公开(公告)号：US5606263A

公开(公告)日：1997-02-25

申请号：US620393

申请日：1996-03-22

申请人： Tetsuo Yoshizawa ,  Masaaki Imaizumi ,  Hideyuki Nishida ,  Hiroshi Kondo ,  Takashi Sakaki ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Tetsuo Yoshizawa ,  Masaaki Imaizumi ,  Hideyuki Nishida ,  Hiroshi Kondo ,  Takashi Sakaki ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： G01R1/073

CPC分类号： G01R1/07307

摘要： An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.

摘要翻译： 电路构件包括电连接构件，所述电连接构件具有保持构件，所述保持构件包括电绝缘材料和在所述保持构件内以预定间隔嵌入的多个导电构件，所述多个导电构件中的每一个与所述电气绝缘材料绝缘 绝缘材料，并且还使所述导电构件的端部暴露在所述保持构件的两个表面上; 和电路部分，所述电路部分具有连接到所述导电部件或暴露在所述保持部件的两个表面上的所述布线图形的连接部分，并连接到所述保持部件的至少一个表面。

公开(公告)号：US5058800A

公开(公告)日：1991-10-22

申请号：US358639

申请日：1989-05-30

申请人： Tetsuo Yoshizawa ,  Hiroshi Kondo ,  Takashi Sakaki ,  Masaaki Imaizumi ,  Hideyuki Nishida ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Tetsuo Yoshizawa ,  Hiroshi Kondo ,  Takashi Sakaki ,  Masaaki Imaizumi ,  Hideyuki Nishida ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： H01L21/00 ,  H01R4/02 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L21/67138 ,  H01R4/02 ,  H01L2224/83222 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/1815 ,  H05K3/321 ,  H05K3/3494

摘要： A method of making an electric circuit device by connecting first and second electrical circuit components through an electrical connecting member. The method comprises effecting internal heating such as supersonic heating, high-frequency induction heating, high-frequency dielectric heating or microwave heating at first connecting regions between the connecting portions of the first electrical circuit component and the first ends of the electrically conductive members of the electrical connecting member. The same internal heating may also be effected at second connecting regions between the connecting portions of the second electrical circuit component and the second ends of the electrically conductive members of the electrical connecting member. In consequence, alloying takes place in first and second connecting regions so as to connect the first and second electrical circuit components through the electrical connecting member.

公开(公告)号：US5967804A

公开(公告)日：1999-10-19

申请号：US597383

申请日：1996-02-08

申请人： Tetsuo Yoshizawa ,  Hideyuki Nishida ,  Masaaki Imaizumi ,  Yasuteru Ichida ,  Masaki Konishi ,  Hiroshi Kondo ,  Takashi Sakaki

发明人： Tetsuo Yoshizawa ,  Hideyuki Nishida ,  Masaaki Imaizumi ,  Yasuteru Ichida ,  Masaki Konishi ,  Hiroshi Kondo ,  Takashi Sakaki

IPC分类号： H01L21/60 ,  H01L23/14 ,  H01L23/15 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01R9/09

CPC分类号： H01L24/83 ,  H01L23/145 ,  H01L23/15 ,  H01L23/315 ,  H01L23/49531 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/351

摘要： An electrical connecting member for use in an electrical connection for connecting a first electrical circuit component on a side thereof and a second electrical circuit component on another side thereof, said electrical connecting member comprising: a plurality of layers each layer having a plurality of conductive members and an insulative holder for holding said plurality of conductive members, wherein said plurality of conductive members are arranged such that each conductive member has one end exposed on one surface of said layer and another end exposed on another surface of said layer, and makes electric contact with at least one of a conductive member immediately below and a conductive member immediately above, but does not contact conductive members laterally offset thereof, and wherein said conductive members have diameters that are substantially equal to each other, between said one surface of said layer and said another surface of said layer; and said plurality of layers are stacked such that said plurality of conductive members in one layer are connected with said plurality of conductive members in another layer, and are held by said insulative holder with a different pitch shifted slightly from said plurality of conductive members in another layer. It is a further object to provide an electrical member and an electrical circuit device which employ such an electrical connecting member.

