公开(公告)号：US09412920B2

公开(公告)日：2016-08-09

申请号：US13446540

申请日：2012-04-13

申请人： Yasunari Ooyabu ,  Hisataka Ito ,  Tsutomu Nishioka ,  Toshiki Naito

发明人： Yasunari Ooyabu ,  Hisataka Ito ,  Tsutomu Nishioka ,  Toshiki Naito

IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/46 ,  H01L23/00

CPC分类号： H01L33/56 ,  H01L24/97 ,  H01L33/46 ,  H01L33/505 ,  H01L2224/16 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2924/00

摘要： A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.

摘要翻译： 荧光体反射片在发光二极管元件的厚度方向的一侧提供荧光体层，并且在发光二极管元件侧提供反射树脂层。 荧光体反射片包括荧光体层和设置在荧光体层的厚度方向的一个表面上的反射树脂层。 反射树脂层相对于发光二极管元件形成为与发光二极管元件的侧面相对设置。

公开(公告)号：US09214611B2

公开(公告)日：2015-12-15

申请号：US13446517

申请日：2012-04-13

申请人： Yasunari Ooyabu ,  Tsutomu Nishioka ,  Hisataka Ito ,  Toshiki Naito

发明人： Yasunari Ooyabu ,  Tsutomu Nishioka ,  Hisataka Ito ,  Toshiki Naito

IPC分类号： H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L23/00 ,  H01L33/50

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81

摘要： A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element.

摘要翻译： 反射树脂片在发光二极管元件的一侧提供反射树脂层。 反射树脂片包括剥离基板和设置在剥离基板的厚度方向的一个表面上的反射树脂层。 对应于发光二极管元件形成反射树脂层，以便能够与发光二极管元件紧密接触。

公开(公告)号：US07265167B2

公开(公告)日：2007-09-04

申请号：US10703494

申请日：2003-11-10

申请人： Shinya Akizuki ,  Kazuhiro Ikemura ,  Hisataka Ito ,  Takahiro Uchida ,  Takuya Eto ,  Tsutomu Nishioka ,  Katsumi Shimada

发明人： Shinya Akizuki ,  Kazuhiro Ikemura ,  Hisataka Ito ,  Takahiro Uchida ,  Takuya Eto ,  Tsutomu Nishioka ,  Katsumi Shimada

IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/02 ,  H01L23/29

CPC分类号： H01L23/295 ,  C08G59/621 ,  C08K3/04 ,  C08K3/36 ,  C08K9/02 ,  H01L2224/13 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，其能够提供即使在互连电极距离或导体线距离的间距减小中也不会引起短路的高可靠性的半导体器件以及使用该半导体器件的半导体器件。 用于半导体封装的环氧树脂组合物，其包含以下组分（A）至（C）：（A）环氧树脂，（B）酚醛树脂，和（C）用于防止半导体短路的无机填料 半导体封装的一个步骤。

公开(公告)号：US20100330405A1

公开(公告)日：2010-12-30

申请号：US12866391

申请日：2009-06-18

申请人： Masanori Sumihara ,  Masakazu Yamada ,  Tsutomu Nishioka

发明人： Masanori Sumihara ,  Masakazu Yamada ,  Tsutomu Nishioka

IPC分类号： H01M10/0587

CPC分类号： H01M10/4235 ,  H01M4/13 ,  H01M10/0525 ,  H01M10/0585 ,  H01M10/0587

摘要： [Purpose] A purpose of the present invention is to provide a nonaqueous electrolyte secondary battery with high safety in which breakage of a positive electrode plate and buckling of a negative electrode plate are reduced during charging and discharging.[Solutions] A nonaqueous electrolyte secondary battery includes an electrode group 10 in which a positive electrode plate 4 including a positive electrode current collector 1 and a positive electrode material mixture layer 2a, 2b formed on the positive electrode current collector 1, and a negative electrode plate 8 including a negative electrode current collector 5 and a negative electrode material mixture layer 6a, 6b formed on the negative electrode current collector 8, are wound or stacked with a separator 9 interposed therebetween. The positive electrode material mixture layer 2a, 2b has at least one thin portion 3a, 3b extending perpendicularly to a longitudinal direction of the positive electrode plate 4.

