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1.发明授权Aluminum nitride, aluminum nitride containing solid solutions and aluminum nitride composites prepared by combustion synthesis and sintered bodies prepared therefrom 失效通过燃烧合成制备的氮化铝，含氮化铝的固溶体和氮化铝复合材料，由其制备的烧结体
公开(公告)号：US5710382A
公开(公告)日：1998-01-20
申请号：US593310
申请日：1996-01-31
IPC分类号： C01B21/072 , C04B35/581 , C04B35/80 , C22C29/14 , B22F3/00 , C04B35/58
CPC分类号： C01B21/072 , C04B35/581 , C04B35/806 , C01P2004/10 , C01P2004/20 , C01P2004/61 , C01P2006/10 , C01P2006/12 , C01P2006/80 , Y10T428/12042
摘要： Aluminum nitride powder, aluminum nitride platelets, powdered solid solutions of aluminum nitride and at least one other ceramic material such as silicon carbide, and composites of aluminum nitride and transition metal borides or carbides are prepared by combustion synthesis at low gaseous nitrogen pressures. Porous bodies of aluminum nitride or composites of aluminum nitride and transition metal borides or carbides are also prepared by combustion synthesis at these pressures. The porous bodies are suitable for infiltration, either as formed or after being coated with at least one layer of a silicate material, by polymers or metals. The powders are also suitable for preparing dense sintered bodies. The aluminum nitride powder is also used to prepare AlN sintered bodies.
摘要翻译： 通过在低气态氮气压力下的燃烧合成来制备氮化铝粉末，氮化铝薄片，氮化铝粉末状固溶体和至少一种其它陶瓷材料如碳化硅，以及氮化铝和过渡金属硼化物或碳化物的复合材料。 氮化铝的多孔体或氮化铝和过渡金属硼化物或碳化物的复合物也通过在这些压力下的燃烧合成来制备。 多孔体适合于通过聚合物或金属形成或涂覆有至少一层硅酸盐材料之后的渗透。 粉末也适用于制备致密的烧结体。 氮化铝粉末也用于制备AlN烧结体。
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2.发明授权Aluminum nitride, aluminum nitride containing solid solutions and aluminum nitride composites prepared by combustion synthesis 失效通过燃烧合成制备的氮化铝，含氮化铝的固溶体和氮化铝复合材料
公开(公告)号：US5649278A
公开(公告)日：1997-07-15
申请号：US532729
申请日：1995-09-26
IPC分类号： C04B41/83 , C01B21/06 , C01B21/072 , C01B21/076 , C04B35/581 , C04B35/65 , C04B35/80 , C04B41/50 , C04B41/85 , C04B41/88 , B22F1/00
CPC分类号： C04B41/009 , C01B21/0602 , C01B21/072 , C01B21/0722 , C04B35/651 , C04B35/806 , C04B41/5089 , C04B41/85 , C01P2002/50 , C01P2004/10 , C01P2004/20 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2006/10 , C01P2006/12 , C01P2006/80 , Y10T428/12042
摘要： Aluminum nitride powder, aluminum nitride platelets, powdered solid solutions of aluminum nitride and at least one other ceramic material such as silicon carbide, and composites of aluminum nitride and transition metal borides or carbides are prepared by combustion synthesis at low gaseous nitrogen pressures. Porous bodies of aluminum nitride or composites of aluminum nitride and transition metal borides or carbides are also prepared by combustion synthesis at these pressures. The porous bodies are suitable for infiltration, either as formed or after being coated with at least one layer of a silicate material, by polymers or metals.
