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1.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08501870B2
公开(公告)日：2013-08-06
申请号：US13615167
申请日：2012-09-13
IPC分类号： C08F8/00
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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2.发明申请Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board 审中-公开导电箔与粘合层，导体包层层压板，印刷线路板和多层接线板公开(公告)号：US20090323300A1
公开(公告)日：2009-12-31
申请号：US12298337
申请日：2007-04-24
CPC分类号： H05K3/386 , B32B5/022 , B32B5/024 , B32B7/12 , B32B15/08 , B32B15/12 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/10 , B32B27/12 , B32B27/281 , B32B27/285 , B32B27/306 , B32B27/32 , B32B27/38 , B32B27/42 , B32B2255/06 , B32B2255/26 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/714 , B32B2307/718 , B32B2457/08 , C09J163/00 , H05K3/427 , H05K3/4602 , H05K2201/0355 , Y10T428/24355 , Y10T428/254 , Y10T428/265 , Y10T428/2852 , Y10T428/31721 , Y10T442/2459
摘要： The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C).
摘要翻译： 本发明提供一种附着粘合剂层的导电箔和导体包覆层叠片，特别是在耐高温性优异的高频带中，能够令人满意地降低传输损失，并且能够适当地制造印刷电路板 耐层间剥离。 本发明的带粘合剂层的导电箔具有形成在导电箔上的导电箔和粘合层，其中粘合层由含有组分（A）的固化性树脂组合物组成：多官能环氧树脂，组分（ B）：多官能酚树脂和（C）成分：聚酰胺酰亚胺。 本发明的导体包覆层压片包括绝缘层，面向绝缘层的导电层和夹在绝缘层和导电层之间的粘合层，并且粘合层由含有组分的固化树脂组合物 A），（B）和（C）。
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3.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08568891B2
公开(公告)日：2013-10-29
申请号：US13463541
申请日：2012-05-03
IPC分类号： B32B15/08
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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4.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08277948B2
公开(公告)日：2012-10-02
申请号：US12279571
申请日：2007-02-14
IPC分类号： B32B15/08
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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5.发明申请Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包层压板公开(公告)号：US20100233495A1
公开(公告)日：2010-09-16
申请号：US12279571
申请日：2007-02-14
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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6.发明授权Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate 有权制备含有半IPN复合热固性树脂的树脂清漆的方法，并且使用该树脂清漆的方法，用于印刷线路板，预浸料和覆金属层压板的树脂清漆公开(公告)号：US08404769B2
公开(公告)日：2013-03-26
申请号：US12596165
申请日：2008-04-25
CPC分类号： H05K1/0353 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2274/00 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J3/246 , C08J5/24 , C08J2387/00 , C08K3/013 , C08L9/00 , C08L15/00 , C08L21/00 , C08L47/00 , C08L71/00 , C08L71/12 , H05K1/024 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , Y10T428/31696 , C08L2666/14
摘要： Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
摘要翻译： 本发明提供了含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的制造方法，其中，该方法包括以下步骤：（i）预反应（B ）丁二烯聚合物，其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未进行化学改性，（C）交联剂， 在（A）聚苯醚存在下，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将所得混合物和聚苯醚改性的丁二烯预聚物混合在一起; 以及使用该树脂清漆，预浸料坯和覆金属层压板。
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7.发明申请PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE 有权生产含有SEMI-IPN复合热固性树脂的树脂的方法，并提供使用该树脂的方法，用于印刷的导线板，PREPREG和金属层压板的树脂变化公开(公告)号：US20100129676A1
公开(公告)日：2010-05-27
申请号：US12596165
申请日：2008-04-25
CPC分类号： H05K1/0353 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2274/00 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J3/246 , C08J5/24 , C08J2387/00 , C08K3/013 , C08L9/00 , C08L15/00 , C08L21/00 , C08L47/00 , C08L71/00 , C08L71/12 , H05K1/024 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , Y10T428/31696 , C08L2666/14
摘要： Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
摘要翻译： 本发明提供一种热固性树脂清漆的制造方法，由此能够制造印刷电路板，其中印刷电路板在高频带中具有优异的介电性能并且可以显着降低传输损耗，并且在吸湿后表现出优异的耐热性， 优异的热膨胀性能，并且满足金属箔剥离强度。 一种制备含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的方法，其中该方法包括以下步骤：（i）预先反应（B） 在其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未经化学改性且（C）交联剂的丁二烯聚合物，在 存在（A）聚苯醚，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将得到的混合物和聚苯醚改性的丁二烯预聚物，树脂清漆，预浸渍体和使用其的覆金属层压板混合在一起。
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8.发明申请PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE 审中-公开用于生产含有SEMI-IPN复合材料的树脂组合物，热固性树脂的方法和使用该树脂的方法，用于印刷的导线板，PREPREG和金属层压板的树脂变化公开(公告)号：US20130040153A1
公开(公告)日：2013-02-14
申请号：US13588881
申请日：2012-08-17
IPC分类号： C09D109/00 , B32B15/08 , H05K3/00
CPC分类号： H05K1/0353 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2274/00 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J3/246 , C08J5/24 , C08J2387/00 , C08K3/013 , C08L9/00 , C08L15/00 , C08L21/00 , C08L47/00 , C08L71/00 , C08L71/12 , H05K1/024 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , Y10T428/31696 , C08L2666/14
摘要： A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish.
