公开(公告)号：US20110042677A1

公开(公告)日：2011-02-24

申请号：US12863202

申请日：2009-11-13

申请人： Takeshi Suzuki ,  Kenichi Hotehama ,  Koichi Hirano ,  Seiichi Nakatani

发明人： Takeshi Suzuki ,  Kenichi Hotehama ,  Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H01L33/08 ,  H01L21/336

CPC分类号： H01L29/66742 ,  H01L29/66765 ,  H01L29/786 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/7869

摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprises a metal layer comprising a gate electrode, a source electrode and a drain electrode; a metal oxide film made from a metal which constitutes the metal layer and formed over a surface region of the metal layer; and a semiconductor layer formed above the gate electrode via the metal oxide film. In the flexible semiconductor device, uncovered portions, each of which is not covered with the metal oxide film, are locally formed in the surface region of the metal layer; and also electrical connections are formed between the source electrode and the semiconductor layer and between the drain electrode and the semiconductor layer via the uncovered portions.

摘要翻译： 提供了一种柔性半导体器件。 本发明的柔性半导体器件包括由栅电极，源电极和漏电极组成的金属层; 由金属制成的金属氧化物膜，其构成金属层并形成在金属层的表面区域上; 以及通过金属氧化物膜形成在栅极电极上方的半导体层。 在柔性半导体器件中，在金属层的表面区域局部形成未被金属氧化物膜覆盖的未覆盖部分， 并且还通过未覆盖部分在源电极和半导体层之间以及在漏电极和半导体层之间形成电连接。

公开(公告)号：US08975626B2

公开(公告)日：2015-03-10

申请号：US12863202

申请日：2009-11-13

申请人： Takeshi Suzuki ,  Kenichi Hotehama ,  Koichi Hirano ,  Seiichi Nakatani

发明人： Takeshi Suzuki ,  Kenichi Hotehama ,  Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H01L33/08 ,  H01L29/66 ,  H01L29/786

CPC分类号： H01L29/66742 ,  H01L29/66765 ,  H01L29/786 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/7869

摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprises a metal layer comprising a gate electrode, a source electrode and a drain electrode; a metal oxide film made from a metal which constitutes the metal layer and formed over a surface region of the metal layer; and a semiconductor layer formed above the gate electrode via the metal oxide film. In the flexible semiconductor device, uncovered portions, each of which is not covered with the metal oxide film, are locally formed in the surface region of the metal layer; and also electrical connections are formed between the source electrode and the semiconductor layer and between the drain electrode and the semiconductor layer via the uncovered portions.

摘要翻译： 提供了一种柔性半导体器件。 本发明的柔性半导体器件包括由栅电极，源电极和漏电极组成的金属层; 由金属制成的金属氧化物膜，其构成金属层并形成在金属层的表面区域上; 以及通过金属氧化物膜形成在栅极电极上方的半导体层。 在柔性半导体器件中，在金属层的表面区域局部形成未被金属氧化物膜覆盖的未覆盖部分， 并且还通过未覆盖部分在源电极和半导体层之间以及在漏电极和半导体层之间形成电连接。

公开(公告)号：US08581247B2

公开(公告)日：2013-11-12

申请号：US13256457

申请日：2010-02-02

申请人： Takeshi Suzuki ,  Kenichi Hotehama ,  Seiichi Nakatani ,  Koichi Hirano ,  Tatsuo Ogawa

发明人： Takeshi Suzuki ,  Kenichi Hotehama ,  Seiichi Nakatani ,  Koichi Hirano ,  Tatsuo Ogawa

IPC分类号： H01L29/10 ,  H01L29/12 ,  H01L21/02

CPC分类号： H01L29/66742 ,  H01L27/1218 ,  H01L29/66757 ,  H01L29/78603 ,  H01L29/78675 ,  H01L29/7869 ,  H01L51/0097 ,  H01L51/0512

摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

摘要翻译： 提供了一种柔性半导体器件。 本发明的柔性半导体器件包括支撑层，形成在支撑层上的半导体结构部分和形成在半导体结构部分上的树脂膜。 树脂膜包括通过激光照射形成的开口，并且与树脂膜的开口部内的导电构件与半导体结构部的表面接触。

公开(公告)号：US20120001173A1

公开(公告)日：2012-01-05

申请号：US13256457

申请日：2010-02-02

申请人： Takeshi Suzuki ,  Kenichi Hotehama ,  Seiichi Nakatani ,  Koichi Hirano ,  Tatsuo Ogawa

发明人： Takeshi Suzuki ,  Kenichi Hotehama ,  Seiichi Nakatani ,  Koichi Hirano ,  Tatsuo Ogawa