摘要翻译： PCT No.PCT / US94 / 00925 Sec。 371日期：1995年9月26日 102（e）1995年9月26日PCT PCT 1994年1月27日PCT公布。 WO94 / 22786 PCT公开号 日期1994年10月13日氮化铝粉末，氮化铝片状粉末状固体溶液和至少一种其他陶瓷材料如碳化硅，以及氮化铝和过渡金属硼化物或碳化物的复合材料通过低气体的燃烧合成 氮气压力。 氮化铝的多孔体或氮化铝和过渡金属硼化物或碳化物的复合物也通过在这些压力下的燃烧合成来制备。 多孔体适合于通过聚合物或金属形成或涂覆有至少一层硅酸盐材料之后的渗透。
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3.发明授权Method for forming beta-silicon carbide whiskers, singly or in a matrix, using an organotitanium coordination compound catalyst 失效使用有机钛配位化合物催化剂单独或以基质形成β-碳化硅晶须的方法
公开(公告)号：US5383421A
公开(公告)日：1995-01-24
申请号：US64527
申请日：1993-05-19
IPC分类号： C04B35/565 , C04B35/584 , C04B35/622 , C04B35/80 , C30B25/00 , C30B1/10
CPC分类号： C04B35/80 , C04B35/565 , C04B35/584 , C04B35/622 , C30B25/005 , C30B29/36
摘要： Beta-silicon carbide whiskers of superior uniformity can be formed, either singly or in-situ in a matrix, by heating a source for silicon with a source of carbon (greater than 0 percent but less than or equal to about 60 percent of stoichiometric, with respect to the silicon source) in the presence of a titanium-containing catalyst, such as titanocene dichloride. Advantageously, the titanium catalyst can be applied by drying a solution of the titanium catalyst on the carbon and silicon sources. The titanium, carbon and silicon sources are then heated together, preferably to between about 1800.degree. C. and about 1850.degree. C., resulting in a product containing high quality beta-silicon carbide whiskers. The silicon source can be silicon nitride powder, which can either be substantially converted to free-flowing whiskers, or in the alternative, the silicon nitride powder, carbon source and titanium catalyst can be formed into a conventional ceramic matrix prior to conversion to beta-silicon carbide whiskers, so the whiskers formed therein will serve as a reinforcement for the ceramic matrix.
摘要翻译： 通过用碳源（大于0％但小于或等于化学计量的约60％）加热硅源，可以在基质中单独或原位形成均匀性优异的β-碳化硅晶须， 相对于硅源）在含钛催化剂（例如二氯二茂钛）的存在下进行。 有利地，可以通过将钛催化剂的溶液干燥在碳源和硅源上来施加钛催化剂。 然后将钛，碳和硅源一起加热，优选在约1800℃至约1850℃之间，产生含有高质量β-碳化硅晶须的产品。 硅源可以是氮化硅粉末，其可以基本上转化为自由流动的晶须，或者替代地，氮化硅粉末，碳源和钛催化剂可以在转化成β- 碳化硅晶须，因此其中形成的晶须将用作陶瓷基体的增强材料。
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公开(公告)号：US08865845B2
公开(公告)日：2014-10-21
申请号：US12091811
申请日：2006-10-25
申请人： Paul J. Popa , Lynne K. Mills , Kevin E. Howard
发明人： Paul J. Popa , Lynne K. Mills , Kevin E. Howard
IPC分类号： C08F283/12 , G03F7/09 , C08G77/58 , G03F7/075
CPC分类号： G03F7/091 , C08G77/58 , G03F7/0757
摘要： The invention relates to silsesquioxane-titania hybrid polymers, wherein the titania domain size is less than about five nanometers. Such polymers are useful, for example, to form anti-reflection coatings in the fabrication of microelectronic devices.