摘要翻译： 一种热固性树脂清漆，其包含彼此相容的未固化的半IPN复合材料的热固性树脂组合物（A）聚苯醚，（B）在其分子中含有40％以上的1,2- - 丁二烯单元在其侧链中具有1,2-乙烯基，并且不经化学改性，和（C）交联剂; （D）无机填料; 和（E）饱和热塑性弹性体。 另外，使用该热固性树脂清漆的印刷电路板用树脂清漆，预浸料坯和覆金属层压板。
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9.发明申请PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF 审中-公开用于电镀工艺的层压板，用于接线板的层压板及其制造方法，多层布线板及其制造方法公开(公告)号：US20120305291A1
公开(公告)日：2012-12-06
申请号：US13484514
申请日：2012-05-31
申请人： Daisuke FUJIMOTO , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
发明人： Daisuke FUJIMOTO , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
CPC分类号： C08K3/36 , C08G69/265 , C08G81/028 , C09D5/002 , C09D163/00 , C23C18/1603 , C23C18/1653 , C23C18/1689 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D1/04 , C25D5/50 , H05K3/387 , Y10T428/31511 , C08L77/06 , C08L87/005
摘要： Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).
摘要翻译： 公开了一种对化学镀铜表现出高粘合性且能够应对半导体封装的高密度布线的电镀工艺的底漆层; 用于具有底漆层的布线板的层压板及其制造方法; 以及具有底涂层的多层布线板及其制造方法。 底漆层由包含（A）多官能环氧树脂，（B）环氧树脂固化剂和（C）具有特定结构单元的含酚羟基的聚丁二烯改性聚酰胺树脂的树脂组合物形成，其中共混 相对于成分（A）和成分（B）的总和100质量份，成分（C）的比例为5质量份以上且小于25质量份。
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10.发明申请PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME 审中-公开用于电镀工艺的电镀层，用于电路板的层压板及其生产方法，以及多层电路板及其制造方法公开(公告)号：US20140151091A1
公开(公告)日：2014-06-05
申请号：US14123140
申请日：2012-05-29
申请人： Daisuke Fujimoto , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
发明人： Daisuke Fujimoto , Kunpei Yamada , Nobuyuki Ogawa , Hikari Murai
CPC分类号： H05K1/0366 , C08L63/00 , C09D5/002 , C23C18/1653 , C23C18/1844 , C25D5/34 , C25D7/0614 , H05K1/0298 , H05K1/0373 , H05K3/007 , H05K3/4676 , H05K2201/0209 , Y10T156/1043 , Y10T428/249921
摘要： Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. Specifically disclosed are a primer layer for plating process formed of a resin composition for primer layer including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B); a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.
摘要翻译： 公开了一种对化学镀铜表现出高粘合性且能够应对半导体封装的高密度布线的电镀工艺的底漆层; 用于具有底漆层的布线板的层压板及其制造方法; 以及具有底涂层的多层布线板及其制造方法。 具体公开了由（A）多官能环氧树脂，（B）环氧树脂固化剂和（C）含酚羟基的聚丁二烯改性的聚酰胺树脂（A）形成的用于底漆层的树脂组合物形成的电镀工艺的底漆层 具有规定的结构单元，其中，相对于成分（A）和成分（B）的总和100质量份，成分（C）的配合比例为5质量份以上且小于25质量份 ）; 用于具有底漆层的布线板的层压板及其制造方法; 以及具有底涂层的多层布线板及其制造方法。
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