摘要翻译： 一种用于电连接的电连接构件，用于连接其一侧上的第一电路部件和在其另一侧上的第二电路部件，所述电连接构件包括：多个层，每层具有多个导电构件 以及用于保持所述多个导电构件的绝缘保持器，其中所述多个导电构件布置成使得每个导电构件具有在所述层的一个表面上暴露的一端，而在所述层的另一表面上暴露的另一端，并且进行电接触 其中紧邻在下方的导电部件中的至少一个和紧接在上方的导电部件，但不接触横向偏移的导电部件，并且其中所述导电部件具有在所述层的所述一个表面和 所述层的另一表面; 并且所述多个层被堆叠，使得一层中的所述多个导电构件与另一层中的所述多个导电构件连接，并且由所述绝缘保持器以与另一层中的所述多个导电构件稍微偏移的不同节距保持 层。 另一个目的是提供一种使用这种电连接构件的电气构件和电路装置。

公开(公告)号：US5216807A

公开(公告)日：1993-06-08

申请号：US832653

申请日：1992-02-11

申请人： Tetsuo Yoshizawa ,  Yoshimi Terayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Tetsuo Yoshizawa ,  Yoshimi Terayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3025 ,  Y10T29/49208

摘要： A method of producing an electrical connection member includes the steps of applying a carrier containing a light-sensitive resin onto a substrate member, forming holes in portions of the carrier to form a pattern and expose the substrate member in the holes, filling each hole in the carrier with an electrically conductive member, and removing the substrate member from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.

摘要翻译： 制造电连接部件的方法包括以下步骤：将含有感光树脂的载体施加到基板部件上，在载体的一部分上形成孔以形成图案，并将基板部件暴露在孔中， 所述载体具有导电构件，并且从所述载体移除所述基底构件。 利用这种方法，可以容易地制造可以提供高密度电连接部分并且可以提高电连接的可靠性和安全性的电连接构件。

公开(公告)号：US5197892A

公开(公告)日：1993-03-30

申请号：US677379

申请日：1991-03-27

申请人： Tetsuo Yoshizawa ,  Yoshimi Tarayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Tetsuo Yoshizawa ,  Yoshimi Tarayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： H01L23/29 ,  H01L23/498 ,  H01L23/552 ,  H05K3/32

CPC分类号： H01L23/552 ,  H01L23/295 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/3025 ,  H05K3/321

摘要： An electric circuit device comprises an electric connecting member comprising a support member made of an electrically insulating material and a plurality of electrically conductive members buried in the support member and being isolated from one another. The ends of one side of the electrically conductive members are exposed at one surface of the support member, and the ends on the other side of the electrically conductive members are exposed at another surface of the support member. A first electric circuit component has connecting regions connected to the one set of ends of the electrically conductive members, and a second electric circuit component has connecting regions connected to the other set of ends of the electrically conductive members. Some of the electrically conductive members can be arranged in a zigzag pattern, and the pattern of the exposed ends of at least one electrically conductive member is wave-like or S-like.

摘要翻译： 电路装置包括电连接构件，电连接构件包括由电绝缘材料制成的支撑构件和埋在支撑构件中并彼此隔离的多个导电构件。 导电构件的一侧的端部在支撑构件的一个表面处露出，并且导电构件的另一侧上的端部在支撑构件的另一个表面处露出。 第一电路部件具有连接到导电构件的一组端部的连接区域，并且第二电路部件具有连接到导电构件的另一组端部的连接区域。 一些导电构件可以以锯齿形图案布置，并且至少一个导电构件的露出端的图案是波浪形或类似S形。