摘要翻译： 本发明涉及倍半硅氧烷 - 二氧化钛杂化聚合物，其中二氧化钛域的尺寸小于约5纳米。 这样的聚合物可用于例如在微电子器件的制造中形成抗反射涂层。
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5.发明授权Method of making moisture resistant aluminum nitride powder and powder produced thereby 失效制造耐湿氮化铝粉末的方法和由此制备的粉末
公开(公告)号：US5234712A
公开(公告)日：1993-08-10
申请号：US895496
申请日：1992-06-08
申请人： Kevin E. Howard
发明人： Kevin E. Howard
IPC分类号： C04B41/87 , C01B21/072 , C01B21/082 , C04B41/45 , C04B41/81 , C08K9/02 , C08K9/06 , C09C1/40 , C09C3/00
CPC分类号： C04B41/4584 , C01B21/0728 , C04B41/81 , C08K9/02 , C08K9/06 , C09C1/40 , C09C3/006 , C01P2004/86 , Y10T428/2982 , Y10T428/2991 , Y10T428/2995
摘要： A method for making a moisture-resistant aluminum nitride-containing powder which includes (a) coating a layer of silicate onto aluminum nitride-containing powder having aluminum nitride on at least a portion of its surface and (b) heat-treating the coated aluminum nitride-containing powder at a temperature of from about 350.degree. to about 1000.degree. C. for a period of time sufficient to cause the silicate to react with the surface aluminum nitride thereby forming a layer of Si-Al-O-N bonded to the surface aluminum nitride. The silicate has alkyl or alkoxyalkyl radicals attached thereto. The method yields a moisture- resistant aluminum nitride-containing powder having a layer of Si-Al-O-N reaction-bonded to the surface aluminum nitride.
摘要翻译： 一种制造耐湿氮化铝的粉末的方法，其包括（a）在其表面的至少一部分上将含硅氮化物的氮化铝粉末涂覆到含氮化铝的粉末上，以及（b）将所述涂覆的铝 含氮化物的粉末在约350℃至约1000℃的温度下持续一段足以使硅酸盐与表面氮化铝反应的时间，从而形成结合到表面铝上的Si-Al-ON层 氮化物。 硅酸盐具有与其连接的烷基或烷氧基烷基。 该方法产生具有与表面氮化铝反应结合的Si-Al-O-N层的耐湿氮化铝粉末。
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6.发明授权Porous body precursors, shaped porous bodies, processes for making them, and end-use products based upon the same 失效多孔体前体，成形多孔体，制造方法以及基于其的最终用途产品公开(公告)号：US08685883B2
公开(公告)日：2014-04-01
申请号：US12988317
申请日：2009-04-29
CPC分类号： B01J27/055 , B01J21/04 , B01J23/50 , B01J23/66 , B01J23/688 , B01J35/002 , B01J35/1009 , B01J35/1038 , B01J35/1042 , B01J37/0009 , B01J37/0018 , B01J37/0201 , B01J37/0203 , B01J37/0205 , B01J37/0213 , C07D301/10
摘要： The present invention provides porous body precursors and shaped porous bodies. Also included are catalysts and other end-use products based upon the shaped porous bodies and thus the porous body precursors. Finally, processes for making these are provided. The porous body precursors comprise a precursor alumina blend capable of enhancing one or more properties of a shaped porous body based thereupon. The need to employ modifiers to achieve a similar result may thus be substantially reduced, or even avoided, and cost savings are thus provided, as well as savings in time and equipment costs.
摘要翻译： 本发明提供多孔体前体和成形多孔体。 还包括基于成形多孔体和因此多孔体前体的催化剂和其它最终用途产品。 最后，提供了制作这些的过程。 多孔体前体包括能够增强基于其的成形多孔体的一个或多个性质的前体氧化铝共混物。 因此可以显着减少或甚至避免使用改性剂来实现类似结果的需要，从而提供成本节约，以及节省时间和设备成本。
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7.发明申请POROUS BODY PRECURSORS, SHAPED POROUS BODIES, PROCESSES FOR MAKING THEM, AND END-USE PRODUCTS BASED UPON THE SAME 失效多孔体系前身，成形多孔体，制造方法以及基于其的最终用途产品公开(公告)号：US20110059844A1
公开(公告)日：2011-03-10
申请号：US12988317
申请日：2009-04-29
IPC分类号： B01J21/04
CPC分类号： B01J27/055 , B01J21/04 , B01J23/50 , B01J23/66 , B01J23/688 , B01J35/002 , B01J35/1009 , B01J35/1038 , B01J35/1042 , B01J37/0009 , B01J37/0018 , B01J37/0201 , B01J37/0203 , B01J37/0205 , B01J37/0213 , C07D301/10
摘要： The present invention provides porous body precursors and shaped porous bodies. Also included are catalysts and other end-use products based upon the shaped porous bodies and thus the porous body precursors. Finally, processes for making these are provided. The porous body precursors comprise a precursor alumina blend capable of enhancing one or more properties of a shaped porous body based thereupon. The need to employ modifiers to achieve a similar result may thus be substantially reduced, or even avoided, and cost savings are thus provided, as well as savings in time and equipment costs.
