公开(公告)号：US09837308B2

公开(公告)日：2017-12-05

申请号：US14384861

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Nobutaka Mizutani ,  Takashi Tanaka ,  Yuichiro Inatomi ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: H01L21/768 ,  H01L21/288 ,  C23C18/18 ,  C23C18/16 ,  C23C18/38 ,  C23C14/02 ,  C23C16/02 ,  C23C28/00 ,  C23C14/24 ,  C23C14/04 ,  C23C16/04

CPC classification number: H01L21/76867 ,  C23C14/024 ,  C23C14/046 ,  C23C14/24 ,  C23C16/0272 ,  C23C16/045 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1694 ,  C23C18/1844 ,  C23C18/1893 ,  C23C18/38 ,  C23C28/322 ,  C23C28/34 ,  H01L21/288 ,  H01L21/76841 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76898

Abstract: A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.

公开(公告)号：US09653350B2

公开(公告)日：2017-05-16

申请号：US14548794

申请日：2014-11-20

Applicant: Tokyo Electron Limited

Inventor： Takashi Tanaka ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: B05D3/00 ,  H01L21/768 ,  C23C18/18 ,  B05D3/02 ,  B05D3/10 ,  C23C18/40 ,  C23C18/48

CPC classification number: H01L21/76874 ,  B05D3/002 ,  B05D3/02 ,  B05D3/10 ,  C23C18/1893 ,  C23C18/40 ,  C23C18/48 ,  H01L21/76898

Abstract: Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent.

公开(公告)号：US09552994B2

公开(公告)日：2017-01-24

申请号：US14384465

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Inatomi ,  Takashi Tanaka ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: H01L21/288 ,  C23C18/16 ,  H01L21/768

CPC classification number: H01L21/288 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1669 ,  C23C18/1676 ,  H01L21/76849

Abstract: A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.

Abstract translation: 电镀装置20包括：基板保持装置110，被配置为保持和旋转基板2; 第一放电装置30，被配置为将电镀液体朝向保持在基板保持装置110上的基板2排出; 以及设置在基板2的上方并具有开口部22的顶板21.第一排出装置30包括：第一排出部33，被配置为朝向基板2排出电镀液，第一排出部33构成为 在排出电镀液体的排出位置与排出液体的待机位置之间移动。 此外，第一排出单元33构造成在排出位置处与顶板21的开口22重叠。

公开(公告)号：US20150099355A1

公开(公告)日：2015-04-09

申请号：US14384465

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Inatomi ,  Takashi Tanaka ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: H01L21/288 ,  C23C18/16

CPC classification number: H01L21/288 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1669 ,  C23C18/1676 ,  H01L21/76849

Abstract: A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.

Abstract translation: 电镀装置20包括：基板保持装置110，被配置为保持和旋转基板2; 第一放电装置30，被配置为将电镀液体朝向保持在基板保持装置110上的基板2排出; 以及设置在基板2的上方并具有开口部22的顶板21.第一排出装置30包括：第一排出部33，被配置为朝向基板2排出电镀液，第一排出部33构成为 在排出电镀液体的排出位置与排出液体的待机位置之间移动。 此外，第一排出单元33构造成在排出位置处与顶板21的开口22重叠。

公开(公告)号：US11631581B2

公开(公告)日：2023-04-18

申请号：US16604744

申请日：2018-03-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Makoto Muramatsu ,  Yusuke Saito ,  Hisashi Genjima ,  Hiroyuki Fujii

IPC: H01L21/324 ,  H01L21/02 ,  B05D3/06

Abstract: A technique for obtaining good film quality in forming a silicon-oxide-containing insulating film as a coating film on a substrate. A coating liquid containing polysilazane is applied to a wafer, a solvent in the coating liquid is volatilized, and then the coating film is irradiated with ultraviolet rays under a nitrogen atmosphere before performing a curing process. Thus, dangling bonds are likely to be formed at hydrolyzed portions in polysilazane. Since dangling bonds are formed in advance at portions in silicon to be hydrolyzed, productivity of hydroxyl groups is enhanced. That is, since an energy required for hydrolysis is reduced, the number of the portions remaining without being hydrolyzed is reduced even when the curing process is performed at a low temperature. Therefore, dehydration synthesis occurs efficiently, which increases a crosslinking rate and makes it possible to form a dense (good film quality) insulating film.

公开(公告)号：US10030308B2

公开(公告)日：2018-07-24

申请号：US14384495

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Takashi Tanaka ,  Yuichiro Inatomi ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: B05D3/10 ,  C23C18/16 ,  C23C18/30 ,  C23C18/18 ,  C25D17/00 ,  H01L21/768 ,  H01L21/288 ,  H01L23/48 ,  C23C18/38

Abstract: A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.

