公开(公告)号：US09647066B2

公开(公告)日：2017-05-09

申请号：US13454960

申请日：2012-04-24

Applicant: Chang-Shen Lu ,  Chih-Tang Peng ,  Tai-Chun Huang ,  Pei-Ren Jeng ,  Hao-Ming Lien ,  Yi-Hung Lin ,  Tze-Liang Lee ,  Syun-Ming Jang

Inventor： Chang-Shen Lu ,  Chih-Tang Peng ,  Tai-Chun Huang ,  Pei-Ren Jeng ,  Hao-Ming Lien ,  Yi-Hung Lin ,  Tze-Liang Lee ,  Syun-Ming Jang

IPC: H01L27/088 ,  H01L29/10 ,  H01L21/8234 ,  H01L29/66 ,  H01L29/78 ,  H01L21/20

CPC classification number: H01L29/10 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/6681 ,  H01L29/785

Abstract: A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET.

公开(公告)号：US20160252565A1

公开(公告)日：2016-09-01

申请号：US15055062

申请日：2016-02-26

Applicant: Sung-Li Wang ,  Lin-Jung WU ,  Shyh-Shin Ferng ,  Yi-Hung Lin ,  Sheng-Shin Lin ,  Semilab SDI LLC

Inventor： Dmitriy Marinskiy ,  Thye Chong Loy ,  Jacek Lagowski ,  Sung-Li Wang ,  Lin-Jung Wu ,  Shyh-Shin Ferng ,  Yi-Hung Lin ,  Sheng-Shin Lin

IPC: G01R31/26 ,  H01L21/66

Abstract: An example semiconductor wafer includes a semiconductor layer, a dielectric layer disposed on the semiconductor layer, and a layer of the metal disposed on the dielectric layer. An example method of determining an effective work function of a metal on the semiconductor wafer includes determining a surface barrier voltage of the semiconductor wafer, and determining a metal effective work function of the semiconductor wafer based, at least in part, on the surface barrier voltage.

Abstract translation: 示例性半导体晶片包括半导体层，设置在半导体层上的电介质层和设置在电介质层上的金属层。 确定半导体晶片上的金属的有效功函数的示例性方法包括确定半导体晶片的表面势垒电压，以及至少部分地基于表面势垒电压确定半导体晶片的金属有效功函数 。

公开(公告)号：US09398926B2

公开(公告)日：2016-07-26

申请号：US12436010

申请日：2009-05-05

Applicant: Yu-Shi Weng ,  Yi-Hung Lin ,  Ya-Jen Yu ,  Shan-Chang Chueh ,  I-Ching Wu ,  Chris I. Huang

Inventor： Yu-Shi Weng ,  Yi-Hung Lin ,  Ya-Jen Yu ,  Shan-Chang Chueh ,  I-Ching Wu ,  Chris I. Huang

IPC: A61F2/44 ,  A61B17/70

CPC classification number: A61B17/7062 ,  A61B17/7065 ,  A61F2/44 ,  A61F2/4405

Abstract: An interspinous stabilization device includes: (1) a supporting member with a top surface and a bottom surface both being configured to engage spinous processes; (2) two side members connected to the supporting member; (3) a fastener attached to the side members; and optionally (4) two extendable arms each secured on one of the side members.

Abstract translation: 椎间稳定装置包括：（1）具有顶表面和底表面的支撑构件，其被构造成接合棘突; （2）连接到支撑构件的两个侧构件; （3）附接到侧构件的紧固件; 和可选地（4）两个可伸缩臂，每个固定在一个侧构件上。

公开(公告)号：US08835267B2

公开(公告)日：2014-09-16

申请号：US13248319

申请日：2011-09-29

Applicant: Yen-Ru Lee ,  Ming-Hua Yu ,  Tze-Liang Lee ,  Chii-Horng Li ,  Pang-Yen Tsai ,  Lilly Su ,  Yi-Hung Lin ,  Yu-Hung Cheng

Inventor： Yen-Ru Lee ,  Ming-Hua Yu ,  Tze-Liang Lee ,  Chii-Horng Li ,  Pang-Yen Tsai ,  Lilly Su ,  Yi-Hung Lin ,  Yu-Hung Cheng

IPC: H01L21/336 ,  H01L21/8234 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/66

CPC classification number: H01L29/7848 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02661 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L21/3083 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823425 ,  H01L21/823481 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823878 ,  H01L29/045 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/7845 ,  H01L29/7846

Abstract: A method for fabricating a semiconductor device is disclosed. A strained material is formed in a cavity of a substrate and adjacent to an isolation structure in the substrate. The strained material has a corner above the surface of the substrate. The disclosed method provides an improved method for forming the strained material adjacent to the isolation structure with an increased portion in the cavity of a substrate to enhance carrier mobility and upgrade the device performance. In an embodiment, the improved formation method is achieved using an etching process to redistribute the strained material by removing at least a portion of the corner to be located in the cavity.

