公开(公告)号：US06235436B1

公开(公告)日：2001-05-22

申请号：US09442277

申请日：1999-11-17

申请人： Takashi Hirano ,  Toshio Banba ,  Hiroaki Makabe ,  Naoshige Takeda ,  Toshiro Takeda

发明人： Takashi Hirano ,  Toshio Banba ,  Hiroaki Makabe ,  Naoshige Takeda ,  Toshiro Takeda

IPC分类号： G03F730

CPC分类号： G03F7/0226 ,  G03F7/0755 ,  G03F7/0757 ,  Y10S430/107

摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 &mgr;m on a semiconductor element.

摘要翻译： 一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的二价基团：其中R 1和R 2表示二价有机基团，并且R 3和R 4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

公开(公告)号：US20120100484A1

公开(公告)日：2012-04-26

申请号：US13321180

申请日：2009-05-20

申请人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

发明人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

IPC分类号： G03F7/027

CPC分类号： G03F7/0233 ,  G03F7/0226

摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.

摘要翻译： 正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式 通式（2）。 式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2） 表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是 披露

公开(公告)号：US06607865B2

公开(公告)日：2003-08-19

申请号：US10059169

申请日：2002-01-31

申请人： Hiroaki Makabe ,  Toshio Banba ,  Takashi Hirano

发明人： Hiroaki Makabe ,  Toshio Banba ,  Takashi Hirano

IPC分类号： G03F7023

CPC分类号： G03F7/022 ,  G03F7/0226 ,  G03F7/0233

摘要： The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight of a polyamide resin and 1 to 50 parts by weight of a photosensitizer represented by, for example, the following formula (Q-1):

公开(公告)号：US6071666A

公开(公告)日：2000-06-06

申请号：US854863

申请日：1997-05-12

申请人： Takashi Hirano ,  Toshio Banba ,  Hiroaki Makabe ,  Naoshige Takeda ,  Toshiro Takeda

发明人： Takashi Hirano ,  Toshio Banba ,  Hiroaki Makabe ,  Naoshige Takeda ,  Toshiro Takeda

IPC分类号： G03F7/022 ,  G03F7/075 ,  G03F7/023

CPC分类号： G03F7/0226 ,  G03F7/0755 ,  G03F7/0757 ,  Y10S430/107

摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.m on a semiconductor element.

摘要翻译： 一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的基团：其中R1和R2表示有机基团，R3和R4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

公开(公告)号：US06927013B2

公开(公告)日：2005-08-09

申请号：US10474831

申请日：2002-04-30

申请人： Toshio Banba ,  Hiroaki Makabe ,  Takashi Hirano

发明人： Toshio Banba ,  Hiroaki Makabe ,  Takashi Hirano

IPC分类号： G03F7/022 ,  G03F7/023 ,  G03F7/075 ,  G03F7/039

CPC分类号： G03F7/037 ,  G03F7/022 ,  G03F7/0233 ,  G03F7/0757

摘要： The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound. In addition, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide, 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound and 1 to 30 parts by weight of a phenol compound. Furthermore, the present invention provides a semiconductor device manufactured by using said positive-working photosensitive resin composition.

摘要翻译： 本发明提供一种具有高灵敏度的正性感光性树脂组合物，其具有高分辨率和高膜厚保持率的图案。 换句话说，本发明提供一种正性感光性树脂组合物，其包含100重量份的聚酰胺和1至50重量份的感光材料，即1,2-萘醌-2-重氮化物-5 - 磺酸酯化合物或酚化合物的1,2-萘醌-2-重氮化物-4-磺酸酯化合物。 此外，本发明提供一种正性感光性树脂组合物，其包含100重量份的聚酰胺，1至50重量份的感光材料，即1,2-萘醌-2-重氮基-5- 磺酸酯化合物或酚化合物的1,2-萘醌-2-二叠氮-4-磺酸酯化合物和1〜30重量份苯酚化合物。 此外，本发明提供了通过使用所述正性感光性树脂组合物制造的半导体器件。

公开(公告)号：US06576381B1

公开(公告)日：2003-06-10

申请号：US09913156

申请日：2001-08-10

申请人： Takashi Hirano ,  Kagehisa Yamamoto ,  Toshio Banba ,  Hiroaki Makabe

发明人： Takashi Hirano ,  Kagehisa Yamamoto ,  Toshio Banba ,  Hiroaki Makabe

IPC分类号： G03C300

CPC分类号： H01L24/12 ,  C08G73/22 ,  C09D179/04 ,  G03F7/0233 ,  H01L23/5329 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode.