摘要翻译： 本发明提供多孔体前体和成形多孔体。 还包括基于成形多孔体和因此多孔体前体的催化剂和其它最终用途产品。 最后，提供了制作这些的过程。 多孔体前体包括能够增强基于其的成形多孔体的一个或多个性质的前体氧化铝共混物。 因此可以显着减少或甚至避免使用改性剂来实现类似结果的需要，从而提供成本节约，以及节省时间和设备成本。
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公开(公告)号：US06936191B2
公开(公告)日：2005-08-30
申请号：US10247905
申请日：2002-09-20
申请人： Richard T. Fox , Susan J. Babinec , Kevin E. Howard , Mark A. Chartier , Todd M. Clarey , Ruseell B. Peters, Jr.
发明人： Richard T. Fox , Susan J. Babinec , Kevin E. Howard , Mark A. Chartier , Todd M. Clarey , Ruseell B. Peters, Jr.
摘要： Disclosed is an electrically conductive thermoplastic polymer composition comprising a thermoplastic polymer and a synergistic combination of metal fibers and metal-coated fibers, structures made therefrom, and a process to make said compositions and structures.
摘要翻译： 公开了一种导电热塑性聚合物组合物，其包含热塑性聚合物和金属纤维和金属涂覆纤维的协同组合，由其制备的结构，以及制备所述组合物和结构的方法。
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9.发明授权Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same 失效用氮化铝填充树脂封装的半导体器件及其制备方法
公开(公告)号：US5627107A
公开(公告)日：1997-05-06
申请号：US474228
申请日：1995-06-07
申请人： Kevin E. Howard
发明人： Kevin E. Howard
IPC分类号： C01B21/072 , C04B41/81 , C08K9/02 , C08K9/06 , H01L21/60
CPC分类号： C04B41/81 , C01B21/0728 , C08K9/02 , C08K9/06
摘要： Semiconductor devices are encapsulated in a thermosetting resin filled with aluminum nitride particles. The aluminum nitride particles have an outer layer of Al-O-N, into which is incorporated amorphous Si-O, which renders them hydrolyrically stable. The aluminum nitride particles impart very high thermal conductivity to the cured resin. In addition, the cured resin has a CTE similar to that of the encapsulated semiconductor device, and has excellent dielectric properties.
摘要翻译： 半导体器件封装在填充有氮化铝颗粒的热固性树脂中。 氮化铝颗粒具有Al-O-N的外层，其中掺入非晶Si-O，使其水解稳定。 氮化铝颗粒对固化树脂赋予非常高的导热性。 此外，固化树脂具有与封装的半导体器件类似的CTE，并且具有优异的介电性能。
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10.发明授权公开(公告)号：US07115531B2
公开(公告)日：2006-10-03
申请号：US09933535
申请日：2001-08-20
申请人： Edward O. Shaffer, II , Kevin E. Howard , Joost J. M. Waeterloos , Jack E. Hetzner , Paul H. Townsend, III , Lynne K. Mills , Sheila Gombar-Fetner , Larry R. Wilson
发明人： Edward O. Shaffer, II , Kevin E. Howard , Joost J. M. Waeterloos , Jack E. Hetzner , Paul H. Townsend, III , Lynne K. Mills , Sheila Gombar-Fetner , Larry R. Wilson
IPC分类号： H01L21/469 , H01L21/31
CPC分类号： H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/0332 , H01L21/31144 , H01L21/3121 , H01L21/76801 , H01L21/7681 , H01L21/76811 , H01L21/76813 , H01L21/76829 , H01L21/76835 , H01L23/53238 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.
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