Surface treating apparatus, surface treating method and semiconductor
device manufacturing method
    2.
    发明授权
    Surface treating apparatus, surface treating method and semiconductor device manufacturing method 失效
    表面处理装置,表面处理方法及半导体装置的制造方法

    公开(公告)号:US5505778A

    公开(公告)日:1996-04-09

    申请号:US730078

    申请日:1991-07-15

    摘要: An apparatus for treating solid surface using a thermally excited molecular beam according to the present invention is capable of completely preventing flying of contaminant caused by a heating source to a sample. To achieve this, in the present invention, the heating source for exciting the molecules is hermetically separated from the sample. Alternatively, a container where the heating source is housed and a container where the sample is accommodated are separated such that a conductance between the two containers is sufficiently small. In this way, chemical reactions between the molecular beam of the reactive gas which is highly reactive and the heating source heated to high temperatures can be eliminated, and flying of the contaminant to the sample can thus be greatly reduced. As a result, flying of the contaminating substances caused by the heating source to the sample can be prevented, and reduction in the surface treating rate of the sample, caused by the contaminant, can be prevented.

    摘要翻译: 根据本发明的使用热激发分子束处理固体表面的设备能够完全防止由加热源引起的污染物飞溅到样品。 为了实现这一点,在本发明中,用于激发分子的加热源与样品气密分离。 或者,容纳加热源的容器和容纳样品的容器被分离,使得两个容器之间的电导足够小。 以这种方式,可以消除高反应性的反应性气体的分子束与加热到高温的加热源之间的化学反应,从而大大减少污染物向样品的飞散。 结果,可以防止由加热源引起的对样品的污染物质的飞溅,并且可以防止由污染物引起的样品表面处理速度的降低。

    Surface treatment and apparatus therefor
    5.
    发明授权
    Surface treatment and apparatus therefor 失效
    表面处理及其设备

    公开(公告)号:US4886571A

    公开(公告)日:1989-12-12

    申请号:US302334

    申请日:1989-01-27

    摘要: An apparatus for surface treating a sample article with activated particles, comprising a reaction chamber in which a sample article to be surface processed is placed, means for introducing a reaction gas into the reaction chamber, an activation surface properly set in the reaction chamber and arranged capable of activating at least one part of the particles composing the reaction gas, and means for evacuating the used reaction gas out of the reaction chamber.

    摘要翻译: 一种用于用活化颗粒表面处理样品的装置,包括其中放置待表面处理样品的反应室,用于将反应气体引入反应室的装置,适当地设置在反应室中的活化表面, 能够活化至少一部分构成反应气体的粒子,以及将所使用的反应气体从反应室排出的装置。

    Plasma processing apparatus
    7.
    发明授权

    公开(公告)号:US5891252A

    公开(公告)日:1999-04-06

    申请号:US766818

    申请日:1996-12-13

    IPC分类号: C23C16/00 H01J37/32

    摘要: A plasma processing apparatus in which power consumption is reduced, which can generate uniform plasma in a large range and in which minute processing in high etching selectivity and in high aspect ratio is enabled is disclosed. High density plasma is generated in a vacuum vessel housing a processed sample utilizing an electron cyclotron resonance phenomenon caused by an electromagnetic wave in an ultra-high frequency band and a magnetic field and the surface of the processed sample is etched using this plasma. An electromagnetic wave in an ultra-high frequency band for generating plasma is radiated from a planar conductive plate consisting of graphite or silicon which is arranged opposite to the surface of the processed sample into space inside the vacuum vessel. High density plasma in the low degree of dissociation can be generated by using an electromagnetic wave in an ultra-high frequency band and as a result, the controllability of etching reaction can be enhanced. Further, a radical effective in etching can be increased by reaction between the surface of a planar conductive plate for radiating an electromagnetic wave and plasma.

    Surface processing method and an apparatus for carrying out the same
    8.
    发明授权
    Surface processing method and an apparatus for carrying out the same 失效
    表面处理方法及其执行装置

    公开(公告)号:US5462635A

    公开(公告)日:1995-10-31

    申请号:US251660

    申请日:1994-05-31

    摘要: A surface processing method capable of processing the surface of a work at a high processing rate without damaging the surface of the work uses, in combination, a fast processing technique using charged particles and a moderate processing technique using neutral particles that scarcely damage the surface of the work, and a surface processing apparatus suitable for carrying out the surface processing method. In carrying out a surface treatment process, the substrate is processed in a moderate surface processing mode using neutral particles while the substrate is exposed substantially to charged particles, and the substrate is processed in a fast surface processing mode using charged particles while the substrate is not exposed substantially to charged particles to achieve the surface treatment process at a high processing rate without damaging the surface of the substrate.