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/66742 ,  H01L27/1218 ,  H01L29/66757 ,  H01L29/78603 ,  H01L29/78675 ,  H01L29/7869 ,  H01L51/0097 ,  H01L51/0512

摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

摘要翻译： 提供了一种柔性半导体器件。 本发明的柔性半导体器件包括支撑层，形成在支撑层上的半导体结构部分和形成在半导体结构部分上的树脂膜。 树脂膜包括通过激光照射形成的开口，并且与树脂膜的开口部内的导电构件与半导体结构部的表面接触。

公开(公告)号：US08343822B2

公开(公告)日：2013-01-01

申请号：US12681445

申请日：2009-07-30

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

IPC分类号： H01L21/84 ,  H01L21/00

CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

摘要翻译： 一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层 绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作 （v）中的电极的构成材料。 金属箔不需要剥离，可以使用高温工艺。

公开(公告)号：US20120286264A1

公开(公告)日：2012-11-15

申请号：US13519668

申请日：2011-04-22

申请人： Takeshi Suzuki ,  Seiichi Nakatani ,  Koichi Hirano

发明人： Takeshi Suzuki ,  Seiichi Nakatani ,  Koichi Hirano

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/78603 ,  G02F1/133305 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/1292 ,  H01L29/7869 ,  H01L29/78696 ,  H01L2251/5338 ,  H05B33/10

摘要： There is provided a method for manufacturing a flexible semiconductor device. The method of the present invention comprises the steps of: (a) preparing a metal foil having a concave portion; (b) forming a gate insulating film on a bottom face of the concave portion of the metal foil; (c) forming a semiconductor layer above the bottom face of the concave portion via the gate insulating film while making use of the concave portion as a bank member; and (d) forming a source electrode and a drain electrode such that they make contact with the semiconductor layer.

摘要翻译： 提供了一种用于制造柔性半导体器件的方法。 本发明的方法包括以下步骤：（a）制备具有凹部的金属箔; （b）在金属箔的凹部的底面上形成栅极绝缘膜; （c）通过所述栅极绝缘膜在所述凹部的底面上形成半导体层，同时利用所述凹部作为堤部件; 和（d）形成源电极和漏电极，使其与半导体层接触。

公开(公告)号：US20100283054A1

公开(公告)日：2010-11-11

申请号：US12681445

申请日：2009-07-30

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

摘要： There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved.

摘要翻译： 提供了一种制造柔性半导体器件的方法，其特征在于包括：（i）在金属箔的上表面上形成绝缘膜的步骤，（ii）在金属的上表面上形成引出电极图案的步骤 箔，（iii）以半导体层与引出电极图案接触的方式在绝缘膜上形成半导体层的步骤，（iv）在所述绝缘膜的上表面上形成密封树脂层的步骤 金属箔以密封树脂层覆盖半导体层和引出电极图案，以及（v）通过蚀刻金属箔形成电极的步骤，其中金属箔用作绝缘膜的支撑体， （i）〜（iv）中形成的并用作（v）中的电极的构成材料的引出电极图案，半导体层和密封树脂层。 由于作为支撑体的金属箔不需要最终被剥离，所以可以通过简单的工艺制造TFT元件。 此外，由于使用金属箔作为支撑体，因此可以将绝缘膜和半导体层的制造引入高温处理，从而提高TFT特性。

公开(公告)号：US20090078746A1

公开(公告)日：2009-03-26

申请号：US12282774

申请日：2007-02-22

申请人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： B23K1/20 ,  B23K3/00

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2924/00

摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡生成剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

公开(公告)号：US08887383B2

公开(公告)日：2014-11-18

申请号：US12518358

申请日：2007-11-27

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Takashi Kitae ,  Seiji Karashima ,  Kenichi Hotehama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Takashi Kitae ,  Seiji Karashima ,  Kenichi Hotehama

IPC分类号： H01R9/00 ,  H05K3/00 ,  H05K3/34 ,  H01L23/00 ,  H05K3/24 ,  H01L21/683

CPC分类号： H01L24/12 ,  H01L21/6835 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11522 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83555 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/244 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/0338 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

摘要翻译： 在其上放置焊料凸块的电极结构100包括由选自Cu，Al，Cr和Ti的电极构成材料制成的电极图案50，形成在电极图案的一部分上的Ni层52 50，形成在除了电极图案50的一部分以外的区域的至少一部分上的Pd层54以及形成在Ni层52和Pd层54上的Au层56。

公开(公告)号：US08297488B2

公开(公告)日：2012-10-30

申请号：US12282774

申请日：2007-02-22

申请人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： B23K31/00 ,  B23K31/02

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2924/00

摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡发生剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。