(公告)号：US20060143887A1

公开(公告)日：2006-07-06

申请号：US11260023

申请日：2005-10-26

申请人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

发明人： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

IPC分类号： H01G7/00 ,  H01R9/00 ,  H01G4/06

CPC分类号： H05K1/162 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  Y10T29/43 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

公开(公告)号：US20110254124A1

公开(公告)日：2011-10-20

申请号：US12761782

申请日：2010-04-16

申请人： Ravi K. Nalla ,  John Guzek ,  Javier Soto Gonzalez ,  Drew Delaney ,  Hamid Azimi

发明人： Ravi K. Nalla ,  John Guzek ,  Javier Soto Gonzalez ,  Drew Delaney ,  Hamid Azimi

IPC分类号： H01L27/08 ,  H01L23/552 ,  B32B38/10

CPC分类号： H01L23/49822 ,  H01L21/02109 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76897 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49866 ,  H01L23/5226 ,  H01L23/552 ,  H01L23/645 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/1206 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4682 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die, forming a coreless substrate by building up layers on the dielectric material, and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将管芯附接到载体材料，其中载体材料包括由蚀刻停止层分隔的顶层和底层; 在模具附近形成电介质材料，通过在电介质材料上形成层而形成无芯衬底，然后去除顶层载体材料并从底层载体材料蚀刻停止层。

公开(公告)号：US20100101084A1

公开(公告)日：2010-04-29

申请号：US12257688

申请日：2008-10-24

申请人： John Guzek ,  Yonggang Li

发明人： John Guzek ,  Yonggang Li

IPC分类号： H05K3/06

CPC分类号： H05K1/0296 ,  C25D5/02 ,  C25D5/34 ,  H01L23/49541 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/02 ,  H05K3/045 ,  H05K3/107 ,  H05K3/108 ,  H05K3/188 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/09727 ,  H05K2203/0542 ,  Y10T29/49156 ,  H01L2924/00

摘要： In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提出使用混合激光投影图案化（LPP）和半添加剂图案化（SAP）的相同层微电子电路图案化。 在这方面，引入了一种方法，包括使用LPP图案化层叠基板表面的第一密度区域，使用SAP对叠层基板表面的第二密度区域进行图案化，以及电镀层叠基板表面的第一和第二密度区域，其中 跨越第一和第二密度区域的特征直接耦合。 还公开并要求保护其他实施例。

公开(公告)号：US20080003802A1

公开(公告)日：2008-01-03

申请号：US11478751

申请日：2006-06-29

申请人： Mengzhi Pang ,  John Guzek

发明人： Mengzhi Pang ,  John Guzek

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K2201/094 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a microelectronic substrate including electrode pads; providing a sorting mask defining first openings and second openings therethrough, the second openings being larger than the first openings; disposing the mask onto the substrate such that the first openings and second openings register with respective ones of the electrode pads; providing first solder portions onto corresponding ones of the electrode pads through the first openings, and second solder portions onto corresponding ones of the electrode pads through the second openings, the second solder portions being larger than the first solder portions; reflowing the solder portions to form, respectively first solder bumps and second solder bumps on respective ones of the electrode pads; and removing the mask after providing solder portions and before reflowing.

摘要翻译： 在微电子衬底的电极焊盘上提供导电凸块的方法以及根据该方法形成的凸起衬底。 该方法包括：提供包括电极焊盘的微电子衬底; 提供限定第一开口和穿过其中的第二开口的分类掩模，所述第二开口大于所述第一开口; 将掩模设置在基板上，使得第一开口和第二开口与相应的电极焊盘对准; 通过第一开口将第一焊料部分提供到对应的电极焊盘上，并且通过第二开口将第二焊料部分提供到对应的电极焊盘上，第二焊料部分大于第一焊料部分; 回流焊接部分，分别形成在相应的电极焊盘上焊接凸块和第二焊料凸块; 并在提供焊料部分之后并在回流之前去除掩模。

公开(公告)号：US20070132063A1

公开(公告)日：2007-06-14

申请号：US11304649

申请日：2005-12-14

申请人： Yongki Min ,  John Guzek

发明人： Yongki Min ,  John Guzek

IPC分类号： H01L29/00

CPC分类号： H05K1/162 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674

摘要： In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate.

摘要翻译： 在一个实施例中，衬底包括嵌入其中的薄膜电容器。 在一个实施例中，多个粘附孔延伸穿过薄膜电容器。 这些粘附孔可以改善电容器与基片的其它部分的粘合性。

公开(公告)号：US07569471B2

公开(公告)日：2009-08-04

申请号：US11479625

申请日：2006-06-29

申请人： Mengzhi Pang ,  John Guzek

发明人： Mengzhi Pang ,  John Guzek

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K2201/094 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/082 ,  Y10T29/53191 ,  Y10T29/53243 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate including first electrode pads and second electrode pads thereon, the first electrode pads exhibiting a first pattern, and the second electrode pads exhibiting a second pattern different from the first pattern; attaching first solder portions to a solder delivery head according to the first pattern, and second solder portions to a solder delivery head according to the second pattern, the second solder portions being larger than the first solder portions; after attaching, releasing the first solder portions onto the first electrode pads, and the second solder portions onto the second electrode pads; after releasing, reflowing the first solder portions and second solder portions to form, respectively, first solder bumps and second solder bumps on the electrode pads.

摘要翻译： 在微电子衬底的电极焊盘上提供导电凸块的方法以及根据该方法形成的凸起衬底。 该方法包括：提供包括第一电极焊盘和第二电极焊盘的衬底，第一电极焊盘呈现第一图案，第二电极焊盘呈现与第一图案不同的第二图案; 根据第一图案将第一焊料部附着到焊料输送头，根据第二图案将第二焊料部分附接到焊料输送头，第二焊料部分大于第一焊料部分; 附着后，将第一焊料部分释放到第一电极焊盘上，将第二焊料部分释放到第二焊盘上; 在释放之后，回流第一焊料部分和第二焊料部分，以分别在电极焊盘上形成第一焊料凸块和第二焊料凸块。