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    Heat transmitting member and method of manufacturing the same
    1.
    发明授权
    Heat transmitting member and method of manufacturing the same 失效
    传热部件及其制造方法

    公开(公告)号：US5943543A

    公开(公告)日：1999-08-24

    申请号：US669520

    申请日：1996-06-26

    申请人： Tatsuya Uchida ,  Hatsue Hiratsuka ,  Yasuo Kamigata ,  Takeshi Yoshida ,  Hidefumi Tsuboi

    发明人： Tatsuya Uchida ,  Hatsue Hiratsuka ,  Yasuo Kamigata ,  Takeshi Yoshida ,  Hidefumi Tsuboi

    IPC分类号： F21S11/00 ,  A23B7/04 ,  A23B7/144 ,  A23B7/148 ,  B22F3/11 ,  B22F7/00 ,  F23D1/00 ,  F24J2/07 ,  F24J2/10 ,  F24J2/12 ,  F24J2/14 ,  F24J2/18 ,  F24J2/52 ,  F24J2/54 ,  F25D17/04 ,  F25D25/02 ,  F28F13/00 ,  F28F13/18 ,  F28F21/08 ,  B22F3/10

    CPC分类号： F28F21/085 ,  B22F3/1115 ,  B22F3/1121 ,  B22F3/1125 ,  B22F3/1137 ,  B22F7/002 ,  B22F7/006 ,  F28F13/003 ,  F28F13/18 ,  B22F2998/00

    摘要： This invention provides a heat transmitting pipe and a heat transmitting plate which are capable of greatly improving the heat transfer efficiency of a conventional finned heating pipe and a convention heating plate. Copper oxide powder is deposited in a vapor phase onto a cellular synthetic resin coated with an adhesive beforehand. Thereafter, a copper plate with the same metal powder deposited thereon is placed on one surface of the metal powder-bearing cellular synthetic resin and is brought into lightly pressed contact with the surface by a roll press or the like, to thereby form a laminated article. Subsequently, the cellular synthetic resin is burnt off in a combustion furnace, to thereby produce a cellular metal material of the copper oxide on the copper plate. Further, the cellular metal material is reduced and sintered in a reducing atmosphere such as that of a hydrogen reduction furnace, to thereby produce a cellular copper material which is provided with the copper plate on one surface thereof. The cellular copper material can be directly used as a material for working a heat transmitting plate in a heat exchanger.

    摘要翻译： PCT No.PCT / JP94 / 02249 Sec。 371日期1996年6月26日第 102（e）日期1996年6月26日PCT 1994年12月27日PCT公布。 公开号WO95 / 18350 日期1995年7月6日本发明提供能够大大提高传统的翅片式加热管和常规加热板的传热效率的传热管和传热板。 事先将氧化铜粉末以气相沉积到涂有粘合剂的细胞合成树脂上。 然后，将含有相同金属粉末的铜板放置在含金属粉末的多孔合成树脂的一个表面上，并通过辊压机等与表面轻压接触，从而形成层压体 。 随后，在燃烧炉中烧制细胞合成树脂，从而在铜板上产生铜氧化物的多孔金属材料。 此外，在还原气氛（如氢还原炉）中还原并烧结多孔金属材料，从而在其一个表面上制备设置有铜板的多孔铜材料。 细胞铜材料可以直接用作在热交换器中加热传热板的材料。

    Method for producing porous bodies
    2.
    发明授权
    Method for producing porous bodies 失效
    多孔体的制​​造方法

    公开(公告)号：US5881353A

    公开(公告)日：1999-03-09

    申请号：US722249

    申请日：1996-09-30

    申请人： Yasuo Kamigata ,  Takeshi Yoshida ,  Kenzo Susa ,  Tatsuya Uchida ,  Hatsue Hiratsuka

    发明人： Yasuo Kamigata ,  Takeshi Yoshida ,  Kenzo Susa ,  Tatsuya Uchida ,  Hatsue Hiratsuka

    IPC分类号： B01D39/20 ,  B22F3/11 ,  C04B35/622 ,  C04B38/06 ,  F28F13/00 ,  H01M4/80 ,  B22F3/10

    CPC分类号： H01M4/808 ,  B01D39/2034 ,  B22F3/1137 ,  C04B35/622 ,  C04B38/0615 ,  F28F13/003 ,  B22F2998/00 ,  C04B2111/00793 ,  C04B2111/0081

    摘要： A method for producing a porous body with high porosity is provided.An adhesive is coated on a synthetic resin foam having three-dimensional network structure, such as urethane foam, serving as a base material, to impart stickiness to the surface of the resin foam, and thereafter a powder such as copper oxide powder is applied thereto, followed by heating to remove the substrate and sinter the powder. Thus, a porous body to which the pattern of the base material has been transferred is produced.The powder may be appropriately selected to obtain porous bodies having a great strength, without limitations on materials.

