Communication Method, Communication System And Base Station
    1.
    发明申请
    Communication Method, Communication System And Base Station 有权
    通信方式,通信系统和基站

    公开(公告)号:US20100248726A1

    公开(公告)日:2010-09-30

    申请号:US12813112

    申请日:2010-06-10

    IPC分类号: H04W36/00 H04B1/38

    CPC分类号: H04W36/02 H04W92/20

    摘要: A communication method in a communication system, wherein the communication system includes a mobile terminal, a communication server that distributes data to the mobile terminal, and plural base stations that are capable of relaying the data, and one of the base stations among the plural base stations is responsible for relaying the data. The communication method includes transmitting, to the communication server, restriction instruction information to restrict a data transmission rate, by a first base station that is responsible for relaying the data among the plural base stations, and hand-overing, by the first base station, causing a second base station different from the first base station to take over the responsibility of relaying.

    摘要翻译: 一种通信系统中的通信方法,其中,所述通信系统包括移动终端,向所述移动终端分发数据的通信服务器,以及能够中继所述数据的多个基站,以及所述多个基站 站负责中继数据。 该通信方法包括:通过负责中继多个基站之间的数据的第一基站和由第一基站进行切换的向通信服务器发送限制指令信息以限制数据传输速率, 导致与第一基站不同的第二基站接管中继的责任。

    BASE STATION APPARATUS, MOBILE STATION AND WIRELESS COMMUNICATION CONTROLLING METHOD
    2.
    发明申请
    BASE STATION APPARATUS, MOBILE STATION AND WIRELESS COMMUNICATION CONTROLLING METHOD 有权
    基站设备,移动站和无线通信控制方法

    公开(公告)号:US20090318155A1

    公开(公告)日:2009-12-24

    申请号:US12431933

    申请日:2009-04-29

    IPC分类号: H04W36/38

    CPC分类号: H04W36/0061 H04W92/20

    摘要: A wireless base station includes a candidate-cell obtaining unit that obtains a plurality of wireless communication route candidates usable for wireless communication of a mobile station with wireless base stations; a candidate-cell extracting unit that determines whether a wireless communication route candidate via which wireless communication can be performed is included in a plurality of wireless communication route candidates managed by the wireless base station itself from among the obtained wireless communication route candidates; a self-station determining unit; and a handover preparing unit that, when wireless communication can be performed via at least any of the wireless communication route candidates managed by the wireless base station itself according to the result of determination, notifies a wireless base station with which the mobile station is in wireless communication that wireless communication can be performed with the mobile station.

    摘要翻译: 无线基站包括获取可用于具有无线基站的移动台的无线通信的多个无线通信路由候选的候选小区获取单元; 候选小区提取单元,其从所获得的无线通信路由候选中,确定能够通过无线通信进行无线通信的无线通信路由候选被包含在由所述无线基站本身管理的多个无线通信路由候选中; 自站确定单元; 以及切换准备单元,当通过根据确定结果的无线基站本身管理的无线通信路由候选中的至少任一个进行无线通信时,向无线基站通知无线基站 可以与移动台进行无线通信的通信。

    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    基板加工装置及制造半导体装置的方法

    公开(公告)号:US20090197409A1

    公开(公告)日:2009-08-06

    申请号:US12363059

    申请日:2009-01-30

    IPC分类号: H01L21/285 C23C16/44

    摘要: Provided is a substrate processing apparatus. The substrate processing apparatus comprises a reaction tube; a heating device configured to heat the reaction tube; and a manifold installed outward as compared with the heating device and made of a nonmetallic material. A first thickness of the manifold defined in a direction perpendicular to a center axis of the reaction tube is greater than a second thickness of the manifold defined at a position adjacent to the reaction tube in a direction parallel to the center axis of the reaction tube. The manifold comprises a protrusion part of which at least a portion protrudes inward more than an inner wall of the reaction tube, and a gas supply unit disposed at at least the protrusion part for supplying gas to an inside of the reaction tube.

