Projection device
    8.
    发明授权
    Projection device 失效
    投影设备

    公开(公告)号:US4368975A

    公开(公告)日:1983-01-18

    申请号:US240835

    申请日:1981-03-05

    CPC分类号: G02B13/24 G02B13/22 G02B3/00

    摘要: This specification discloses a projection device in which a plurality of element lens systems for projecting a part area of an object onto a predetermined part area on the image plane at erect one-to-one magnification are arranged parallel to one another in a plane perpendicular to the optical axis. Each element lens system is a telecentric system comprising three thin lenses of the same shape arranged in the direction of the optical axis, and an intermediate lens is provided at a position deviated from the intermediate point between the object side lens and the image plane side lens. A light absorbing member for extinguishing any light rays exceeding the effective lens diameter is provided between the lenses, and the light intensity distribution on the image plane of each element lens system is controlled substantially to Gauss distribution form by aperture eclipse and, even if there is any error in the arrangement interval, the exposure amount distribution in the arrangement direction superposed on the image plane is uniform.

    摘要翻译: 本说明书公开了一种投影装置,其中用于将物体的一部分区域以直立的一对一放大率在像面上的预定部分区域投影的多个元件透镜系统在垂直于...的平面中彼此平行地布置 光轴。 每个元件透镜系统是一种远心系统,包括沿光轴方向布置的相同形状的三个薄透镜,并且在偏离物侧透镜和像平面侧透镜之间的中间点的位置处设置中间透镜 。 在透镜之间设置用于熄灭超过有效透镜直径的光线的光吸收部件,并且每个元件透镜系统的像面上的光强度分布基本上由孔眼日蚀控制为高斯分布形式,并且即使存在 布置间隔中的任何误差,叠加在图像平面上的排列方向上的曝光量分布是均匀的。

    Method for manufacturing semiconductor laser device
    9.
    发明申请
    Method for manufacturing semiconductor laser device 失效
    制造半导体激光器件的方法

    公开(公告)号:US20060094141A1

    公开(公告)日:2006-05-04

    申请号:US11262548

    申请日:2005-10-28

    IPC分类号: H01L21/00

    摘要: A method for manufacturing a semiconductor laser device is provided in which deformation of a cap layer and a third cladding layer is inhibited and a protruding portion of an intermediate layer is removed. By coating outer peripheral portions facing an intermediate layer of a third cladding layer and an etching stop layer with a resist, inevitably removing at least the third cladding layer, and etching the intermediate layer and a cap layer in a second etching step, a protruding portion of the intermediate layer is removed, and the cap layer is prevented from being etched undesirably, whereby a ridge portion without irregularities with respect to a direction substantially perpendicular to a lamination direction is produced, and increase of an operation voltage and decrease of external differential quantum efficiency are prevented.

    摘要翻译: 提供了一种制造半导体激光器件的方法,其中抑制了盖层和第三覆层的变形,并且去除了中间层的突出部分。 通过涂覆面对第三包覆层的中间层的外周部分和具有抗蚀剂的蚀刻停止层,不可避免地至少去除第三包层,并且在第二蚀刻步骤中蚀刻中间层和覆盖层,突出部分 除去中间层,并且防止盖层被不期望地蚀刻,由此产生相对于基本上垂直于层叠方向的方向没有凹凸的脊部,并且增加操作电压并减小外部微分量子 防止效率。

    Semiconductor laser device capable of preventing a threshold current and an operating current from increasing and manufacturing method therefor
    10.
    发明申请
    Semiconductor laser device capable of preventing a threshold current and an operating current from increasing and manufacturing method therefor 失效
    能够防止阈值电流和工作电流的半导体激光装置的增加和制造方法

    公开(公告)号:US20050100067A1

    公开(公告)日:2005-05-12

    申请号:US10602827

    申请日:2003-06-25

    申请人: Atsuo Tsunoda

    发明人: Atsuo Tsunoda

    摘要: A ridge section constructed of a p-type second AlGaInP clad layer 8, a p-type GaInP interlayer 9 and a p-type GaAs cap layer 10 is formed on an etching stop layer 7. A step of not smaller than 0.13 μm is formed between the p-type interlayer 9 and the p-type second clad layer 8 by making the p-type interlayer 9 protrude in both widthwise directions beyond the p-type second clad layer 8. With this step, AlInP layers can be formed separately from each other on both sides of the ridge section and on the ridge section. Therefore, when the AlInP layer on the ridge section is removed by etching, an AlInP current constriction layer 13 located on both sides of the ridge section is reliably protected by a resist film and not over-etched. The AlInP current constriction layer 13 effectively puts a current constriction function into effect, so that a semiconductor laser device of low-threshold current and low-power consumption is obtained.

    摘要翻译: 在蚀刻停止层7上形成由p型第二AlGaInP包覆层8,p型GaInP夹层9和p型GaAs覆盖层10构成的脊部。 通过使p型中间层9在宽度方向上突出超过p型第二覆盖层8,在p型中间层9和p型第二覆盖层8之间形成不小于0.13μm的台阶。 通过该步骤,AlInP层可以在脊部两侧和脊部两侧彼此分开形成。 因此,当通过蚀刻去除脊部上的AlInP层时,位于脊部两侧的AlInP电流收缩层13可靠地被抗蚀剂膜保护而不被过度蚀刻。 AlInP电流收缩层13有效地使电流收缩功能起作用,从而获得低阈值电流和低功耗的半导体激光器件。