公开(公告)号：US08164000B2

公开(公告)日：2012-04-24

申请号：US12135849

申请日：2008-06-09

申请人： Tso-Hung Yeh ,  Hung-Yi Chang ,  Shing-Tza Liou

发明人： Tso-Hung Yeh ,  Hung-Yi Chang ,  Shing-Tza Liou

IPC分类号： H05K1/00

CPC分类号： H05K1/056 ,  B82Y10/00 ,  H05K1/0206 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/24124 ,  Y10T428/24132

摘要： A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.

摘要翻译： 用于柔性印刷电路板的柔性印刷电路板基膜包括柔性聚合物基体片和嵌入聚合物基质中的多个碳纳米管束。 每个纳米管束彼此间隔开。 柔性聚合物基质包括第一表面和第二表面。 由于碳纳米管的高导热性，可以从柔性印刷电路板基膜的第一表面到第二表面有效地传导热量。 本发明还提供了由柔性印刷电路板基膜制成的柔性层压板和由柔性层压板制成的柔性印刷电路板。

公开(公告)号：US20090176080A1

公开(公告)日：2009-07-09

申请号：US12140480

申请日：2008-06-17

申请人： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

发明人： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

IPC分类号： B32B33/00 ,  B32B5/00 ,  C08G16/00 ,  H05K1/00

CPC分类号： H05K3/0064 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B37/12 ,  B32B2250/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2367/00 ,  B32B2457/08 ,  C08G63/189 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0195 ,  Y10T428/264 ,  Y10T428/28 ,  Y10T428/2848

摘要： An exemplary stiffener includes at least one polyethylene naphthalate layer. The at least one polyethylene naphthalate layer is represented by the following formula:

摘要翻译： 示例性的加强件包括至少一种聚萘二甲酸乙二醇酯层。 所述至少一种聚萘二甲酸乙二醇酯层由下式表示：

公开(公告)号：US08453324B2

公开(公告)日：2013-06-04

申请号：US13306811

申请日：2011-11-29

申请人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

发明人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC分类号： H01K3/10

CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

摘要翻译： FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

公开(公告)号：US07985482B2

公开(公告)日：2011-07-26

申请号：US12144260

申请日：2008-06-23

申请人： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

发明人： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

IPC分类号： B32B27/08 ,  B32B27/34

CPC分类号： H05K3/0064 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/42 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721 ,  Y10T428/31725

摘要： A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.

摘要翻译： 用于柔性印刷柔性印刷电路板的加强片包括交替层叠的聚酰亚胺层和聚酰胺酰亚胺层，其中聚酰胺酰亚胺的分子结构由下式表示：其中Ar和Ar'表示不同的取代芳族基团。

公开(公告)号：US07511962B2

公开(公告)日：2009-03-31

申请号：US11960656

申请日：2007-12-19

申请人： Ning Hou ,  Shing-Tza Liou

发明人： Ning Hou ,  Shing-Tza Liou

IPC分类号： H05K1/00

CPC分类号： H05K1/0281 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009

摘要： A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

摘要翻译： 柔性印刷电路板包括柔性基座，工作迹线区域和至少一个加强迹线。 工作轨迹区域和至少一个加强迹线形成在柔性基座上。 工作痕迹由多条工作痕迹组成。 在柔性基座中，至少一个加强迹线设置在工作轨迹区域的周边。

公开(公告)号：US08052881B2

公开(公告)日：2011-11-08

申请号：US12164422

申请日：2008-06-30

申请人： Yun-Li Zhu ,  Yung-Wei Lai ,  Shing-Tza Liou

发明人： Yun-Li Zhu ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC分类号： H05K13/00

CPC分类号： H05K3/4638 ,  H05K1/0269 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/09063 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/166 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/10

摘要： A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board.

摘要翻译： 一种制造多层印刷电路板的方法包括以下步骤。 提供了许多层压单元。 每个层压单元包括其中限定有电路图案的导电层和可剥离地附接到导电层的剥离层。 提供了许多绝缘层。 每个绝缘层在其中确定了金属化的通孔。 导电层和绝缘层交替地堆叠在一起，使得相邻的导电层被一个绝缘层绝缘，并且金属化的通孔电连接相邻的导电层的电路图案。 在堆叠步骤中，在将导电层堆叠在各绝缘层上之后，从层压单元中去除剥离层，从而获得预层压多层印刷电路板。 层叠的导电层和绝缘层被层叠在一起以实现多层印刷电路板。

公开(公告)号：US07728232B2

公开(公告)日：2010-06-01

申请号：US11964578

申请日：2007-12-26

申请人： Feng-Yan Huang ,  Shing-Tza Liou

发明人： Feng-Yan Huang ,  Shing-Tza Liou

IPC分类号： H05K1/00

CPC分类号： H05K1/118 ,  C09J7/10 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2433/00 ,  H05K3/0058 ,  H05K3/323 ,  H05K3/386 ,  H05K2201/0187 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/2009 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2857

摘要： An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

摘要翻译： 示例性粘合剂层包括粘合剂主体，其具有第一粘合剂表面和在粘合剂主体的与第一粘合剂表面相对的一侧上的第二粘合剂表面。 粘合剂主体在第一粘合剂表面和第二粘合剂表面之间限定多个通孔。 通孔填充有比粘合剂主体具有更高粘合力的内部粘合剂。 可以提高粘合剂主体的第一粘合剂表面和第二粘合剂表面的粘附性，从而防止具有粘合剂层的印刷电路板变形。

公开(公告)号：US20090120671A1

公开(公告)日：2009-05-14

申请号：US12170735

申请日：2008-07-10

申请人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

发明人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC分类号： H05K1/03 ,  H05K3/42

CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.

摘要翻译： 柔性印刷电路板基板包括导电层，绝缘层和钩。 导电层具有与第一表面相对的第一表面和第二表面。 该绝缘层具有与第三表面相对的第三表面和第四表面。 绝缘层的第三表面与导电层的第二表面结合。 在导电层和绝缘层中限定了通孔，该绝缘层从导电层的第一表面延伸到绝缘层的第四表面。 钩从导电层延伸并穿过通孔从绝缘层的第四表面突出。

公开(公告)号：US08071887B2

公开(公告)日：2011-12-06

申请号：US12253869

申请日：2008-10-17

申请人： Shing-Tza Liou ,  Yao-Wen Bai ,  Cheng-Hsien Lin

发明人： Shing-Tza Liou ,  Yao-Wen Bai ,  Cheng-Hsien Lin

IPC分类号： H05K1/03

CPC分类号： H05K1/097 ,  B82Y10/00 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2203/013 ,  Y10T29/49155 ,  Y10T428/2462 ,  Y10T428/30 ,  Y10T428/32

摘要： A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.

摘要翻译： 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。

公开(公告)号：US08205330B2

公开(公告)日：2012-06-26

申请号：US12135873

申请日：2008-06-09

申请人： Qi Zhang ,  Yung-Wei Lai ,  Shing-Tza Liou

发明人： Qi Zhang ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC分类号： H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.

摘要翻译： 提供了制造印刷电路板的示例性方法。 在该方法中，提供了具有在基板与第一表面相对的第一表面和第二表面的基板。 形成在第一表面和第二表面之间的衬底中的多个通孔。 将导电浆料施加到基材上以填充限定在基材中的通孔，以形成多个填充构件，并印刷在基板的第一表面和第二表面中的至少一个上以形成多个电迹线 。 位于衬底中的通孔中的填充构件和印刷在衬底上的电迹线被固化。