Abstract translation: 公开了一种制造半导体器件的方法。 应变材料形成在衬底的空腔中并与衬底中的隔离结构相邻。 应变材料在基底表面上方有一角。 所公开的方法提供了一种用于形成邻近隔离结构的应变材料的改进方法，其中衬底的腔中具有增加的部分，以增强载体移动性并提高器件性能。 在一个实施例中，改进的形成方法是通过使用蚀刻工艺来实现的，该蚀刻工艺通过去除位于空腔中的角部的至少一部分来重新分布应变材料。

公开(公告)号：US20140001509A1

公开(公告)日：2014-01-02

申请号：US13534186

申请日：2012-06-27

Applicant: Yi-Hung Lin ,  Cheng-Hong Chen ,  Shih-Chang Lee

Inventor： Yi-Hung Lin ,  Cheng-Hong Chen ,  Shih-Chang Lee

IPC: H01L31/0224 ,  H01L31/18 ,  H01L33/40

CPC classification number: H01L33/40 ,  H01L31/02168 ,  H01L31/022425 ,  Y02E10/50

Abstract: An optoelectronic semiconductor device includes: an optoelectronic semiconductor stack including an upper surface; and a metal electrode structure formed on the optoelectronic semiconductor stack, wherein the metal electrode structure comprises a side surface including oxidized metal formed by oxidizing the metal electrode structure.

Abstract translation: 光电子半导体器件包括：包括上表面的光电子半导体堆叠; 以及形成在所述光电子半导体堆叠上的金属电极结构，其中所述金属电极结构包括通过氧化所述金属电极结构形成的包括氧化金属的侧表面。

公开(公告)号：US08614190B2

公开(公告)日：2013-12-24

申请号：US13172776

申请日：2011-06-29

Applicant: Shen-Hua Peng ,  Hsin-Hsin Shen ,  Liang-Yo Yang ,  Meng-Yow Hsieh ,  Pei-Shan Li ,  Wei-Lin Yu ,  Tsai-Yu Lin ,  Po-Liang Lai ,  Jui-Sheng Sun ,  Chih-Hung Chang ,  Yi-Hung Lin

Inventor： Shen-Hua Peng ,  Hsin-Hsin Shen ,  Liang-Yo Yang ,  Meng-Yow Hsieh ,  Pei-Shan Li ,  Wei-Lin Yu ,  Tsai-Yu Lin ,  Po-Liang Lai ,  Jui-Sheng Sun ,  Chih-Hung Chang ,  Yi-Hung Lin

IPC: A61P19/08 ,  A61K38/18 ,  A61K31/74 ,  C07K14/51 ,  C07K14/475

CPC classification number: A61L27/50 ,  A61L27/18 ,  A61L27/54 ,  A61L27/58 ,  A61L2300/414 ,  A61L2430/02

Abstract: Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): A-B-BOX-B-A  Formula (I) B-A-B-(BOX-B-A-B)n-BOX-B-A-B  Formula (II) wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2, 2′-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.

Abstract translation: 提供了用于治疗骨疾病的热应答组合物。 用于治疗骨疾病的热应答组合物包括骨生长因子和可生物降解的共聚物。 生物降解性共聚物具有式（I）或式（II）的结构：AB-BOX-B-AFormula（I）BAB-（BOX-BAB）n-BOX-BA-BFormula（II）其中，A包括亲水 聚乙二醇聚合物，B包括疏水性聚酯聚合物，BOX是2,2'-双（2-恶唑啉）的双官能团单体，用于偶联嵌段AB或BAB，并且n是整数并且相同或多于 0。

公开(公告)号：US20130252189A1

公开(公告)日：2013-09-26

申请号：US13428749

申请日：2012-03-23

Applicant: Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

Inventor： Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

IPC: F27D1/00 ,  F27D5/00

CPC classification number: H05B1/0233 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/306 ,  H01L21/477 ,  H01L21/67115 ,  H01L21/67303 ,  H01L21/683 ,  H01L21/68735 ,  H01L21/68757

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.