    摘要翻译: 提供了一种基板处理装置。 基板处理装置包括反应管; 构造成加热反应管的加热装置; 以及与加热装置相比并且由非金属材料制成的歧管。 在垂直于反应管的中心轴的方向上限定的歧管的第一厚度大于在与反应管的中心轴平行的方向上与反应管相邻的位置处限定的歧管的第二厚度。 歧管包括突出部分,其至少一部分比反应管的内壁向内突出;以及气体供应单元,设置在至少突出部分处,以将气体供应到反应管的内部。

    BRAKE CONTROL APPARATUS
    5.
    发明申请
    BRAKE CONTROL APPARATUS 审中-公开
    制动控制装置

    公开(公告)号:US20080054716A1

    公开(公告)日:2008-03-06

    申请号:US11846709

    申请日:2007-08-29

    IPC分类号: B60T7/12 F16D65/14 G06F7/70

    摘要: A brake control apparatus includes an actuator configured to generate a braking force of road wheel; a first control unit configured to calculate a target braking controlled variable in accordance with an amount of brake manipulation of a driver; and a second control unit including a backup calculation section configured to calculate a backup target braking controlled variable, by receiving the amount of brake manipulation separately from the first control unit. The second control unit selects one of the target braking controlled variable and the backup target braking controlled variable in accordance with operating conditions of the first control unit and the second control unit. The second control unit outputs a drive signal to the actuator so as to bring the braking force of road wheel closer to the selected one of the target braking controlled variable and the backup target braking controlled variable.

    摘要翻译: 一种制动控制装置,包括:致动器,被构造成产生车轮的制动力; 第一控制单元,被配置为根据驾驶员的制动操作量来计算目标制动控制变量; 以及第二控制单元,其包括备用计算部,其被配置为通过分别接收与所述第一控制单元相关的制动操作量来计算备用目标制动控制变量。 第二控制单元根据第一控制单元和第二控制单元的运行条件选择目标制动控制变量和备用目标制动控制变量中的一个。 第二控制单元向致动器输出驱动信号,使得车轮的制动力更接近目标制动控制变量和备用目标制动控制变量中的所选择的一个。

    SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SUBSTRATE MANUFACTURING METHOD
    7.
    发明申请
    SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SUBSTRATE MANUFACTURING METHOD 审中-公开
    基板加工装置,半导体装置制造方法及基板制造方法

    公开(公告)号:US20110306212A1

    公开(公告)日:2011-12-15

    申请号:US13158089

    申请日:2011-06-10

    摘要: Embodiments described herein relate to a substrate processing apparatus includes a reaction tube, a processing chamber provided inside the reaction tube to process a substrate therein, an induction target provided inside the reaction tube to surround the processing chamber and configured to heat the substrate, a heat insulator provided inside the reaction tube to surround the induction target, an induction target provided outside the reaction tube to inductively heat at least the induction target, a first gas supply unit for supplying a first gas into the processing chamber, and a second gas supply unit for supplying a second gas to a first gap provided between the induction target and the heat insulator.

    摘要翻译: 本文所述的实施例涉及一种基板处理装置,其包括反应管,设置在反应管内部以用于处理其中的基板的处理室,设置在反应管内部以包围处理室并被构造为加热基板的感应目标, 设置在反应管的内部以包围感应对象的绝缘体,设置在反应管外侧的感应对象,至少对感应对象进行感应加热,将第一气体供给至处理室的第一气体供给单元和第二气体供给单元 用于将第二气体供给到设置在感应对象和隔热体之间的第一间隙。

    SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUBSTRATE
    8.
    发明申请
    SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUBSTRATE 有权
    基板加工装置,制造半导体装置的方法及其制造方法

    公开(公告)号:US20110210118A1

    公开(公告)日:2011-09-01

    申请号:US13034035

    申请日:2011-02-24

    IPC分类号: H05B6/10

    CPC分类号: H05B6/108

    摘要: There are provided a substrate processing apparatus and a method of manufacturing a substrate in which induction heating of members made of a metal material and installed outside an induction coil is suppressed and safety may be improved during processing of a substrate. The substrate processing apparatus includes: a reaction tube for accommodating a substrate; an induction heating unit installed to surround an outer circumference of the reaction tube; a shielding unit installed to surround an outside of the induction heating unit; a gas supply unit for supplying at least a source gas into the reaction tube; and a controller for processing the substrate by heating an inside of the reaction tube using the induction heating unit, and supplying at least the source gas from the gas supply unit into the reaction tube.

    摘要翻译: 提供了一种基板处理装置和制造基板的方法,其中抑制了由金属材料制成并且安装在感应线圈外部的构件的感应加热,并且在基板的加工期间可以改善安全性。 基板处理装置包括:用于容纳基板的反应管; 感应加热单元,安装成围绕反应管的外周; 屏蔽单元,安装成围绕感应加热单元的外部; 气体供给单元,用于至少将源气体供给到所述反应管中; 以及控制器,其通过使用所述感应加热单元加热所述反应管的内部来处理所述基板,并且至少将来自所述气体供应单元的源气体供应到所述反应管中。