公开(公告)号：US5283468A

公开(公告)日：1994-02-01

申请号：US43629

申请日：1993-04-08

申请人： Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Shunichi Haga ,  Tetsuo Yoshizawa ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Shunichi Haga ,  Tetsuo Yoshizawa ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： H01L21/68 ,  H01L23/10 ,  H01L23/498 ,  H01L25/065 ,  H01L23/16 ,  H01L39/02 ,  H01L23/48

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/10 ,  H01L23/49827 ,  H01L24/96 ,  H01L25/0655 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1627 ,  H01L2924/16315 ,  H01L2924/3025 ,  H01L2924/351

摘要： An electric circuit apparatus comprises an electrically connecting member including a holding body made of an electrically insulating material and a plurality of electrically conductive members embedded in the holding body. First end portions of the electrically conductive member extend through a first side of the holding body and second end portions of the electrically conductive member extend through the other side of the holding body. A plurality of electric circuit components are connected to the second end portions of the electrically conductive members.

摘要翻译： 电路装置包括电连接构件，其包括由电绝缘材料制成的保持体和嵌入保持体中的多个导电构件。 导电构件的第一端部延伸穿过保持体的第一侧，并且导电构件的第二端部延伸穿过保持体的另一侧。 多个电路部件连接到导电部件的第二端部。

公开(公告)号：US4926549A

公开(公告)日：1990-05-22

申请号：US358269

申请日：1989-05-30

申请人： Tetsuo Yoshizawa ,  Yoshimi Terayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

发明人： Tetsuo Yoshizawa ,  Yoshimi Terayama ,  Hiroshi Kondo ,  Takashi Sakaki ,  Shunichi Haga ,  Yasuteru Ichida ,  Masaki Konishi

IPC分类号： H01R43/00 ,  G01R1/073 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3025 ,  Y10T29/49208

摘要： A method of producing electrical connection members includes the steps of forming a carrier on a first electrically conductive member, etching holes in portions of the carrier to expose first electrically conductive member in the holes, and etching the portions of the first electrically conductive member which are exposed in the respective holes to form recesses in the first electrically conductive member so that each of the recesses has a diameter larger than the diameter of a corresponding one of the holes. The respective holes formed in the carrier are filled with second electrically conductive members, and then the first electrically conductive member is removed from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.

公开(公告)号：US07855131B2

公开(公告)日：2010-12-21

申请号：US12385782

申请日：2009-04-20

申请人： Hirokazu Fujiwara ,  Masaki Konishi ,  Takeo Yamamoto ,  Eiichi Okuno ,  Yukihiko Watanbe ,  Takashi Katsuno

发明人： Hirokazu Fujiwara ,  Masaki Konishi ,  Takeo Yamamoto ,  Eiichi Okuno ,  Yukihiko Watanbe ,  Takashi Katsuno

IPC分类号： H01L21/322

CPC分类号： H01L29/47 ,  H01L21/046 ,  H01L29/1608 ,  H01L29/66143 ,  H01L29/872

摘要： A manufacturing method of a semiconductor device comprises a process of doping conductive impurities in a silicon carbide substrate, a process of forming a cap layer on a surface of the silicon carbide substrate, a process of activating the conductive impurities doped in the silicon carbide substrate, a process of oxidizing the cap layer after a first annealing process, and a process of removing the oxidized cap layer. It is preferred that the cap layer is formed from material that includes metal carbide. Since the oxidation onset temperature of metal carbide is comparatively low, the oxidization of the cap layer becomes easy if metal carbide is included in the cap layer. Specifically, it is preferred that the cap layer is formed from metal carbide that has an oxidation onset temperature of 1000 degrees Celsius or below, such as tantalum carbide.

