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公开(公告)号:US12272585B2
公开(公告)日:2025-04-08
申请号:US17241666
申请日:2021-04-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ting-Jung Chen , Shih-Wei Lin , Lee-Chuan Tseng
IPC: H01L21/683 , C23C14/50 , C23C14/54 , C23C14/58 , C23C16/458 , C23C16/46 , H01J37/32 , H01L21/67 , H01L21/768
Abstract: In some embodiments, the present disclosure relates to a process tool that includes a chamber housing defined by a processing chamber, and a wafer chuck structure arranged within the processing chamber. The wafer chuck structure is configured to hold a wafer during a fabrication process. The wafer chuck includes a lower portion and an upper portion arranged over the lower portion. The lower portion includes trenches extending from a topmost surface towards a bottommost surface of the lower portion. The upper portion includes openings that are holes, extend completely through the upper portion, and directly overlie the trenches of the lower portion. Multiple of the openings directly overlie each trench. Further, cooling gas piping is coupled to the trenches of the lower portion of the wafer chuck structure, and a cooling gas source is coupled to the cooling gas piping.
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公开(公告)号:US20230375785A1
公开(公告)日:2023-11-23
申请号:US18362121
申请日:2023-07-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wei Lin
CPC classification number: G02B6/305 , G02B6/1228
Abstract: Structures and methods including a waveguide having a cladding layer surrounding a core layer disposed over a substrate, a cavity extending into the substrate adjacent the waveguide, a fiber disposed in the cavity, and an isolation space extending into the substrate and disposed under the waveguide. A plurality of holes may extend through the cladding layer adjacent the core layer.
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公开(公告)号:US20210135024A1
公开(公告)日:2021-05-06
申请号:US16910566
申请日:2020-06-24
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chen-Hao Chiang , Shih-Wei Lin , Eugene I-Chun Chen , Yi-Chen Chen
IPC: H01L31/0232 , H01L31/028 , H01L31/18 , G02B6/12 , G02B6/124 , G02B6/136 , G02B6/13
Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a first doped region having a first doping type disposed in a semiconductor substrate. A second doped region having a second doping type different than the first doping type is disposed in the semiconductor substrate and laterally spaced from the first doped region. A waveguide structure is disposed in the semiconductor substrate and laterally between the first doped region and the second doped region. A photodetector is disposed at least partially in the semiconductor substrate and laterally between the first doped region and the second doped region. The waveguide structure is configured to guide one or more photons into the photodetector. The photodetector has an upper surface that continuously arcs between opposite sidewalls of the photodetector. The photodetector has a lower surface that continuously arcs between the opposite sidewalls of the photodetector.
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公开(公告)号:US20150069539A1
公开(公告)日:2015-03-12
申请号:US14023572
申请日:2013-09-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chih-Jen Chan , Lee-Chuan Tseng , Shih-Wei Lin , Che-Ming Chang , Chung-Yen Chou , Yuan-Chih Hsieh
IPC: B81C1/00 , B81B7/00 , H01L21/322
CPC classification number: B81C1/00285 , B81B2201/0235 , B81B2201/0242 , B81B2207/015 , B81C2203/0118 , H01L23/26 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by increasing an area in which a getter layer is deposited, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having one or more residual gases. A cavity is formed within a top surface of the substrate. The cavity has a bottom surface and sidewalls extending from the bottom surface to the top surface. A getter layer, which absorbs the one or more residual gases, is deposited over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. By depositing the getter layer to extend to a location on the sidewalls of the cavity, the area of the substrate that is able to absorb the one or more residual gases is increased.
Abstract translation: 本公开涉及一种通过增加其中沉积吸气剂层的区域和相关联的装置来提供高效吸气过程的吸气方法。 在一些实施例中,通过将衬底提供到具有一个或多个残余气体的处理室中来执行该方法。 在衬底的顶表面内形成空腔。 空腔具有底表面和从底表面延伸到顶表面的侧壁。 吸收一种或多种残余气体的吸气剂层在从腔的底表面延伸到侧壁上的位置的位置上沉积在衬底上。 通过沉积吸气剂层以延伸到腔的侧壁上的位置,能够吸收一种或多种残留气体的衬底的面积增加。
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公开(公告)号:US11693295B2
公开(公告)日:2023-07-04
申请号:US16850867
申请日:2020-04-16
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Ting-Jung Chen , Shih-Wei Lin
CPC classification number: G03B13/36 , G02B7/09 , H04N23/67 , H10N30/03 , H10N30/07 , B81B2201/03 , G03B2205/0053 , H10N30/01
Abstract: In accordance with some embodiments, a method of forming an auto-focusing device is provided. The method includes forming a cantilever beam member. The cantilever beam member has a ring shape. The method further includes forming a piezoelectric member over the cantilever beam member. The method also includes forming a membrane over the cantilever beam member. The membrane has a first region and a second region. The first region has a planar surface, and the second region is located between the first region and an inner edge of the cantilever beam member and has a plurality of corrugation structures. In addition, the method includes applying a liquid optical medium over the membrane and sealing the liquid optical medium with a protection layer.