    摘要翻译: 能够以高加工速度处理工件的表面而不损害工件表面的表面处理方法组合使用带电粒子的快速加工技术和使用几乎不损伤表面的中性粒子的中等加工技术 该工作以及适于执行表面处理方法的表面处理设备。 在进行表面处理工艺时,使用中性粒子在中等的表面处理模式下对基板进行处理,同时基板基本上暴露于带电粒子,并且基板在使用带电粒子的情况下以快速表面处理模式进行处理,而基板不是 基本上暴露于带电粒子以在高加工速率下实现表面处理工艺,而不会损坏基板的表面。

    Plasma processing apparatus
    9.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US6033481A

    公开(公告)日:2000-03-07

    申请号:US225971

    申请日:1999-01-06

    IPC分类号: C23C16/00 H01J37/32

    摘要: A plasma processing apparatus in which power consumption is reduced, which can generate uniform plasma in a large range and in which minute processing in high etching selectivity and in high aspect ratio is enabled is disclosed. High density plasma is generated in a vacuum vessel housing a processed sample utilizing an electron cyclotron resonance phenomenon caused by an electromagnetic wave in an ultra-high frequency band and a magnetic field and the surface of the processed sample is etched using this plasma. An electromagnetic wave in an ultra-high frequency band for generating plasma is radiated from a planar conductive plate consisting of graphite or silicon which is arranged opposite to the surface of the processed sample into space inside the vacuum vessel. High density plasma in the low degree of dissociation can be generated by using an electromagnetic wave in an ultra-high frequency band and as a result, the controllability of etching reaction can be enhanced. Further, a radical effective in etching can be increased by reaction between the surface of a planar conductive plate for radiating an electromagnetic wave and plasma.

    摘要翻译: 公开了能够在大范围内产生均匀的等离子体并能够实现高蚀刻选择性和高纵横比的微小加工的功耗降低的等离子体处理装置。 利用由超高频带和磁场中的电磁波引起的电子回旋共振现象,在容纳加工样品的真空容器中产生高密度等离子体,并且使用该等离子体蚀刻处理样品的表面。 用于产生等离子体的超高频带中的电磁波从由石墨或硅组成的平面导电板辐射,该导电板与被处理样品的表面相对地设置在真空容器内部的空间中。 通过在超高频带中使用电磁波可以产生低解离度的高密度等离子体,结果可以提高蚀刻反应的可控性。 此外,通过用于辐射电磁波的平面导电板的表面与等离子体之间的反应可以增加蚀刻中有效的自由基。

    Plasma display apparatus
    10.
    发明授权
    Plasma display apparatus 失效
    等离子显示装置

    公开(公告)号:US08085220B2

    公开(公告)日:2011-12-27

    申请号:US12323592

    申请日:2008-11-26

    IPC分类号: G09G3/28

    摘要: A plasma display apparatus having a priming discharge region PDC partitioned from a display discharge cell DDC, by a traverse rib, at a side where the second electrode between the display discharge cell DDC adjacent in a row direction is adjacent; a second longitudinal rib partitioning the priming discharge region PDC; a third longitudinal rib, further partitioning a region partitioned by the second longitudinal rib into two sections; a convex electrode; and a gap connecting the display discharge cell DDC and the priming discharge cell PDC, wherein a sum of a width in a line direction of a nearly rectangular space region containing adjacent two priming discharge cells PDCs, and a pattern width of the second longitudinal rib is designed larger than a sum of a width in the row direction and a pattern width of the traverse rib.

    摘要翻译: 一种等离子体显示装置,在显示用放电单元DDC与行方向相邻的显示用放电单元DDC之间的第二电极相邻的一侧,通过横动肋从显示用放电单元DDC分割的起动放电区域PDC; 分隔起动放电区域PDC的第二纵向肋; 第三纵向肋,进一步将由所述第二纵向肋分隔的区域划分成两个部分; 凸电极 以及连接显示放电单元DDC和起动放电单元PDC的间隙,其中,包含相邻两个起动放电单元PDC的近似矩形的空间区域的线方向的宽度与第二纵向肋的图案宽度之和为 设计成大于行方向宽度和横幅的图案宽度之和。