摘要翻译： 半导体器件的制造方法包括在碳化硅衬底中掺杂导电杂质的工艺，在碳化硅衬底的表面上形成覆盖层的工艺，激活掺杂在碳化硅衬底中的导电杂质的工艺， 在第一退火工艺之后氧化盖层的工艺，以及去除氧化的盖层的工艺。 优选的是，盖层由包括金属碳化物的材料形成。 由于金属碳化物的氧化开始温度相对较低，如果在盖层中包括金属碳化物，则盖层的氧化变得容易。 具体而言，优选盖层由氧化开始温度为1000℃以下的金属碳化物形成，例如碳化钽。

公开(公告)号：US08168485B2

公开(公告)日：2012-05-01

申请号：US12461205

申请日：2009-08-04

申请人： Takeshi Endo ,  Eiichi Okuno ,  Takeo Yamamoto ,  Hirokazu Fujiwara ,  Masaki Konishi ,  Yukihiko Watanabe ,  Takashi Katsuno

发明人： Takeshi Endo ,  Eiichi Okuno ,  Takeo Yamamoto ,  Hirokazu Fujiwara ,  Masaki Konishi ,  Yukihiko Watanabe ,  Takashi Katsuno

IPC分类号： H01L29/812 ,  H01L21/338

CPC分类号： H01L29/872 ,  H01L29/456 ,  H01L29/47 ,  H01L29/66136 ,  H01L29/66143 ,  H01L29/861

摘要： A method of making a semiconductor device includes forming a p-type semiconductor region to an n-type semiconductor substrate in such a manner that the p-type semiconductor region is partially exposed to a top surface of the semiconductor substrate, forming a Schottky electrode of a first material in such a manner that the Schottky electrode is in Schottky contact with an n-type semiconductor region exposed to the top surface of the semiconductor substrate, and forming an ohmic electrode of a second material different from the first material in such a manner that the ohmic electrode is in ohmic contact with the exposed p-type semiconductor region. The Schottky electrode is formed earlier than the ohmic electrode.

摘要翻译： 制造半导体器件的方法包括：以p型半导体区域部分地暴露于半导体衬底的顶表面，形成p型半导体区域到n型半导体衬底，形成肖特基电极 以使肖特基电极与暴露于半导体衬底的顶表面的n型半导体区域肖特基接触的方式形成第一材料，并且以这种方式形成不同于第一材料的第二材料的欧姆电极 欧姆电极与暴露的p型半导体区域欧姆接触。 肖特基电极比欧姆电极早。

公开(公告)号：US20100032730A1

公开(公告)日：2010-02-11

申请号：US12461205

申请日：2009-08-04

申请人： Takeshi Endo ,  Eiichi Okuno ,  Takeo Yamamoto ,  Hirokazu Fujiwara ,  Masaki Konishi ,  Yukihiko Watanabe ,  Takashi Katsuno

发明人： Takeshi Endo ,  Eiichi Okuno ,  Takeo Yamamoto ,  Hirokazu Fujiwara ,  Masaki Konishi ,  Yukihiko Watanabe ,  Takashi Katsuno

IPC分类号： H01L29/812 ,  H01L21/338

CPC分类号： H01L29/872 ,  H01L29/456 ,  H01L29/47 ,  H01L29/66136 ,  H01L29/66143 ,  H01L29/861

摘要： A method of making a semiconductor device includes forming a p-type semiconductor region to an n-type semiconductor substrate in such a manner that the p-type semiconductor region is partially exposed to a top surface of the semiconductor substrate, forming a Schottky electrode of a first material in such a manner that the Schottky electrode is in Schottky contact with an n-type semiconductor region exposed to the top surface of the semiconductor substrate, and forming an ohmic electrode of a second material different from the first material in such a manner that the ohmic electrode is in ohmic contact with the exposed p-type semiconductor region. The Schottky electrode is formed earlier than the ohmic electrode.

摘要翻译： 制造半导体器件的方法包括：以p型半导体区域部分地暴露于半导体衬底的顶表面，形成p型半导体区域到n型半导体衬底，形成肖特基电极 以使肖特基电极与暴露于半导体衬底的顶表面的n型半导体区域肖特基接触的方式形成第一材料，并且以这种方式形成不同于第一材料的第二材料的欧姆电极 欧姆电极与暴露的p型半导体区域欧姆接触。 肖特基电极比欧姆电极早。