公开(公告)号：US5423209A

公开(公告)日：1995-06-13

申请号：US249068

申请日：1994-05-25

申请人： Teruomi Nakaya ,  Masao Ebihara ,  Yoshio Hayashi ,  Seizo Suzuki ,  Naoaki Kuwano ,  Asao Hanzawa ,  Takashi Saitow ,  Mitsuo Usami ,  Toru Iwata

发明人： Teruomi Nakaya ,  Masao Ebihara ,  Yoshio Hayashi ,  Seizo Suzuki ,  Naoaki Kuwano ,  Asao Hanzawa ,  Takashi Saitow ,  Mitsuo Usami ,  Toru Iwata

IPC分类号： G01F1/46 ,  G01P5/16 ,  G01P5/165 ,  G01P13/02 ,  G01C21/00

CPC分类号： G01F1/46 ,  G01P13/025 ,  G01P5/165

摘要： A flight velocity detection system using a truncated pyramid-shape multi-e Pitot probe in which an extreme end portion has a truncated pyramid-shape, a cylindrical hole is provided at the apex thereof, a total pressure tube of a smaller diameter than that of the cylindrical hole is secured at a position by a predetermined length determined by a relationship with the diameter of the cylindrical hole from the extreme end of the cylindrical hole, and groups of pressure holes comprised of a plurality of pressure holes are arranged in each of the truncated pyramid surfaces of the truncated pyramid shape. Items of pressure information detected by the probe are input into a velocity vector processor to convert them into electric signals, and signals are processed using pressure coefficients of the holes of the probe with respect to the velocity vector stored in advance in the velocity vector processor to calculate flight velocity vector (V, .alpha., .beta.) with respect to the probe axis from the pressure information and air density.

摘要翻译： 使用截头棱锥形多孔皮托探头的飞行速度检测系统，其顶端具有截头棱锥形，圆柱形孔设置在其顶点，直径小于 圆柱形孔被固定在与圆柱形孔的前端与圆柱形孔的直径关系确定的预定长度的位置处，并且由多个压力孔组成的一组压力孔布置在 截头棱锥形截面金字塔表面。 由探头检测到的压力信息的项目被输入到速度矢量处理器中以将它们转换为电信号，并且使用相对于预先存储在速度矢量处理器中的速度向量的探针的孔的压力系数来处理信号， 从压力信息和空气密度计算相对于探针轴的飞行速度矢量（V，α，β）。

公开(公告)号：US08017441B2

公开(公告)日：2011-09-13

申请号：US12303066

申请日：2006-06-02

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： An IC tag inlet (100) is configured by: an upper side antenna (102) and a lower side antenna (103) sandwiching a semiconductor chip (101) that includes an upper electrode (132) and a lower electrode (133) from both upper and lower directions; and a support resin (104) covering the semiconductor chip (101). The semiconductor chip (101) is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 μm or smaller. In a manufacturing process of the IC tag inlet (100), in order to make the handling of the semiconductor chip (101) easy, prior to a step of sandwiching the semiconductor chip (101) between the upper side antenna (102) and the lower side antenna (103), the whole surface of the semiconductor chip (101) is covered by the support resin (104), so that an effective volume is made large.

摘要翻译： IC标签入口（100）通过以下方式构成：上下侧天线（102）和下侧天线（103），其夹着半导体芯片（101），其包括来自两者的上电极（132）和下电极（133） 上下方向; 和覆盖半导体芯片（101）的支撑树脂（104）。 半导体芯片（101）是外形尺寸为0.15mm以下，厚度为10μm以下的微型芯片。 在IC标签入口（100）的制造过程中，为了使半导体芯片（101）的处理容易，在将半导体芯片（101）夹在上侧天线（102）和 下侧天线（103），半导体芯片（101）的整个表面被支撑树脂（104）覆盖，使得有效体积变大。

公开(公告)号：US07652360B2

公开(公告)日：2010-01-26

申请号：US11696028

申请日：2007-04-03

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L23/02

CPC分类号： H01L24/01 ,  G06K7/0008 ,  G06K19/02 ,  G06K19/041 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07786 ,  H01L21/50 ,  H01L23/051 ,  H01L23/08 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/48 ,  H01L23/4827 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/16588 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83205