Abstract translation: 公开了一种装置，系统和方法。 示例性装置包括被配置为保持覆盖晶片的第一部分。 第一部分包括中心区域和围绕中心区域的边缘区域。 第一部分还包括上表面和下表面。 该装置还包括延伸超过晶片的外半径的第二部分。 第二部分包括上表面和下表面。 中心区域的第一部分的下表面具有第一反射特性。 边缘区域中的第一部分的下表面和第二部分具有第二反射特性。

公开(公告)号：US20120280384A1

公开(公告)日：2012-11-08

申请号：US13167086

申请日：2011-06-23

Applicant: Yi-Hung Lin ,  Meng-Tsung Lee ,  Sui-An Kao ,  Yi-Hsin Chen ,  Feng-Lung Chien

Inventor： Yi-Hung Lin ,  Meng-Tsung Lee ,  Sui-An Kao ,  Yi-Hsin Chen ,  Feng-Lung Chien

IPC: H01L23/48 ,  H01L21/283

CPC classification number: H01L24/11 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/03903 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/0556 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2224/0347 ,  H01L2224/1161 ,  H01L2224/05552

Abstract: A fabrication method of a semiconductor structure includes providing a chip having at least an electrode pad, forming a titanium layer on the electrode pad, forming a dielectric layer on the chip and a portion of the titanium layer, forming a copper layer on the dielectric layer and the titanium layer, forming a conductive pillar on the copper layer corresponding in position to the titanium layer, and removing a portion of the copper layer that is not covered by the conductive pillar. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability.

Abstract translation: 半导体结构的制造方法包括提供至少具有电极焊盘的芯片，在电极焊盘上形成钛层，在芯片上形成电介质层和钛层的一部分，在电介质层上形成铜层 和钛层，在与铜层相对应的铜层上形成导电柱，并除去未被导电柱覆盖的铜层的一部分。 当通过蚀刻去除铜层的部分时，由于钛层被电介质层覆盖，所以避免了钛层的底切，从而为导电柱提供改进的支撑以提高产品的可靠性。

公开(公告)号：US20050011895A1

公开(公告)日：2005-01-20

申请号：US10620972

申请日：2003-07-14

Applicant: Yi-Hung Lin

Inventor： Yi-Hung Lin

IPC: A45D33/18 ,  B65D51/24 ,  B65D41/06 ,  A45D33/00

CPC classification number: A45D33/18 ,  B65D51/245

Abstract: A cosmetics container includes a main body, a top cover, and a colored plate. Thus, the reflective face of the top cover co-operates with the colored plate to produce a colorful optical reflective effect, and the refractive face of the top cover produces a refractive effect, thereby enhancing the aesthetic quality of the cosmetics container so that the cosmetics container has an outstanding appearance.

Abstract translation: 化妆品容器包括主体，顶盖和彩色板。 因此，顶盖的反射面与着色板配合，产生彩色光学反射效果，顶盖的折射面产生折射效果，从而提高化妆品容器的美学质量，使得化妆品 集装箱外观美观。

公开(公告)号：US06695139B2

公开(公告)日：2004-02-24

申请号：US10076548

申请日：2002-02-19

Applicant: Yi-Hung Lin

Inventor： Yi-Hung Lin

IPC: C07B30510

CPC classification number: A45D33/006

Abstract: A cosmetic powder case includes a case body having a lip wall. The lip wall has a position slot at interior side thereof and an order slot at exterior side thereof. The order slot has a locking slot thereon. A separate disk has an axial hole at central, channel portions around the axial hole, and a lock sidewall at the edge thereof which has position flange at exterior side thereof and a ring slot at interior side thereof. The ring slot has position blocks therein. A rotatable disk has an axial rod at bottom side thereof, channels located around the axial rod, and an L-shaped lock flange extended from the edge thereof. The lock flange has a ring rib at distal end of interior side thereof, and a puff has a band thereon for facilitating user to grip.

Abstract translation: 化妆品粉末盒包括具有唇壁的壳体。 唇壁在其内侧具有位置槽，在其外侧具有订制槽。 订单槽在其上具有锁定槽。 单独的盘在中心具有轴向孔，围绕轴向孔的通道部分和在其边缘处具有位于其外侧的位置凸缘的锁定侧壁以及在其内侧的环形槽。 环槽在其中具有位置块。 旋转盘在其底侧具有轴向杆，位于轴向杆周围的通道和从其边缘延伸的L形锁定凸缘。 锁定凸缘在其内侧的远端具有环形肋，并且在其上具有用于便于使用者抓握的带状物的带状物。