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    Display Device
    2.
    发明申请
    Display Device 审中-公开
    显示设备

    公开(公告)号：US20140085169A1

    公开(公告)日：2014-03-27

    申请号：US14110412

    申请日：2012-03-01

    申请人： Stefan Illek ,  Norwin von Malm ,  Tilman Ruegheimer

    发明人： Stefan Illek ,  Norwin von Malm ,  Tilman Ruegheimer

    IPC分类号： G09G3/32

    CPC分类号： G09G3/3208 ,  G09G3/32 ,  H01L25/0753

    摘要： A display device includes a multiplicity of pixels, at least one connection carrier, and a multiplicity of inorganic light-emitting diode chips. The connection carrier includes a multiplicity of switches. Each pixel contains at least one light-emitting diode chip. Each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier. Each switch is designed for driving at least one light-emitting diode chip and the light-emitting diode chips are imaging elements of the display device.

    摘要翻译： 显示装置包括多个像素，至少一个连接载体和多个无机发光二极管芯片。 连接载体包括多个开关。 每个像素包含至少一个发光二极管芯片。 每个发光二极管芯片被机械地固定并电连接到连接载体上。 每个开关被设计用于驱动至少一个发光二极管芯片，并且发光二极管芯片是显示装置的成像元件。

    Light-emitting diode chip
    3.
    发明授权
    Light-emitting diode chip 有权
    发光二极管芯片

    公开(公告)号：US09548433B2

    公开(公告)日：2017-01-17

    申请号：US13878673

    申请日：2011-09-28

    申请人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

    发明人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

    IPC分类号： H01L31/12 ,  H01L33/62 ,  H01L27/15

    CPC分类号： H01L33/62 ,  H01L27/153 ,  H01L2224/48463

    摘要： A light-emitting diode chip includes at least two semiconductor bodies, each semiconductor body including at least one active area that generates radiation, a carrier having a top side and an underside facing away from the top side, and an electrically insulating connector arranged at the top side of the carrier, wherein the electrically insulating connector is arranged between the semiconductor bodies and the top side of the carrier, the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier, and at least some of the semiconductor bodies electrically connect in series with one another.

    摘要翻译： 发光二极管芯片包括至少两个半导体本体，每个半导体主体包括产生辐射的至少一个有效区域，具有顶侧和背面离开顶侧的载体;以及电绝缘连接器， 所述电绝缘连接器设置在所述半导体主体和所述载体的顶侧之间，所述电绝缘连接器在所述半导体主体和所述载体之间施加机械接触，并且所述半导体主体中的至少一些电 相互连接。

    LIGHT-EMITTING DIODE CHIP
    4.
    发明申请
    LIGHT-EMITTING DIODE CHIP 有权
    发光二极管芯片

    公开(公告)号：US20130299867A1

    公开(公告)日：2013-11-14

    申请号：US13878673

    申请日：2011-09-28

    申请人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

    发明人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L27/153 ,  H01L2224/48463

    摘要： A light-emitting diode chip includes at least two semiconductor bodies, each semiconductor body including at least one active area that generates radiation, a carrier having a top side and an underside facing away from the top side, and an electrically insulating connector arranged at the top side of the carrier, wherein the electrically insulating connector is arranged between the semiconductor bodies and the top side of the carrier, the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier, and at least some of the semiconductor bodies electrically connect in series with one another.

    摘要翻译： 发光二极管芯片包括至少两个半导体本体，每个半导体主体包括产生辐射的至少一个有效区域，具有顶侧和背面离开顶侧的载体;以及电绝缘连接器， 所述电绝缘连接器设置在所述半导体主体和所述载体的顶侧之间，所述电绝缘连接器在所述半导体主体和所述载体之间施加机械接触，并且所述半导体主体中的至少一些电 相互连接。

    LIGHTING DEVICE
    5.
    发明申请
    LIGHTING DEVICE 有权
    照明设备

    公开(公告)号：US20130043496A1

    公开(公告)日：2013-02-21

    申请号：US13522508

    申请日：2011-01-17

    申请人： Matthias Sabathil ,  Norwin von Malm ,  Lutz Hoeppel ,  Stefan Illek ,  Bernd Barchmann ,  Patrick Rode

    发明人： Matthias Sabathil ,  Norwin von Malm ,  Lutz Hoeppel ,  Stefan Illek ,  Bernd Barchmann ,  Patrick Rode

    IPC分类号： H01L33/08

    CPC分类号： H01L25/0753 ,  H01L33/22 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A lighting device with front carrier, rear carrier and plurality of light-emitting diode chips, which when in operation emits light and releases waste heat, wherein rear carrier is covered at least in selected locations by front carrier, light-emitting diode chips are arranged between rear carrier and front carrier to form array, light-emitting diodes are contacted electrically by rear and/or front carrier and immobilized mechanically by rear carrier and front carrier, front carrier is coupled thermally conductively to light-emitting diode chips and includes light outcoupling face remote from light-emitting diode chips, which light outcoupling face releases some of waste heat released by light-emitting diode chips into surrounding environment, each light-emitting diode chip is actuated with electrical nominal power of 100 mW or less when lighting device is in operation and has light yield of 100 lm/W or more.

