摘要:
Disclosed is a coating composition that can provide structural materials having hydrophilicity, excellent self-cleaning property and long service life. The present invention also discloses a method for preparing the composition, a substrate, such as a film or structural exterior material like vinyl sidings, with the applied coating composition, and a method to prepare a substrate with the coating composition. The coating composition has hydroxy group-containing inorganic particles that improve the initial hydrophilicity of conventional coating agents. Additionally, by using two types of inorganic particles having different particles diameters, the coating composition can form a hydrophilic coating layer having a contact angle with water of 30° or less. Additionally, a low boiling point organic solvent having erosive property to a substrate to be coated may be used to allow the application of the coating layer to a conventional production line for structural exterior materials without adding a separate coating line.
摘要:
The present invention provides an apparatus for optical disc spin-coating that prevents leakage of a photocurable resin due to a capillary phenomenon by controlling a contact area between a cap and a disc so that contamination of the disc and manufacturing errors do not occur. Furthermore, the apparatus of the present invention can manufacture an optical disc having a central portion which is not contaminated by a photocurable resin and in which bubbles are not generated. In addition, the apparatus may further include a vacuum hole formed in the turntable, which can be opened and closed independently from the opening and closing of a vacuum hole formed in the central axis of the turntable, to prevent the lifting of the optical disc when the cap is removed. As a result, operability and the manufacturing efficiency of the apparatus can be increased significantly.
摘要:
Provided are a nanoporous membrane and a method of fabricating the same. The nanoporous membrane includes a support, and a separation layer including a plurality of nano-sized pores at a density of 1010/cm2 or greater and a matrix. The nanoporous membrane has a high flux and a high selectivity.
摘要:
In a method for fabricating a nitride-based compound layer, first, a GaN substrate is prepared. A mask layer with a predetermined pattern is formed on the GaN substrate to expose a partial area of the GaN substrate. Then a buffer layer is formed on the partially exposed GaN substrate. The buffer layer is made of a material having a 10% or less lattice mismatch with GaN. Thereafter, the nitride-based compound is grown laterally from a top surface of the buffer layer toward a top surface of the mask layer and the nitride-based compound layer is vertically grown to a predetermined thickness. Also, the mask layer and the buffer layer are removed via wet-etching to separate the nitride-based compound layer from the GaN substrate.
摘要:
Disclosed are a nitride based semiconductor device, including a high-quality GaN layer formed on a silicone substrate, and a process for preparing the same. A nitride based semiconductor device in accordance with the present invention comprises a plurality of nanorods aligned and formed on the silicone substrate in the vertical direction; an amorphous matrix layer filling spaces between nanorods so as to protrude some upper portion of the nanorods; and a GaN layer formed on the matrix layer.
摘要:
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.
摘要:
Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.
摘要:
A cover sheet of a substrate for data storage including a hard coating layer, a plastic containing substrate, and an adhesive layer is provided. Thus, the cover sheet of a uniform thickness can be provided and the substrate for data storage can be provided with scratch resistance and contamination resistance.
摘要:
Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.
摘要:
A method of growing a non-polar m-plane nitride semiconductor. A (11-23) plane sapphire substrate is prepared, and a non-polar (10-10) nitride semiconductor is grown on the sapphire substrate. The present invention can also be applied to a method for manufacturing other m-plane hexagonal semiconductors.