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公开(公告)号:US20220344193A1
公开(公告)日:2022-10-27
申请号:US17241666
申请日:2021-04-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ting-Jung Chen , Shih-Wei Lin , Lee-Chuan Tseng
IPC: H01L21/683 , H01L21/67 , H01J37/32 , C23C14/50 , C23C14/54 , C23C14/58 , C23C16/458 , C23C16/46
Abstract: In some embodiments, the present disclosure relates to a process tool that includes a chamber housing defined by a processing chamber, and a wafer chuck structure arranged within the processing chamber. The wafer chuck structure is configured to hold a wafer during a fabrication process. The wafer chuck includes a lower portion and an upper portion arranged over the lower portion. The lower portion includes trenches extending from a topmost surface towards a bottommost surface of the lower portion. The upper portion includes openings that are holes, extend completely through the upper portion, and directly overlie the trenches of the lower portion. Multiple of the openings directly overlie each trench. Further, cooling gas piping is coupled to the trenches of the lower portion of the wafer chuck structure, and a cooling gas source is coupled to the cooling gas piping.
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公开(公告)号:US10276634B2
公开(公告)日:2019-04-30
申请号:US15627646
申请日:2017-06-20
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wei Lin , Yuan-Tai Tseng , Shih-Chang Liu
Abstract: A semiconductor memory structure is provided. The semiconductor memory structure includes a bottom electrode formed over a substrate and a magnetic tunneling junction (MTJ) cell formed over the bottom electrode. The semiconductor memory structure includes a top electrode formed over the MTJ cell and a passivation layer surrounding the top electrode. The passivation layer has a recessed portion that is lower than a top surface of the top electrode. The semiconductor memory structure further includes a cap layer formed on the top electrode and the passivation layer, wherein the cap layer is formed in the recessed portion.
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公开(公告)号:US09606081B2
公开(公告)日:2017-03-28
申请号:US14645788
申请日:2015-03-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Che-Ming Chang , Chih-Jen Chan , Chung-Yen Chou , Lee-Chuan Tseng , Shih-Wei Lin , Yuan-Chih Hsieh
IPC: H01L21/00 , G01N27/414 , H01L23/00 , H01L23/528 , B01L3/00
CPC classification number: B81C1/00595 , B01L3/502707 , B01L2200/10 , B01L2300/0887 , B81B1/002 , B81B2201/0214 , B81B2207/07 , B81B2207/096 , B81C1/00 , G01N27/4145 , H01L21/2007 , H01L23/49816 , H01L23/528 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02372 , H01L2224/0239 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184 , H01L2224/05569 , H01L2224/0557 , H01L2224/08225 , H01L2224/13024 , H01L2224/13025 , H01L2224/131 , H01L2224/13124 , H01L2224/13147 , H01L2224/13184 , H01L2224/2919 , H01L2224/32225 , H01L2224/80801 , H01L2224/8385 , H01L2924/1306 , H01L2924/1461 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01074
Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.
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公开(公告)号:US20160266063A1
公开(公告)日:2016-09-15
申请号:US14645788
申请日:2015-03-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Che-Ming Chang , Chih-Jen Chan , Chung-Yen Chou , Lee-Chuan Tseng , Shih-Wei Lin , Yuan-Chih Hsieh
IPC: G01N27/414 , H01L21/02 , B01L3/00 , H01L23/00 , H01L23/528 , H01L21/311 , H01L21/027
CPC classification number: B81C1/00595 , B01L3/502707 , B01L2200/10 , B01L2300/0887 , B81B1/002 , B81B2201/0214 , B81B2207/07 , B81B2207/096 , B81C1/00 , G01N27/4145 , H01L21/2007 , H01L23/49816 , H01L23/528 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02372 , H01L2224/0239 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184 , H01L2224/05569 , H01L2224/0557 , H01L2224/08225 , H01L2224/13024 , H01L2224/13025 , H01L2224/131 , H01L2224/13124 , H01L2224/13147 , H01L2224/13184 , H01L2224/2919 , H01L2224/32225 , H01L2224/80801 , H01L2224/8385 , H01L2924/1306 , H01L2924/1461 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01074
Abstract: A bio-sensing semiconductor structure is provided. A transistor includes a channel region and a gate underlying the channel region. A first dielectric layer overlies the transistor. A first opening extends through the first dielectric layer to expose the channel region. A bio-sensing layer lines the first opening and covers an upper surface of the channel region. A second dielectric layer lines the first opening over the bio-sensing layer. A second opening within the first opening extends to the bio-sensing layer, through a region of the second dielectric layer overlying the channel region. A method for manufacturing the bio-sensing semiconductor structure is also provided.
Abstract translation: 提供了一种生物传感半导体结构。 晶体管包括沟道区和沟道区下面的栅。 第一介电层覆盖晶体管。 第一开口延伸穿过第一电介质层以暴露沟道区。 生物感测层将第一开口排列并覆盖沟道区域的上表面。 第二介电层将生物感测层上的第一开口排列。 第一开口内的第二开口延伸到生物感测层,穿过覆盖沟道区的第二介电层的区域。 还提供了一种制造生物传感半导体结构的方法。
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公开(公告)号:US11226506B2
公开(公告)日:2022-01-18
申请号:US16821160
申请日:2020-03-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wei Lin , Ming Chyi Liu
Abstract: In some embodiments, the present disclosure relates to a modulator device that includes an input terminal configured to receive impingent light. A first waveguide has a first output region and a first input region that is coupled to the input terminal. A second waveguide is optically coupled to the first waveguide and has second input region and a second output region that is coupled to the input terminal. An output terminal coupled to the first output region of the first waveguide and the second output region of the second waveguide is configured to provide outgoing light that is modulated. A heater structure is configured to provide heat to the first waveguide to induce a temperature difference between the first and second waveguides. A gas-filled isolation structure is proximate to the heater structure and is configured to thermally isolate the second waveguide from the heat provided to the first waveguide.
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