摘要翻译： [目的]本发明的目的是提供一种高安全性的非水电解质二次电池，其在充放电期间正极板的断裂和负极板的翘曲减小。 [解决方案]非水电解质二次电池包括电极组10，其中包括正极集电体1的正极板4和形成在正极集电体1上的正极合剂层2a，2b和负极 包括负极集电体5的板8和形成在负极集电体8上的负极材料混合层6a，6b被隔板9缠绕或堆叠。 正极合剂层2a，2b具有与正极板4的长度方向垂直的至少一个薄壁部3a，3b。

公开(公告)号：US20100035140A1

公开(公告)日：2010-02-11

申请号：US12515482

申请日：2008-07-22

申请人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu ,  Seiichi Kato

发明人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu ,  Seiichi Kato

IPC分类号： H01M10/02 ,  H01M4/02 ,  H01M2/14 ,  H01M4/04

CPC分类号： H01M4/02 ,  H01M2/1653 ,  H01M4/04 ,  H01M4/131 ,  H01M4/525 ,  H01M4/62 ,  H01M4/70 ,  H01M4/75 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/058

摘要： In an electrode plate 3 including a both-surface coated part 14 in which an active material layer 13 and a porous protective film 28 are formed, a core material exposed part 18 which is an end part of the current collector core material 12 and in which the active material layer 13 and the porous protective film 28 are not formed, and a one-surface coated part 17 which is provided between the both-surface coated part 14 and the core material exposed part 18 and in which the active material layer 13 and the porous protective film 28 are formed, a plurality of grooves 10 are formed in both surfaces of the both-surface coated part 14 and are not formed in the one-surface coated part 17. The grooves 10 are formed so that each of the grooves extends from the porous protective film 28 to the active material layer 13.

摘要翻译： 在包括形成有活性物质层13和多孔保护膜28的双面涂布部14的电极板3中，作为集电体芯材12的端部的芯材露出部18， 未形成活性物质层13和多孔保护膜28，并且设置在双面涂布部14和芯材露出部18之间的单面涂布部17，其中活性物质层13和 形成多孔保护膜28，在双面涂布部14的两面形成有多个槽10，并且不形成在单面涂布部17中。槽10形成为使得每个槽 从多孔保护膜28延伸到活性物质层13。

公开(公告)号：US20090325045A1

公开(公告)日：2009-12-31

申请号：US12516969

申请日：2008-07-22

申请人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu

发明人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu

IPC分类号： H01M6/10 ,  H01M2/08 ,  H01M4/02 ,  B29C59/04

CPC分类号： H01M10/0587 ,  H01M4/0435 ,  H01M4/131 ,  H01M4/1391 ,  H01M10/0525 ,  Y10T29/49108 ,  Y10T29/49112 ,  Y10T156/1023

摘要： An electrode plate includes a both-surface coated part 14 in which an electrode active material layer 13 is provided on both surfaces of a current collector core material 12, a core material exposed part 18 in which the negative electrode active material layer 13 is not provided, and a one-surface coated part 17 in which the negative electrode active material layer 13 is provided on only one surface of the current collector core material 12. A plurality of grooves 10 are formed in both surfaces of the both-surface coated part 14 and the grooves 10 are not formed in the one-surface coated part 17.

摘要翻译： 电极板包括在集电体芯材12的两个表面上设置有电极活性物质层13的双面涂布部14，未设置负极活性物质层13的芯材露出部18 以及仅在集电体芯材12的一个表面上设置有负极活性物质层13的单面涂布部17。在两面涂布部14的两面形成有多个槽10 并且在单面涂布部17中不形成槽10。

公开(公告)号：US07842418B2

公开(公告)日：2010-11-30

申请号：US12516969

申请日：2008-07-22

申请人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu

发明人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu

IPC分类号： H01M4/02 ,  H01M4/00 ,  H01M6/10 ,  H01M4/82

CPC分类号： H01M10/0587 ,  H01M4/0435 ,  H01M4/131 ,  H01M4/1391 ,  H01M10/0525 ,  Y10T29/49108 ,  Y10T29/49112 ,  Y10T156/1023

摘要： An electrode plate includes a both-surface coated part 14 in which an electrode active material layer 13 is provided on both surfaces of a current collector core material 12, a core material exposed part 18 in which the negative electrode active material layer 13 is not provided, and a one-surface coated part 17 in which the negative electrode active material layer 13 is provided on only one surface of the current collector core material 12. A plurality of grooves 10 are formed in both surfaces of the both-surface coated part 14 and the grooves 10 are not formed in the one-surface coated part 17.