    摘要翻译： 一种具有前载体，后载体和多个发光二极管芯片的照明装置，其在运行时发光并释放废热，其中后载体至少在前载体上被选定的位置覆盖，发光二极管芯片布置 在后载体和前载体之间形成阵列，发光二极管由后和/或前载体电接触并由后载体和前载体机械固定，前载体热传导耦合到发光二极管芯片，并且包括光输出耦合 面对远离发光二极管芯片的光输出耦合面将发光二极管芯片释放的一部分废热释放到周围环境中，当发光二极管芯片的照明装置为100mW或更小时，每个发光二极管芯片的功率为100mW 具有100 lm / W以上的光收率。

    Lighting device
    6.
    发明授权
    Lighting device 有权
    照明设备

    公开(公告)号：US09029878B2

    公开(公告)日：2015-05-12

    申请号：US13522508

    申请日：2011-01-17

    申请人： Matthias Sabathil ,  Norwin von Malm ,  Lutz Hoeppel ,  Stefan Illek ,  Bernd Barchmann ,  Patrick Rode

    发明人： Matthias Sabathil ,  Norwin von Malm ,  Lutz Hoeppel ,  Stefan Illek ,  Bernd Barchmann ,  Patrick Rode

    IPC分类号： H01L33/08 ,  H01L25/075 ,  H01L33/22 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L33/22 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A lighting device with front carrier, rear carrier and plurality of light-emitting diode chips, which when in operation emits light and releases waste heat, wherein rear carrier is covered at least in selected locations by front carrier, light-emitting diode chips are arranged between rear carrier and front carrier to form array, light-emitting diodes are contacted electrically by rear and/or front carrier and immobilized mechanically by rear carrier and front carrier, front carrier is coupled thermally conductively to light-emitting diode chips and includes light outcoupling face remote from light-emitting diode chips, which light outcoupling face releases some of waste heat released by light-emitting diode chips into surrounding environment, each light-emitting diode chip is actuated with electrical nominal power of 100 mW or less when lighting device is in operation and has light yield of 100 lm/W or more.

    摘要翻译： 一种具有前载体，后载体和多个发光二极管芯片的照明装置，其在运行时发光并释放废热，其中后载体至少在前载体上被选定的位置覆盖，发光二极管芯片布置 在后载体和前载体之间形成阵列，发光二极管由后和/或前载体电接触并由后载体和前载体机械固定，前载体热传导耦合到发光二极管芯片，并且包括光输出耦合 面对远离发光二极管芯片的光输出耦合面将发光二极管芯片释放的一部分废热释放到周围环境中，当发光二极管芯片的照明装置为100mW或更小时，每个发光二极管芯片的功率为100mW 具有100 lm / W以上的光收率。

    Optoelectronic component
    7.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08811448B2

    公开(公告)日：2014-08-19

    申请号：US13120752

    申请日：2009-08-31

    申请人： Stefan Illek

    发明人： Stefan Illek

    IPC分类号： H01S3/091 ,  H01S5/04 ,  H01S5/183 ,  H01S5/14 ,  H01S5/18 ,  H01S5/00 ,  H01S5/02 ,  H01S5/40 ,  H01S5/022

    CPC分类号： H01S5/183 ,  H01L2224/48463 ,  H01S5/0071 ,  H01S5/0215 ,  H01S5/0217 ,  H01S5/02272 ,  H01S5/041 ,  H01S5/14 ,  H01S5/18 ,  H01S5/4031

    摘要： An optoelectronic component includes an optical pump device including a first radiation-generating layer and a first radiation exit area at a top side of the pump device, wherein electromagnetic radiation generated during operation of the pump device is coupled out from the pump device through the first radiation exit area transversely and at least in part non-perpendicularly with respect to the first radiation-generating layer, and a surface emitting semiconductor laser chip including a reflective layer sequence including a Bragg mirror, and a second radiation-generating layer, wherein the surface emitting semiconductor laser chip is fixed to the top side of the pump device, and the reflective layer sequence is arranged between the first radiation exit area and the second radiation-generating layer.

    摘要翻译： 光电子部件包括光泵装置，其包括位于泵装置顶侧的第一辐射产生层和第一辐射出口区域，其中在泵装置操作期间产生的电磁辐射通过第一 横向且至少部分地相对于第一辐射产生层非垂直的辐射出射面以及包括布拉格反射镜和第二辐射产生层的反射层序列的表面发射半导体激光器芯片，其中表面 发射半导体激光器芯片固定在泵装置的顶侧，并且反射层序列被布置在第一辐射出射区域和第二辐射产生层之间。

    Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip
    8.
    发明授权
    Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip 有权
    光电半导体芯片及其制造方法

    公开(公告)号：US08536603B2

    公开(公告)日：2013-09-17

    申请号：US13123779

    申请日：2009-10-12

    申请人： Stefan Illek ,  Uwe Strauss

    发明人： Stefan Illek ,  Uwe Strauss

    IPC分类号： H01L33/00

    CPC分类号： H01S5/12 ,  H01L33/14 ,  H01L2924/0002 ,  H01S5/0421 ,  H01S5/06256 ,  H01S5/1228 ,  H01S5/1231 ,  H01S5/209 ,  H01L2924/00

    摘要： An optoelectronic semiconductor chip having a semiconductor layer sequence with a plurality of layers arranged over one another includes an active layer with an active region which emits electromagnetic radiation in an emission direction when in operation, a first grating layer on the active layer which, in an emission direction, has a plurality of stripes in the form of grating lines extending perpendicularly to the emission direction with spaces arranged therebetween, and a second grating layer on the first grating layer which covers the stripes of the first grating layer and the spaces and which comprises a transparent material applied by non-epitaxial application.

    摘要翻译： 具有彼此排列的多个层的半导体层序列的光电子半导体芯片包括：有源层，具有在工作时发射方向上发射电磁辐射的有源区;活性层上的第一光栅层， 发射方向具有垂直于发射方向延伸的格栅线的形式的多个条纹，并且其间具有间隔布置的第一光栅层和覆盖第一光栅层和空间的条纹的第二光栅层，并且包括 通过非外延应用施加的透明材料。