摘要:
For example, in a plasma processing system, C4F8 gas and C2H4 gas are introduced as film-forming gases at flow rates of 60 sccm and 30 sccm, respectively, under the conditions of a pressure of 0.2 Pa, a microwave power of 2.7 kW, a radiofrequency power of 1.5 kW, and a wafer temperature of 350° C. At the same time, a plasma gas is also introduced at a flow rate of 150 sccm to form CF film 13 having an F content of, for example, 22% on silicon substrate 11. This CF film 13 has a relative dielectric constant of 2.4.
摘要:
Microwave is introduced into a plasma chamber of a plasma processing apparatus and magnetic field is applied thereto to allow plasma generation gas to be placed in plasma state by the electron cyclotron resonance. This plasma is introduced into a film forming chamber of the plasma processing apparatus to allow film forming gas including compound gas of carbon and fluorine or compound gas of carbon, fluorine and hydrogen, and hydro carbon gas to be placed in plasma state. In addition, an insulating film consisting of fluorine added carbon film is formed by the film forming gas placed in plasma state.
摘要:
Microwave is introduced into a plasma chamber of a plasma processing apparatus and magnetic field is applied thereto to allow plasma generation gas to be placed in plasma state by the electron cyclotron resonance. This plasma is introduced into a film forming chamber of the plasma processing apparatus to allow film forming gas including compound gas of carbon and fluorine or compound gas of carbon, fluorine and hydrogen, and hydro carbon gas to be placed in plasma state. In addition, an insulating film consisting of fluorine added carbon film is formed by the film forming gas placed in plasma state.
摘要:
It is an object of the present invention to provide a process for a fluorine containing carbon film (a CF film), which can put an interlayer insulator film of a fluorine containing carbon film into practice. A conductive film, e.g., a TiN film 41, is formed on a CF film 4. After a pattern of a resist film 42 is formed thereon, the TiN film 41 is etched with, e.g., BCl3 gas. Thereafter, when the surface of the wafer is irradiated with O2 plasma, the CF film is chemically etched, and the resist film 42 is also etched. However, since the TiN film 41 functions as a mask, a predetermined hole can be formed. Although an interconnection layer of aluminum or the like is formed on the surface of the CF film 4, the TiN film 41 functions as an adhesion layer for adhering the interconnection layer to the CF film 4 and serves as a part of the interconnection layer. As the mask, an insulator film of SiO2 or the like may be substituted for the film.
摘要:
This invention is a method of: making a film-forming gas including a compound gas of carbon and fluorine into plasma in a vacuum container 2 including a stage 4 for an object to be processed 10; and applying a bias electric power to the stage 4 in order to draw ions in the plasma toward the object 10 while forming an insulation film consisting of a film of fluorine-added carbon onto the object 10 by the plasma. At first, a first electric power of the bias electric power is applied to the stage 4 and the compound gas of carbon and fluorine is introduced at a first flow rate to form the film of fluorine-added carbon onto the object 10. Then, a second electric power of the bias electric power smaller than the first electric power is applied to the stage 4 and the compound gas of carbon and fluorine is introduced at a second flow rate smaller than the first flow rate to form the film of fluorine-added carbon onto the object 10. According to the invention, in the case of filling up a concave portion having a high aspect ratio with a film of fluorine-added carbon, the film-forming process can be conducted while generating less voids with a raised throughput.
摘要:
The present invention provides a slat band chain for both straight and curved lines and a sprocket made of synthetic resin which the chain can engage with every other tooth of the sprocket. At least three reinforcement ribs 24a-24c connecting the front curled portions 14 with the rear curled portions 16 are installed. The width B, and the length C, of the rear curled portions in the feeding direction are set to the intermediate value of those conventional slat band chains for straight and curved lines.
摘要:
In a semiconductor device, a contact layer is provided between a silicon-containing insulating film SiO2, etc. or a metal wiring layer, and a fluorine-containing carbon CF film to increase their adhesion. For this purpose, SiC film deposition gases, such as SiH4 gas and C2H4 gas, are excited into plasma to stack a SiC film [200] as the contact layer on the top surface of a SiO2 film [110]. After that, switching of deposition gases is conducted for about 1 second by introducing SiH4 gas, C2H4 gas, C4F8 gas and C2H4 gas. Subsequently, CF film deposition gases, such as C4F8 gas and C2H4 gas, for example, are excited into plasma to deposit[e] a CF film [120] on the SiC film [200]. In this way, both the SiC film deposition gases and the CF film deposition gases exist simultaneously during the deposition gas switching step, whereby Si—C bonds are produced near the boundary between the SiC film [200] and the CF film [120] across these films, and they enhance adhesion between these films and hence increase adhesion of the SiO2 film [110] and the CF film [120].
摘要翻译:在半导体器件中,在含硅绝缘膜SiO 2等或金属布线层和含氟碳CF膜之间设置接触层以增加其粘合性。 为此,将SiC膜沉积气体如SiH 4气体和C 2 H 4气体激发到等离子体中以将SiO 2膜[200]作为接触层堆叠在SiO 2膜的顶表面上[110]。 之后,通过引入SiH 4气体,C 2 H 4气体,C 4 F 8气体和C 2 H 4气体,沉积气体的切换进行约1秒。 随后,诸如C 4 F 8气体和C 2 H 4气体的CF膜沉积气体例如被激发到等离子体中以在SiC膜[200]上沉积CF膜[120]。 以这种方式,在沉积气体切换步骤期间,同时存在SiC膜沉积气体和CF膜沉积气体,由此在SiC膜[200]和CF膜[120]之间的边界附近产生Si-C键 这些膜,并且它们增强了这些膜之间的粘附性,因此增加了SiO 2膜[110]和CF膜[120]的粘附性。
摘要:
A novel fire-retardant polymer composition is provided which comprises 100 parts by weight of a polymer such as polyolefins and polystyrenes, 1-30 parts by weight of an oxide or a complex oxide of metals such as antimony, boron, and molybdenum, and 1-30 parts by weight of heat-expandable graphite. The fire-retardant polymer composition emits less amounts of smoke and corrosive gas on burning with the characteristics of the polymer material kept unimpaired.
摘要:
In the present invention, the No. I invention relates to a regenerated PET resin composition which comprises formulating 0.5-100 part by weight of a lactone polymer (B) with 100 parts by weight of a regenerated PET resin (A), in which there is improved a molding processability such as an injection moldability and extruding molding, and relates to a molded article therefrom and, the No. II invention relates to a flame retardant resin composition containing a thermoplastic resin (E) and a flame retardant (F), in which bleeding of the flame retardant is suppressed without a decline of a flame retardancy, and relates to a molded article therefrom.
摘要:
A fire-retardant polymer composition is provided which comprises 100 parts by weight of a polymer such as polystyrene, 1 to 30 parts by weight of heat-expandable graphite, and 1 to 30 parts by weight of a phosphorus compound. The polymer composition is fire-retardant, and emits less smoke and less corrosive gas on burning.