摘要翻译： 本发明减轻了倒装芯片生产中的操作问题，并且提供了在各种可靠性方面优异的半导体器件。 本发明的目的在于一种封装半导体装置，其特征在于，包括：（a）通过在电路形成的芯片上涂布由100重量份聚酰胺和1〜100重量份的正型感光性树脂组合物而得到的用于芯片保护的聚苯并恶唑树脂膜 重量份的光敏重氮醌化合物，并对涂覆的组合物进行图案化和固化，和（b）凸块电极。

公开(公告)号：US08530119B2

公开(公告)日：2013-09-10

申请号：US13321180

申请日：2009-05-20

申请人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

发明人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

IPC分类号： G03F7/023

CPC分类号： G03F7/0233 ,  G03F7/0226

摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.

摘要翻译： 正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式 通式（2）。 式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2） 表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是 披露

公开(公告)号：US20100062273A1

公开(公告)日：2010-03-11

申请号：US12525309

申请日：2008-02-18

申请人： Hiroaki Makabe ,  Koji Terakawa

发明人： Hiroaki Makabe ,  Koji Terakawa

IPC分类号： B32B27/06 ,  C08J3/28 ,  B32B9/04

CPC分类号： H01L21/02118 ,  C08G73/10 ,  C08G73/22 ,  C08L79/04 ,  C08L79/08 ,  G03F7/022 ,  G03F7/0233 ,  H01L21/02282 ,  H01L21/312 ,  Y10T428/31721

摘要： A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.

摘要翻译： 光敏树脂组合物包括具有聚苯并恶唑前体结构的碱溶性树脂或聚酰亚胺前体结构，或二者均为光敏剂，所述碱溶性树脂的环化速率[（A] / [B]）为[ A]（％）在300℃下的环化速率[B]（％）为0.70以上。 根据本发明，在半导体器件，固化膜，保护膜，绝缘膜和半导体器件的制造中具有高灵敏度和高生产率的感光性树脂组合物以及使用该固化膜的显示装置 提供。

公开(公告)号：US08530133B2

公开(公告)日：2013-09-10

申请号：US13248015

申请日：2011-09-28

申请人： Andrew Bell ,  Keitaro Seto ,  Hiroaki Makabe ,  Edmund Elce

发明人： Andrew Bell ,  Keitaro Seto ,  Hiroaki Makabe ,  Edmund Elce

IPC分类号： G03F7/023 ,  C07C39/12 ,  C07C245/18 ,  C07C39/17

CPC分类号： G03F7/022 ,  C07C39/17 ,  C07C43/1782 ,  C07C43/1783 ,  C07C43/1788 ,  C07C245/12 ,  C07C309/71 ,  C07C2601/16 ,  C07C2602/10 ,  C07C2602/24 ,  C07C2603/86 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/40

摘要： Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin.

摘要翻译： 根据本发明的实施方案提供了降冰片烷型镇流材料，衍生自这种压载材料的降冰片烷酮型光活性化合物和包括这种降冰片烷烷型光敏化合物和PBO或PNB树脂之一的碱溶性正色聚合物组合物 。

公开(公告)号：US07858721B2

公开(公告)日：2010-12-28

申请号：US12387025

申请日：2009-04-27

申请人： Dino Amoroso ,  Brian Bedwell ,  Andrew Bell ,  Edmund Elce ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Robert Shick ,  Xiaoming Wu ,  Hiroaki Makabe ,  Yasunori Takahashi ,  Etsu Takeuchi ,  Daoji Gan ,  Seok Ho Kang

发明人： Dino Amoroso ,  Brian Bedwell ,  Andrew Bell ,  Edmund Elce ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Robert Shick ,  Xiaoming Wu ,  Hiroaki Makabe ,  Yasunori Takahashi ,  Etsu Takeuchi ,  Daoji Gan ,  Seok Ho Kang

IPC分类号： C08F232/02 ,  G03F7/004

CPC分类号： G03F7/0395 ,  C08F232/08 ,  C08G61/02 ,  C08G61/06 ,  C08G61/12 ,  C08L65/00 ,  G03F7/0046 ,  G03F7/0233 ,  G03F7/038 ,  Y10S430/106

摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

摘要翻译： 根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。 其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。