摘要： An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

摘要翻译： 其中将平板半导体和连接到半导体的前表面和后表面上的表面电极的引线和引线封装在玻璃管中的电子器件。

公开(公告)号：US07629667B2

公开(公告)日：2009-12-08

申请号：US10564885

申请日：2003-08-28

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L21/8222

CPC分类号： G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L23/5227 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01Q1/22 ,  H01Q1/2283 ,  H01L2224/0401

摘要： An issue of reducing a product manufacture unit cost exists in wireless IC chips which are required to be disposable because the wireless IC chips circulate in a massive scale and require a very high collection cost. It is possible to increase the communication distance of a wireless IC chip with an on-chip antenna simply contrived for reduction of the production unit cost by increasing the size of the antenna mounted on a wireless IC chip or by increasing the output power of a reader as in a conventional way. However, because of the circumstances of the applications used and the read accuracy of the reader, the antenna cannot be mounted on a very small chip in an in-chip antenna form. When an AC magnetic field is applied to an on-chip antenna from outside, eddy current is produced in principle because the semiconductor substrate is conductive. It has been fount that the thickness of the substrate can be used as a design parameter because of the eddy current. Based on this finding, according to the invention, the thickness of the substrate is decreased to reduce or eliminate the energy loss due to the eddy current to utilize the electromagnetic wave energy for the semiconductor circuit operation as originally designed. With the thickness reduction, it is possible to increase the communication distance by preventing ineffective absorption of energy and thereby increasing the current flowing through the on-chip antenna.

摘要翻译： 由于无线IC芯片大量流通并且需要非常高的收集成本，所以无线IC芯片中存在降低产品制造单位成本的问题，这些无线IC芯片需要一次性使用。 可以通过增加安装在无线IC芯片上的天线的尺寸或通过增加读取器的输出功率来简单地设计用于降低生产单元成本的片上天线的无线IC芯片的通信距离 如常规方式。 然而，由于使用的应用环境和读取器的读取精度，天线不能以片内天线形式安装在非常小的芯片上。 当从外部向片上天线施加AC磁场时，由于半导体衬底是导电的，原则上产生涡电流。 由于涡电流，衬底的厚度可以用作设计参数。 基于这一发现，根据本发明，减小或消除了由于涡电流而导致的能量损耗，以便如最初设计的那样利用电磁波能量进行半导体电路操作。 通过减小厚度，可以通过防止能量的无效吸收从而增加流过片上天线的电流来增加通信距离。

公开(公告)号：US20090191668A1

公开(公告)日：2009-07-30

申请号：US12303066

申请日：2006-06-02

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L21/50

CPC分类号： H01L21/56 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： An IC tag inlet (100) is configured by: an upper side antenna (102) and a lower side antenna (103) sandwiching a semiconductor chip (101) that includes an upper electrode (132) and a lower electrode (133) from both upper and lower directions; and a support resin (104) covering the semiconductor chip (101). The semiconductor chip (101) is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 μm or smaller. In a manufacturing process of the IC tag inlet (100), in order to make the handling of the semiconductor chip (101) easy, prior to a step of sandwiching the semiconductor chip (101) between the upper side antenna (102) and the lower side antenna (103), the whole surface of the semiconductor chip (101) is covered by the support resin (104), so that an effective volume is made large.

摘要翻译： IC标签入口（100）通过以下方式构成：上下侧天线（102）和下侧天线（103），其夹着半导体芯片（101），其包括来自两者的上电极（132）和下电极（133） 上下方向; 和覆盖半导体芯片（101）的支撑树脂（104）。 半导体芯片（101）是外形尺寸为0.15mm以下，厚度为10μm以下的微型芯片。 在IC标签入口（100）的制造过程中，为了使半导体芯片（101）的处理容易，在将半导体芯片（101）夹在上侧天线（102）和 下侧天线（103），半导体芯片（101）的整个表面被支撑树脂（104）覆盖，使得有效体积变大。

公开(公告)号：US20080074239A1

公开(公告)日：2008-03-27

申请号：US11630861

申请日：2004-08-04

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H04Q5/22

CPC分类号： G06K7/0008 ,  G06F11/1004 ,  H03M13/09

摘要： A reader reads electronic tag data and a CRC code from an electronic tag and detects whether the electronic tag data has been received correctly, by using the CRC code. The CRC code is generated from reader data and electronic tag data stored in the reader and an error detection is performed by using the reader data, so that the error detection is performed simultaneously, and it is possible to selectively read out only the electronic tag data from the electronic tag correlated with the reader data.

