公开(公告)号：US20070209834A1

公开(公告)日：2007-09-13

申请号：US11276645

申请日：2006-03-08

申请人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano

发明人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano

IPC分类号： H01R13/46 ,  H05K5/00

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An integrated circuit leaded stacked package system including forming an no-lead integrated circuit package having a mold cap, and attaching a mold cap of an extended-lead integrated circuit package facing the mold cap of the no-lead integrated circuit package.

摘要翻译： 一种集成电路引线堆叠封装系统，包括形成具有模具帽的无引线集成电路封装，以及附接面向无引线集成电路封装的模具帽的延伸引线集成电路封装的模具盖。

公开(公告)号：US20070210443A1

公开(公告)日：2007-09-13

申请号：US11276646

申请日：2006-03-08

申请人： Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan ,  Tsz Yin Ho

发明人： Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan ,  Tsz Yin Ho

IPC分类号： H01L23/12

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.

摘要翻译： 一种集成电路封装在封装系统上，包括形成互连集成电路封装并将互连集成电路封装上的扩展引线集成电路封装，其中延伸引线集成电路封装的模帽面向互连集成电路的模具盖 包。

公开(公告)号：US20070210424A1

公开(公告)日：2007-09-13

申请号：US11276647

申请日：2006-03-08

申请人： Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan

发明人： Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.

摘要翻译： 一种封装系统中的集成电路封装，包括形成具有基部引线的基极集成电路封装，所述基极引线具有基本平坦的基面的部分，形成具有延伸引线的延伸引线集成电路封装，所述延伸引线具有基本平坦的引线端部分 表面，并且在基本集成电路封装上堆叠延伸引线集成电路封装，其中基本平坦的引出端表面与基本平坦的基面共面。

公开(公告)号：US20110248411A1

公开(公告)日：2011-10-13

申请号：US13166417

申请日：2011-06-22

申请人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, JR. ,  Heap Hoe Kuan

发明人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, JR. ,  Heap Hoe Kuan

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.

摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。

公开(公告)号：US08164172B2

公开(公告)日：2012-04-24

申请号：US13166417

申请日：2011-06-22

申请人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaanor, Jr. ,  Heap Hoe Kuan

发明人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaanor, Jr. ,  Heap Hoe Kuan

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.

摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。

公开(公告)号：US07981702B2

公开(公告)日：2011-07-19

申请号：US11276647

申请日：2006-03-08

申请人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan

发明人： Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan

IPC分类号： G01R31/26 ,  H01L21/66 ,  H01L21/00

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.

摘要翻译： 一种封装系统中的集成电路封装，包括形成具有基部引线的基极集成电路封装，所述基极引线具有基本平坦的基面的部分，形成具有延伸引线的延伸引线集成电路封装，所述延伸引线具有基本平坦的引线端 表面，并且在基本集成电路封装上堆叠延伸引线集成电路封装，其中基本平坦的引出端表面与基本平坦的基面共面。

公开(公告)号：US07986043B2

公开(公告)日：2011-07-26

申请号：US11276646

申请日：2006-03-08

申请人： Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan ,  Tsz Yin Ho

发明人： Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano, Jr. ,  Heap Hoe Kuan ,  Tsz Yin Ho

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.

摘要翻译： 一种集成电路封装在封装系统上，包括形成互连集成电路封装并将互连集成电路封装上的扩展引线集成电路封装，其中延伸引线集成电路封装的模帽面向互连集成电路的模具盖 包。

公开(公告)号：US08513542B2

公开(公告)日：2013-08-20

申请号：US11276645

申请日：2006-03-08

申请人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano

发明人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro A. Merilo ,  Seng Guan Chow ,  Antonio B. Dimaano

IPC分类号： H01L23/495 ,  H01L23/02

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An integrated circuit leaded stacked package system includes forming a no-lead integrated circuit package having a mold cap, and attaching a mold cap of an extended-lead integrated circuit package facing the mold cap of the no-lead integrated circuit package.

摘要翻译： 集成电路引线堆叠封装系统包括形成具有模帽的无引线集成电路封装，并且连接面向无引线集成电路封装的模帽的延伸引线集成电路封装的模具盖。

公开(公告)号：US07622325B2

公开(公告)日：2009-11-24

申请号：US11163771

申请日：2005-10-29

申请人： IL Kwon Shim ,  Tsz Yin Ho ,  Dario S. Filoteo, Jr. ,  Seng Guan Chow

发明人： IL Kwon Shim ,  Tsz Yin Ho ,  Dario S. Filoteo, Jr. ,  Seng Guan Chow

IPC分类号： H01L21/00

CPC分类号： H01L24/83 ,  H01L23/49811 ,  H01L23/64 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/10515 ,  H05K2201/10992 ,  H05K2203/0278 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.

摘要翻译： 提供了一种集成电路封装系统，其包括具有基板的高密度小尺寸封装体系。 无源元件安装在基板上。 焊料分离器设置在基板上，焊料分离器在基板上方的预定高度处具有平坦的顶部。 在基板上方的焊料分离器上支撑管芯。

公开(公告)号：US20070096282A1

公开(公告)日：2007-05-03

申请号：US11163771

申请日：2005-10-29

申请人： IL Kwon Shim ,  Tsz Yin Ho ,  Dario S. Filoteo ,  Seng Guan Chow

发明人： IL Kwon Shim ,  Tsz Yin Ho ,  Dario S. Filoteo ,  Seng Guan Chow

IPC分类号： H01L23/02

CPC分类号： H01L24/83 ,  H01L23/49811 ,  H01L23/64 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/10515 ,  H05K2201/10992 ,  H05K2203/0278 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.

摘要翻译： 提供了一种集成电路封装系统，其包括具有基板的高密度小尺寸封装体系。 无源元件安装在基板上。 焊料分离器设置在基板上，焊料分离器在基板上方的预定高度处具有平坦的顶部。 在基板上方的焊料分离器上支撑管芯。