公开(公告)号：US20070200133A1

公开(公告)日：2007-08-30

申请号：US11579770

申请日：2006-03-31

申请人： Akira Hashimoto ,  Masaaki Katsumata ,  Masaaki Hayama ,  Kenichi Endou ,  Kenji Endou ,  Hitoshi Hirano ,  Hidenori Katsumura ,  Tatsuya Inoue

发明人： Akira Hashimoto ,  Masaaki Katsumata ,  Masaaki Hayama ,  Kenichi Endou ,  Kenji Endou ,  Hitoshi Hirano ,  Hidenori Katsumura ,  Tatsuya Inoue

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/32013 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED assembly including a wiring substrate with an opening at its center; a heat sink housed inside the opening; an LED chip mounted on the heat sink; a connecting section for electrically coupling the LED chip and wiring substrate; and a transparent resin covering the LED chip and connecting section. Heat generated from the LED chip is efficiently dissipated, and high productivity is also achievable.

摘要翻译： 一种LED组件，包括在其中心具有开口的布线基板; 安装在开口内的散热片; 安装在散热片上的LED芯片; 用于电耦合LED芯片和布线基板的连接部分; 以及覆盖LED芯片和连接部的透明树脂。 从LED芯片产生的热量被有效地消散，并且也可以实现高生产率。

公开(公告)号：US20080225449A1

公开(公告)日：2008-09-18

申请号：US12047494

申请日：2008-03-13

申请人： Tatsuya INOUE ,  Hidenori KATSUMURA ,  Masaaki Hayama

发明人： Tatsuya INOUE ,  Hidenori KATSUMURA ,  Masaaki Hayama

IPC分类号： H02H9/04 ,  H01C7/10

CPC分类号： H01C7/12 ,  H01C1/08

摘要： An electrostatic discharge protection component comprising a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon excluding some non-formed portion 18, and glass ceramic layer 14 further formed thereon, a pair of terminal electrodes 13a, 13b disposed by exposing a part thereof at non-formed portion 18 on ceramic substrate 12 of the ceramic sintered body, a pair of external electrodes 16a, 16b, and heat conducting portion 15 vertically penetrating ceramic substrate 12, a light-emitting diode or the like mounted on heat conducting portion 15 at non-formed portion 18, it is possible to reduce the size and to efficiently dissipate the heat generated by the component mounted.

摘要翻译： 一种静电放电保护元件，包括具有陶瓷基板12的陶瓷烧结体，除了一些未形成部分18之外形成​​的压敏电阻部分10，以及进一步形成在其上的玻璃陶瓷层14，通过曝光设置的一对端子电极13a， 在陶瓷烧结体的陶瓷基板12上的非成形部18的一部分，一对外部电极16a，16b和上下方向贯穿陶瓷基板12的导热部15，安装了发光二极管等 在非形成部分18的导热部分15上，可以减小尺寸并有效地散发由安装的部件产生的热量。

公开(公告)号：US07358445B1

公开(公告)日：2008-04-15

申请号：US09661281

申请日：2000-09-14

申请人： Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

发明人： Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

IPC分类号： H05K1/03

CPC分类号： H05K3/3484 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K3/1216 ,  H05K3/207 ,  H05K3/3457 ,  H05K3/386 ,  H05K3/4061 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/09572 ,  H05K2201/09763 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0465 ,  Y10T29/49163 ,  H01L2924/00

摘要： The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second surface has larger surface roughness than the first surface. When the circuit substrate is mounted on another substrate, it is mounted to the other substrate via the second surface. The circuit substrate is capable of mounting a device or being mounted on another substrate to form an apparatus.

摘要翻译： 本发明提供一种电路基板，其具有包括第一表面和与第一表面相对的第二表面的基板。 第一和第二导体图案分别形成在第一和第二表面上。 第二表面具有比第一表面更大的表面粗糙度。 当电路基板安装在另一基板上时，其经由第二表面安装到另一基板。 电路基板能够安装设备或安装在另一基板上以形成设备。

公开(公告)号：US06378424B1

公开(公告)日：2002-04-30

申请号：US09539169

申请日：2000-03-29

申请人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

发明人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

IPC分类号： B41M110

CPC分类号： B82Y30/00 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K3/207 ,  H05K3/4667 ,  H05K3/4685 ,  H05K2203/0113 ,  Y10T156/1064

摘要： A method of fabricating electronic parts is provided which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance. The disclosed method includes the steps of forming a pattern on a surface of a flexible resin sheet by laser process, and then forming a release layer on the surface of the thus obtained pattern, thereby forming an intaglio plate. Next, the intaglio plate is filled with Ag paste, dried and laminated onto an insulating substrate, on which a thermoplastic resin layer is formed. Thereafter, the intaglio plate is peeled from the substrate so that the pattern of the paste is transferred thereon, and a conductor pattern is formed. Further, an insulating layer is formed to cover the conductor pattern and another conductor pattern is formed on the insulating layer, thereby forming a multilayered structure.