    摘要翻译： PCT No.PCT / JP94 / 01337 Sec。 371日期1996年9月30日 102（e）1996年9月30日PCT PCT 1994年8月11日PCT公布。 第WO95 / 26844号公报 日期1995年10月12日提供了一种用于制造具有高孔隙率的多孔体的方法。 将粘合剂涂布在具有三维网状结构的合成树脂发泡体上，例如用作基材的聚氨酯泡沫，以赋予树脂泡沫表面粘性，然后向其施加氧化铜粉末的粉末 ，然后加热以除去基底并烧结粉末。 因此，制造了已经转移了基材的图案的多孔体。 可以适当选择粉末以获得具有强度的多孔体，而不限于材料。

    Polishing slurry and polishing method
    7.
    发明申请
    Polishing slurry and polishing method 有权
    抛光浆和抛光方法

    公开(公告)号：US20080003924A1

    公开(公告)日：2008-01-03

    申请号：US11808047

    申请日：2007-06-06

    申请人： Yasushi Kurata ,  Katsuyuki Masuda ,  Hiroshi Ono ,  Yasuo Kamigata ,  Kazuhiro Enomoto

    发明人： Yasushi Kurata ,  Katsuyuki Masuda ,  Hiroshi Ono ,  Yasuo Kamigata ,  Kazuhiro Enomoto

    IPC分类号： B24B1/00 ,  C09G1/04

    CPC分类号： B24B37/0056 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C09K3/1463 ,  H01L21/3212

    摘要： A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one or more acids (A-group) selected from acids of which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is less than 3.7 and from which five acids of lactic acid, phthalic acid, fumaric acid, maleic acid and aminoacetic acid are excluded, ammonium salts of the A-group and esters of the A-group, and one or more compounds selected from one or more acids (B-group) selected from acids of which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is 3.7 or more and the five acids, ammonium salts of the B-group and esters of the B-group. The metal inhibitor contains one or more types selected from the group consisting of aromatic compounds having a triazole skeleton and one or more types selected from the group consisting of aliphatic compounds having a triazole skeleton and compounds having any one of pyrimidine skeleton, imidazole skeleton, guanidine skeleton, thiazole skeleton and pyrazole skeleton. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.

    摘要翻译： 包括氧化剂，金属氧化物溶解器，金属抑制剂和水并且pH为2至5的抛光浆料。金属氧化物溶解器含有一种或多种选自一种或多种选自以下的酸的化合物（A-group），所述酸选自： 其中第一离解酸基团的解离常数Ka（pKa）的对数的负值小于3.7，并且排除了乳酸，邻苯二甲酸，富马酸，马来酸和氨基乙酸的五种酸，铵盐 的A基团和A基团的酯，以及一种或多种选自一种或多种酸（B族）的化合物，所述酸选自其中解离常数Ka（pKa）的对数的负值为 第一离解酸基团为3.7以上，B族的5种酸，铵盐和B族的酯。 金属抑制剂含有选自具有三唑骨架的芳香族化合物和选自具有三唑骨架的脂肪族化合物和具有嘧啶骨架，咪唑骨架，胍等任意一种的化合物的一种或多种的一种或多种 骨架，噻唑骨架和吡唑骨架。 具有高金属抛光速率，降低蚀刻速率和抛光摩擦的抛光浆料导致半导体器件的高生产率的生产减少了金属布线中的凹陷和侵蚀。

    Polishing slurry and polishing method
    8.
    发明申请
    Polishing slurry and polishing method 审中-公开
    抛光浆和抛光方法

    公开(公告)号：US20070295934A1

    公开(公告)日：2007-12-27

    申请号：US11808038

    申请日：2007-06-06

    申请人： Yasushi Kurata ,  Katsuyuki Masuda ,  Hiroshi Ono ,  Yasuo Kamigata ,  Kazuhiro Enomoto

    发明人： Yasushi Kurata ,  Katsuyuki Masuda ,  Hiroshi Ono ,  Yasuo Kamigata ,  Kazuhiro Enomoto

    IPC分类号： C09K13/00

    CPC分类号： B24B37/0056 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C09K3/1463 ,  H01L21/3212

    摘要： A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one or more acids (A-group) selected from acids of which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is less than 3.7 and from which five acids of lactic acid, phthalic acid, fumaric acid, maleic acid and aminoacetic acid are excluded, ammonium salts of the A-group and esters of the A-group, and one or more compounds selected from one or more acids (B-group) selected from acids of which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is 3.7 or more and the five acids, ammonium salts of the B-group and esters of the B-group. The metal inhibitor contains one or more types selected from the group consisting of aromatic compounds having a triazole skeleton and one or more types selected from the group consisting of aliphatic compounds having a triazole skeleton and compounds having any one of pyrimidine skeleton, imidazole skeleton, guanidine skeleton, thiazole skeleton and pyrazole skeleton. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.

    摘要翻译： 包括氧化剂，金属氧化物溶解器，金属抑制剂和水并且pH为2至5的抛光浆料。金属氧化物溶解器含有一种或多种选自一种或多种选自以下的酸的化合物（A-group），所述酸选自： 其中第一离解酸基团的解离常数Ka（pKa）的对数的负值小于3.7，并且排除了乳酸，邻苯二甲酸，富马酸，马来酸和氨基乙酸的五种酸，铵盐 的A基团和A基团的酯，以及一种或多种选自一种或多种酸（B族）的化合物，所述酸选自其中解离常数Ka（pKa）的对数的负值为 第一离解酸基团为3.7以上，B族的5种酸，铵盐和B族的酯。 金属抑制剂含有选自具有三唑骨架的芳香族化合物和选自具有三唑骨架的脂肪族化合物和具有嘧啶骨架，咪唑骨架，胍等任意一种的化合物的一种或多种的一种或多种 骨架，噻唑骨架和吡唑骨架。 具有高金属抛光速率，降低蚀刻速率和抛光摩擦的抛光浆料导致半导体器件的高生产率的生产减少了金属布线中的凹陷和侵蚀。