摘要翻译： 电极板包括在集电体芯材12的两个表面上设置有电极活性物质层13的双面涂布部14，未设置负极活性物质层13的芯材露出部18 以及仅在集电体芯材12的一个表面上设置有负极活性物质层13的单面涂布部17。在两面涂布部14的两面形成有多个槽10 并且在单面涂布部17中不形成槽10。

公开(公告)号：US07695864B2

公开(公告)日：2010-04-13

申请号：US12515482

申请日：2008-07-22

申请人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu ,  Seiichi Kato

发明人： Masaharu Miyahisa ,  Yoshiki Ohsawa ,  Hideyuki Kumakiri ,  Tsutomu Nishioka ,  Shusaku Goto ,  Takeshi Kasamatsu ,  Seiichi Kato

IPC分类号： H01M4/02 ,  H01M4/04

CPC分类号： H01M4/02 ,  H01M2/1653 ,  H01M4/04 ,  H01M4/131 ,  H01M4/525 ,  H01M4/62 ,  H01M4/70 ,  H01M4/75 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/058

摘要： In an electrode plate 3 including a both-surface coated part 14 in which an active material layer 13 and a porous protective film 28 are formed, a core material exposed part 18 which is an end part of the current collector core material 12 and in which the active material layer 13 and the porous protective film 28 are not formed, and a one-surface coated part 17 which is provided between the both-surface coated part 14 and the core material exposed part 18 and in which the active material layer 13 and the porous protective film 28 are formed, a plurality of grooves 10 are formed in both surfaces of the both-surface coated part 14 and are not formed in the one-surface coated part 17. The grooves 10 are formed so that each of the grooves extends from the porous protective film 28 to the active material layer 13.

摘要翻译： 在包括形成有活性物质层13和多孔保护膜28的双面涂布部14的电极板3中，作为集电体芯材12的端部的芯材露出部18， 未形成活性物质层13和多孔保护膜28，并且设置在双面涂布部14和芯材露出部18之间的单面涂布部17，其中活性物质层13和 形成多孔保护膜28，在双面涂布部14的两面形成有多个槽10，并且不形成在单面涂布部17中。槽10形成为使得每个槽 从多孔保护膜28延伸到活性物质层13。

公开(公告)号：US5294835A

公开(公告)日：1994-03-15

申请号：US920657

申请日：1992-07-28

申请人： Kazumasa Igarashi ,  Hideto Kimura ,  Megumu Nagasawa ,  Tsutomu Nishioka ,  Kazuhiro Ikemura ,  Hideyuki Usui ,  Michio Komoto ,  Haruo Tabata ,  Satoshi Ito

发明人： Kazumasa Igarashi ,  Hideto Kimura ,  Megumu Nagasawa ,  Tsutomu Nishioka ,  Kazuhiro Ikemura ,  Hideyuki Usui ,  Michio Komoto ,  Haruo Tabata ,  Satoshi Ito

IPC分类号： H01L23/29 ,  H01L23/28

CPC分类号： H01L23/296 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465

摘要： A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.

摘要翻译： 一种半导体器件，其中将半导体芯片封装在环氧树脂组合物中，其包含（A）由式（I）表示的环氧树脂：（*化学结构*）（I）其中R1，R2，R3和R4各自表示 具有1至4个碳原子的烷基，和（B）通过使由式（II）表示的硅烷化合物预先反应获得的反应产物：（*化学结构*）（II）其中X表示至少具有一个 一个选自缩水甘油基，氨基和巯基的官能团; Y表示具有1至4个碳原子的烷氧基; 和n表示0,1或2，与式（III）表示的酚芳烷基树脂（*化学结构*）（III）表示，其中m表示0或正整数。 环氧树脂组合物具有低吸湿性和低应力，以提供耐热裂纹性和耐湿性优异的半导体器件。

公开(公告)号：US06410615B1

公开(公告)日：2002-06-25

申请号：US09485389

申请日：2000-02-09

申请人： Takashi Taniguchi ,  Minoru Yamane ,  Tsutomu Nishioka ,  Tadaaki Harada ,  Toshitsugu Hosokawa ,  Kazuhiro Ikemura ,  Sadahito Misumi ,  Shinichi Ohizumi

发明人： Takashi Taniguchi ,  Minoru Yamane ,  Tsutomu Nishioka ,  Tadaaki Harada ,  Toshitsugu Hosokawa ,  Kazuhiro Ikemura ,  Sadahito Misumi ,  Shinichi Ohizumi

IPC分类号： C08L6300

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10S524/904 ,  Y10S525/934 ,  C08L61/04 ,  C08L2666/22 ,  H01L2924/00014 ,  H01L2924/00

摘要： An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，包括环氧树脂，酚醛树脂，硬化促进剂和无机填料。 具有以下特性（X）至（Z）的环氧树脂组合物不会由于树脂封装中的树脂流动（例如半导体元件偏移或金线变形）而引起芯片倾斜，并且可以获得高度可靠的半导体器件：（X） 用流动测试仪在175℃下测得的粘度为50-500P;（Y）其最小熔体粘度由粘度的温度依赖性确定，其用动态粘弹性仪器在剪切速率 5（1 / s）为1×10 5泊或更低; 和（Z）在90℃（Z1）下测量的粘度与在110℃下测量的粘度（Z2）的比例，用剪切速率为5（1 / s）的动态粘弹性仪， （Z1 / Z2）为2.0以上。