公开(公告)号：US20160284592A1

公开(公告)日：2016-09-29

申请号：US15077988

申请日：2016-03-23

Applicant: Tokyo Electron Limited

Inventor： Tomohisa Hoshino ,  Masato Hamada ,  Takashi Tanaka ,  Yuichiro Inatomi ,  Yusuke Saito

IPC: H01L21/768 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/76874 ,  B05D1/005 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/32 ,  C23C18/38 ,  C23C18/50 ,  H01L21/288 ,  H01L21/67051 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76898

Abstract: An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.

Abstract translation: 可以在基板的表面上形成由薄膜形成的粘附层。 在基板上形成粘合层的粘合层形成方法包括在旋转基板2的同时将耦合剂提供到基板2上。基板2以等于或小于300rpm的低速旋转，并且用 IPA被提供到基板2上。

公开(公告)号：US20160247683A1

公开(公告)日：2016-08-25

申请号：US15047690

申请日：2016-02-19

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Inatomi ,  Takashi Tanaka ,  Nobutaka Mizutani ,  Yusuke Saito ,  Kazutoshi Iwai ,  Mitsuaki Iwashita

IPC: H01L21/288 ,  C23C18/16 ,  H01L21/687 ,  H01L21/67 ,  H01L21/02 ,  H01L21/768

CPC classification number: H01L21/76874 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1889 ,  C23C18/38 ,  C23C18/50 ,  C25D7/12 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76898

Abstract: A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2a to adsorb the catalyst 22A onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate 2 and an inside of the recess 2a by supplying a rinse liquid; drying the surface of the substrate 2 and the inside of the recess 2a. Further, by supplying a binder solution 34 containing a binder 22B onto the substrate 2, the catalyst 22A on the surface of the substrate 2 is bound to the substrate 2 by the binder 22B.

Abstract translation: 吸附在基板的表面上的催化剂结合到基板上，而不会在基板的凹槽内残留残留物。 催化剂层形成方法包括通过将催化剂溶液32供给到具有凹部2a的基板2上来形成催化剂层22，以将催化剂22A吸附到基板的表面上并到达凹部的内表面; 通过提供冲洗液来冲洗基底2的表面和凹槽2a的内部; 干燥基板2的表面和凹部2a的内部。 此外，通过将含有粘合剂22B的粘合剂溶液34供给到基板2上，基板2的表面上的催化剂22A通过粘合剂22B与基板2结合。

公开(公告)号：US20150140816A1

公开(公告)日：2015-05-21

申请号：US14548794

申请日：2014-11-20

Applicant: Tokyo Electron Limited

Inventor： Takashi Tanaka ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: H01L21/768

CPC classification number: H01L21/76874 ,  B05D3/002 ,  B05D3/02 ,  B05D3/10 ,  C23C18/1893 ,  C23C18/40 ,  C23C18/48 ,  H01L21/76898

Abstract: Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent.

Abstract translation: 催化金属纳米颗粒可以附着在基底上。 电镀用预处理方法包括：在基板表面上形成含催化剂颗粒膜的催化剂颗粒膜成膜方法，该方法是向基板上提供通过分散催化金属纳米粒子制备的催化剂颗粒溶液 和分散剂在含有水的溶剂中; 通过将基板加热至第一温度来除去至少含有催化剂颗粒的膜中含有的水分的第一加热方法; 以及通过将基板加热至高于第一加热处理后的第一温度的第二温度并将分散剂聚合成具有片状的第二加热方法，并且通过用催化金属纳米粒子覆盖催化金属纳米颗粒而将催化金属纳米颗粒固定在基底层上 片状分散剂。

公开(公告)号：US20150030774A1

公开(公告)日：2015-01-29

申请号：US14384495

申请日：2013-02-22

Applicant: Tokyo Electron Limited

Inventor： Takashi Tanaka ,  Yuichiro Inatomi ,  Nobutaka Mizutani ,  Yusuke Saito ,  Mitsuaki Iwashita

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/18

CPC classification number: C23C18/1694 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1676 ,  C23C18/1678 ,  C23C18/1696 ,  C23C18/18 ,  C23C18/1889 ,  C23C18/30 ,  C23C18/38 ,  C25D17/001 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76864 ,  H01L21/76874 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.

Abstract translation: 电镀方法可以改善与下层的粘合性。 在基板上进行电镀处理的电镀方法包括在基板2上形成作为阻挡膜的第一镀层23a; 烘烤第一镀层23a; 形成用作阻挡膜的第二镀层23b; 并烘烤第二镀层23b。 用作阻挡膜的镀层层叠体23由第一镀层23a和第二镀层23b形成。