摘要翻译： 提供一种制造电子部件的方法，其能够以高精度形成精细图案以及容易地制造具有高性能的导体图案的多层结构。 所公开的方法包括以下步骤：通过激光工艺在柔性树脂片的表面上形成图案，然后在如此获得的图案的表面上形成剥离层，从而形成凹版。 接下来，将凹版板填充Ag膏，干燥并层压到形成有热塑性树脂层的绝缘基板上。 此后，将凹版从基板剥离，使糊状图案转印到其上，形成导体图形。 此外，形成绝缘层以覆盖导体图案，并且在绝缘层上形成另一导体图案，从而形成多层结构。

公开(公告)号：US06310304B1

公开(公告)日：2001-10-30

申请号：US08520620

申请日：1995-08-30

申请人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

发明人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

IPC分类号： H01R909

CPC分类号： B82Y30/00 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K3/207 ,  H05K3/4667 ,  H05K3/4685 ,  H05K2203/0113 ,  Y10T156/1064

摘要： A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a release layer is formed on the surface of the thus obtained pattern, thereby forming an intaglio plate. The intaglio plate is filled with Ag paste and then dried. The intaglio plate is then laminated onto an insulating substrate, on which a thermoplastic resin layer is formed using heat rollers. Thereafter, the intaglio plate is peeled from the insulating substrate so that the pattern of the Ag paste is transferred thereon, and the conductor pattern is formed through burning. Further, an insulating layer is formed so as to cover the conductor pattern and another conductor pattern is formed on the insulating layer, whereby forming a multilayered structure. In some cases, a difference in height of the lower layer conductor pattern is provided and the higher portion thereof functions as a via hole electrode for electrically connecting the lower and upper conductor patterns.

摘要翻译： 通过激光工艺在柔性树脂片的表面上形成可选位置的凹槽比其它部分更深的图案，然后在所得图案的表面上形成剥离层， 从而形成凹版。 凹版印刷板填充Ag膏，然后干燥。 然后将凹版印刷板层压到绝缘基板上，使用热辊在其上形成热塑性树脂层。 此后，将凹版板从绝缘基板剥离，使得Ag糊料的图案转印到其上，并且通过燃烧形成导体图案。 此外，形成绝缘层以覆盖导体图案，并且在绝缘层上形成另一个导体图案，从而形成多层结构。 在一些情况下，提供下层导体图案的高度差，其较高部分用作用于电连接下导体图案和上导体图案的通孔电极。

公开(公告)号：US6141847A

公开(公告)日：2000-11-07

申请号：US997164

申请日：1997-12-23

申请人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

发明人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

IPC分类号： H01G4/40 ,  H01G7/00

CPC分类号： H01G4/40 ,  Y10T29/435 ,  Y10T29/4902

摘要： A ceramic substrate 1 made of magnetic substance on which an inductor 2 is formed is prepared. A ceramic substrate 3 made of dielectric substance on which a capacitor 4 is formed is also prepared. An intermediate layer 5 made of lass paste is printed on the inductor 2 and the capacitor 4. After debinding the substrates 1 and 3 independently, both the substrates are filed with the intermediate layer 5 therebetween so that both the substrates may be glued and integrated. As such, because the debinding process is provided before filing, less gas is generated in firing, and as a result, voids are restrained from occurring.

摘要翻译： 制备由其上形成有电感器2的磁性物质制成的陶瓷基板1。 还制备了由其上形成有电容器4的介电材料制成的陶瓷基板3。 在电感器2和电容器4上印刷由轻质糊料制成的中间层5.在独立地剥离基板1和3之后，两个基板之间留有中间层5，使得两个基板可以胶合并整合。 因此，因为脱脂处理在提交之前提供，所以在烧制中产生较少的气体，结果，抑制了空隙的发生。

公开(公告)号：US07423222B2

公开(公告)日：2008-09-09

申请号：US10203970

申请日：2002-01-11

申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

公开(公告)号：US07161371B2

公开(公告)日：2007-01-09

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑型模块组件。

公开(公告)号：US06374733B1

公开(公告)日：2002-04-23

申请号：US09601776

申请日：2000-09-25

申请人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga ,  Masayuki Mizuno ,  Eiji Kawamoto ,  Yuji Yagi

发明人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga ,  Masayuki Mizuno ,  Eiji Kawamoto ,  Yuji Yagi

IPC分类号： B41M110

CPC分类号： H05K3/4647 ,  H01L21/4867 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/207 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4605 ,  H05K3/4667 ,  H05K2203/0113 ,  H05K2203/0139

摘要： The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.

摘要翻译： 本发明涉及用于各种电子设备的陶瓷基板的制造方法，更具体地说，涉及通过凹版印刷形成导体图案的陶瓷基板的制造方法。 通过使用屏幕掩模，金属掩模或拉制装置中的任何一个，在凹版中提供导电膏，因此导电浆可以均匀地供给到期望的位置。 可以通过重复印刷来调整导电浆料的供给量，从而可以根据图案设定最佳量。 结果，可以容易地形成厚膜的精细布线图案，并且可以获得布线电阻低，布线密度高，布线图形尺寸精度高的陶瓷电路板。

公开(公告)号：US06372158B1

公开(公告)日：2002-04-16

申请号：US09696687

申请日：2000-10-26

申请人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

发明人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

IPC分类号： H01B122

CPC分类号： H05K1/092 ,  H01B1/22

摘要： A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.

摘要翻译： 本发明的糊剂包含贵金属有机酸盐，作为导电浆料的贵金属成分添加到贵金属粉末中。 也可以使用贱金属有机酸盐代替无机粘合剂中的贱金属成分，以从导电糊中排除具有较大直径的颗粒。 本发明的导电性糊料使由分散不充分引起的糊状物块为10μm＆amp; PHgr; 以下，在丝网印刷期间显着降低宽度为100μm以下的布线图案的屏幕堵塞。