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1.发明授权Method of producing a scribelined layout structure for plastic encapsulated circuits 失效生产塑料封装电路的划线布局结构的方法
公开(公告)号：US5336456A
公开(公告)日：1994-08-09
申请号：US990358
申请日：1992-12-15
CPC分类号： H01L23/3107 , B29C37/0082 , B29C45/14311 , B29C70/683 , B29C70/70 , B29L2031/3425 , H01L2924/0002
摘要： A method of producing surface features having topological variances in the scribeline areas of a wafer adjacent to the dies. Surface features are used to reduce fracturing of molding compound and to prevent movement of the molding compound with respect to the surface of a die in a plastic encapsulated integrated circuit.
摘要翻译： 一种在与模具相邻的晶片的划线区域中产生具有拓扑方差的表面特征的方法。 表面特征用于减少模塑料的压裂并防止模塑料在塑料封装的集成电路中相对于模具的表面移动。
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2.发明授权公开(公告)号：US07823279B2
公开(公告)日：2010-11-02
申请号：US10113502
申请日：2002-04-01
IPC分类号： H01R43/00
CPC分类号： H01L23/50 , G11C5/147 , G11C16/30 , H01L24/48 , H01L2224/32225 , H01L2224/451 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19104 , Y10T29/41 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active.
摘要翻译： 封装的装置可以设置有封装电源。 当封装的器件不活动时，封装内的电源可以选择性地耦合到另一个部件。
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公开(公告)号：US06704204B1
公开(公告)日：2004-03-09
申请号：US09103110
申请日：1998-06-23
IPC分类号： H05K114
CPC分类号： H05K5/026 , H01L23/32 , H01L2924/0002 , H01R12/83 , H01R13/50 , H01R13/6485 , H01R13/665 , H05K5/0286 , H01L2924/00
摘要： An apparatus and method for allowing the lead pins of an integrated circuit (IC) package to provide the electrical interface between the IC package and a receptacle of the host data processing system is described. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card and the data processing system into which the IC card is inserted. Thus, the present invention eliminates the need for a printed circuit board (PCB) and connector to provide the interconnection between the IC package and the data processing system.
摘要翻译： 描述了一种用于允许集成电路（IC）封装的引线引脚提供IC封装和主机数据处理系统的插座之间的电接口的装置和方法。 本发明包括容纳在卡壳内以形成IC卡的IC封装，IC封装的引线提供IC卡与插入IC卡的数据处理系统之间的电接口。 因此，本发明不需要印刷电路板（PCB）和连接器来提供IC封装和数据处理系统之间的互连。
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公开(公告)号：US07533457B2
公开(公告)日：2009-05-19
申请号：US11173219
申请日：2005-06-30
CPC分类号： H01L23/3121 , H01L21/565 , H01L24/97 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/0052 , H05K3/284 , H05K2201/10106 , H05K2201/10446 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , H01L2924/00014 , H01L2924/00012
摘要： A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
摘要翻译： 一种方法包括使用组件填充电路板，并用材料封装电路板和组件。 该方法还包括将电路板分离成多个单独的装置。
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公开(公告)号：US06655022B1
公开(公告)日：2003-12-02
申请号：US09160535
申请日：1998-09-24
IPC分类号： H05K328
CPC分类号： H01L23/4985 , H01L23/16 , H01L2924/0002 , H01R4/024 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： A method of implementing a micro BGA is introduced. More specifically, the method discloses packaging an integrated circuit into an integrated circuit assembly. The method first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
摘要翻译： 介绍了实现微BGA的方法。 更具体地，该方法公开了将集成电路封装到集成电路组件中。 该方法首先将聚酰亚胺胶带安装到引线框架上。 聚酰亚胺胶带用作集成电路封装的基板。 接下来，将一片弹性体连接到所述聚酰亚胺胶带上。 然后将集成电路模具附接到所述弹性体。 然后将引线束从所述管芯上的接合焊盘接合到所述引线框架。 焊球附接到所述引线框架。 附着的焊球可以位于所述模具的区域之外。
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公开(公告)号：US06547570B2
公开(公告)日：2003-04-15
申请号：US09792675
申请日：2001-02-23
IPC分类号： H01R1201
CPC分类号： H01R13/6273 , H01R13/22
摘要： An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.