摘要翻译： 读取器从电子标签读取电子标签数据和CRC码，并通过使用CRC码来检测电子标签数据是否被正确接收。 CRC代码是从阅读器数据和存储在读取器中的电子标签数据生成的，并且通过使用读取器数据执行错误检测，从而同时执行错误检测，并且可以仅选择性地读出电子标签数据 从与读取器数据相关的电子标签。

公开(公告)号：US07298029B2

公开(公告)日：2007-11-20

申请号：US11101577

申请日：2005-04-08

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： H01L23/02 ,  H01L29/40

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

摘要翻译： 非接触式识别半导体器件设置有半导体芯片，该半导体芯片包括接收对非接触识别半导体器件的查询的接收电路，存储多个比特的识别信息的存储器和发送识别信息的发送电路。 耦合到所述半导体芯片的天线从所述半导体芯片接收所述识别信息，并将所述识别信息发送到所述非接触式半导体之外。 半导体芯片的长边长度在平面尺寸上不大于0.5mm，并且通过由电子束打印的图案来存储识别信息。

公开(公告)号：US20060189040A1

公开(公告)日：2006-08-24

申请号：US11411884

申请日：2006-04-27

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L21/6835 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/49855 ,  H01L23/5388 ,  H01L23/552 ,  H01L23/645 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q9/40 ,  H01Q9/42 ,  Y10T29/49121 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512

摘要： The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

公开(公告)号：US07061083B1

公开(公告)日：2006-06-13

申请号：US09868231

申请日：1999-12-10

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： H01L23/02 ,  H01L29/40

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： This Application is intended to provide a method for effectively protecting paper or film-form media against forgery. This can be achieved by, for example, embedding in a paper or film-form medium a thin semiconductor chip up to 0.5 mm square, equipped with an antenna, and characterized in that the side walls of the semiconductor chip are formed using oxide films, and in that multiple such semiconductor chips are separated by etching. Limiting the size of these semiconductor chips to 0.5 mm or less enables improvement against bending and concentrated loads, and separating the semiconductor chips by etching results in semiconductor chips free from cracking and breakage. Also, the oxide films constituting the side walls of the semiconductor chips prevents short-circuiting at edges during connection to the respective antennas. Thus, simplified processes can be adopted.

摘要翻译： 本申请旨在提供一种有效保护纸张或胶片形式介质免于伪造的方法。 这可以通过例如在纸或薄膜介质中嵌入具有天线的0.5mm见方的半导体芯片来实现，其特征在于，半导体芯片的侧壁使用氧化膜形成， 并且通过蚀刻分离多个这样的半导体芯片。 将这些半导体芯片的尺寸限制在0.5mm以下可以改善弯曲和集中负载，并且通过蚀刻分离半导体芯片，导致半导体芯片没有破裂和断裂。 此外，构成半导体芯片的侧壁的氧化物膜防止在连接到各个天线期间的边缘短路。 因此，可以采用简化的过程。

公开(公告)号：US20060004800A1

公开(公告)日：2006-01-05

申请号：US11177415

申请日：2005-07-11

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Yasuko Fukuzawa ,  Hideki Tokuyama ,  Mitsuo Usami

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Yasuko Fukuzawa ,  Hideki Tokuyama ,  Mitsuo Usami

IPC分类号： G06F17/00

CPC分类号： G06Q10/08 ,  Y10S707/944 ,  Y10S707/955 ,  Y10S707/96 ,  Y10S707/961 ,  Y10S707/99931 ,  Y10S707/99936

摘要： The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrated database and sending integrated information to requester of integrated material-object information; and receiving and outputting sent integrated material-object information.