摘要翻译： 允许集成电路（IC）封装的引线提供在IC封装内容纳的IC芯片与要插入主机数据处理系统的IC卡的卡连接器之间的电接口的装置和方法。 本发明包括容纳在卡外壳内以形成IC卡的IC封装，IC封装的引线提供IC卡连接器和IC封装之间的电接口。 IC卡连接器然后提供IC卡和数据处理系统之间的电接口。 本发明消除了对印刷电路板（PCB）和将IC封装耦合到PCB的焊接步骤的需要。
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公开(公告)号：US06356456B2
公开(公告)日：2002-03-12
申请号：US09103109
申请日：1998-06-23
申请人： Steven R. Eskildsen
发明人： Steven R. Eskildsen
IPC分类号： H05K712
CPC分类号： H05K5/0265 , H05K5/0286
摘要： A method and apparatus for retaining an electronic function card in the receptacle of a host data processing system (host socket) is described. The present invention exerts a retention force on the card in addition to the frictional forces exerted on each of the connector contacts inserted into the host socket. By increasing the retention forces exerted on an electronic function inserted into a host socket, the chance of the card dislodging from the host socket during a mechanical shock event is reduced. The present invention also provides tactile and/or auditory feedback to the user to indicate when the card is fully inserted into the host socket. Further, a card extractor may be coupled to the retainer of the present invention. When disengaged, the card extractor will release the retention force on the card and the card may be easily removed from the host socket.
摘要翻译： 描述了用于将电子功能卡保持在主机数据处理系统（主机插座）的插座中的方法和装置。 除了施加在插入主机插座中的每个连接器触头上的摩擦力之外，本发明还在卡上施加保持力。 通过增加施加在插入主机插座中的电子功能上的保持力，减少了在机械冲击事件期间从主机插座移除的机会。 本发明还提供对用户的触觉和/或听觉反馈以指示卡何时完全插入主机插座。 此外，卡提取器可以联接到本发明的保持器。 当分离时，卡提取器将释放卡上的保持力，并且卡可以容易地从主机插座中移除。
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公开(公告)号：US20110012670A1
公开(公告)日：2011-01-20
申请号：US12888888
申请日：2010-09-23
IPC分类号： G11C5/14
CPC分类号： H01L23/50 , G11C5/147 , G11C16/30 , H01L24/48 , H01L2224/32225 , H01L2224/451 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19104 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A device with an in package power supply may be utilized to supply power to other components. As a result, the overall system size may be reduced and economies may be achieved.
摘要翻译： 可以使用具有封装电源的装置向其它部件供电。 因此，整体系统规模可能会降低，可能会实现经济效益。
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9.发明授权Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size 有权集成电路芯片具有靠近相邻侧面的接合焊盘，以允许骰子堆叠，而不考虑裸片尺寸公开(公告)号：US06605875B2
公开(公告)日：2003-08-12
申请号：US09475451
申请日：1999-12-30
申请人： Steven R. Eskildsen
发明人： Steven R. Eskildsen
IPC分类号： H01L2348
CPC分类号： H01L25/0657 , H01L21/561 , H01L23/3121 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2225/0651 , H01L2225/06555 , H01L2225/06558 , H01L2225/06562 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15173 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size. A lower die has keep out areas on its top surface. The keep out areas correspond to two adjacent edges of the lower die. The lower die has bond pads within the keep out areas. An upper die is stacked on the top surface of the lower die such that the bond pads within the keep out areas of the lower die are exposed to accept wire bonds. The configuration of the keep out areas next to adjacent edges of the lower die thus provides flexibility in the design of stacked chip packages because the size of the upper die is not limited by the bond pad configuration of the lower die.
摘要翻译： 集成电路芯片具有靠近相邻侧面的接合焊盘，以允许骰子堆叠，而不考虑裸片尺寸。 下模具在其顶部表面上保留区域。 保留区域对应于下模具的两个相邻边缘。 下模具在保持区域内具有接合垫。 上模具堆叠在下模具的顶表面上，使得下模具的保持区域内的接合焊盘暴露以接合引线接合。 由于上模的尺寸不受下模的接合焊盘结构的限制，因此在下模的相邻边缘旁边的保持区的配置提供了堆叠芯片封装的设计的灵活性。
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公开(公告)号：US06489557B2
公开(公告)日：2002-12-03
申请号：US09385924
申请日：1999-08-30
IPC分类号： H01L2302
CPC分类号： H01L23/16 , H01L23/3128 , H01L23/4951 , H01L23/4985 , H01L2224/32225 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
摘要： The present invention introduces a method of implementing micro BGA. More specifically, the present invention discloses a method of packaging an integrated circuit into an integrated circuit assembly. The method of the present invention first mounts polyimide tape to a lead frame. The polyimide tape serves as a substrate for the integrated circuit package. Next, a piece of elastomer is coupled to said polyimide tape. Then an integrated circuit die is attached to said elastomer. Lead beams are then bonded from bond pads on said die to said lead frame. Solder balls are attached to said lead frame. The attached solder balls may be located beyond the area of said die.
摘要翻译： 本发明引入了实现微BGA的方法。 更具体地，本发明公开了一种将集成电路封装到集成电路组件中的方法。 本发明的方法首先将聚酰亚胺胶带安装在引线框架上。 聚酰亚胺胶带用作集成电路封装的基板。 接下来，将一片弹性体连接到所述聚酰亚胺胶带上。 然后将集成电路模具附接到所述弹性体。 然后将引线束从所述管芯上的接合焊盘接合到所述引线框架。 焊球附接到所述引线框架。 附着的焊球可以位于所述模具的区域之外。
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